JPS60165734A - 半導体領域のマツピング方法 - Google Patents
半導体領域のマツピング方法Info
- Publication number
- JPS60165734A JPS60165734A JP59250663A JP25066384A JPS60165734A JP S60165734 A JPS60165734 A JP S60165734A JP 59250663 A JP59250663 A JP 59250663A JP 25066384 A JP25066384 A JP 25066384A JP S60165734 A JPS60165734 A JP S60165734A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- electron
- semiconductor
- charge
- semiconductor structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 43
- 238000000034 method Methods 0.000 title claims description 26
- 238000013507 mapping Methods 0.000 title claims description 5
- 238000010894 electron beam technology Methods 0.000 claims description 16
- 230000002950 deficient Effects 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 description 39
- 230000015654 memory Effects 0.000 description 17
- 230000007547 defect Effects 0.000 description 11
- 238000001465 metallisation Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001493 electron microscopy Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/305—Contactless testing using electron beams
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/575,353 US4575630A (en) | 1984-01-30 | 1984-01-30 | Electron-beam testing of semiconductor wafers |
| US575353 | 2000-05-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60165734A true JPS60165734A (ja) | 1985-08-28 |
| JPH0248139B2 JPH0248139B2 (enExample) | 1990-10-24 |
Family
ID=24299974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59250663A Granted JPS60165734A (ja) | 1984-01-30 | 1984-11-29 | 半導体領域のマツピング方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4575630A (enExample) |
| EP (1) | EP0151720B1 (enExample) |
| JP (1) | JPS60165734A (enExample) |
| DE (1) | DE3464804D1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4665313A (en) * | 1985-06-28 | 1987-05-12 | International Business Machines Corporation | Apparatus and method for displaying hole-electron pair distributions induced by electron bombardment |
| US4721910A (en) * | 1986-09-12 | 1988-01-26 | American Telephone And Telegraph Company, At&T Bell Laboratories | High speed circuit measurements using photoemission sampling |
| US5460034A (en) * | 1992-07-21 | 1995-10-24 | The United States Of America As Represented By The Secretary Of The Air Force | Method for measuring and analyzing surface roughness on semiconductor laser etched facets |
| JPH09184715A (ja) * | 1995-12-28 | 1997-07-15 | Hitachi Ltd | パターン形状検査装置 |
| KR100544222B1 (ko) * | 1997-01-13 | 2006-04-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼의 결함을 검출하는 방법 및 장치 |
| US6504393B1 (en) | 1997-07-15 | 2003-01-07 | Applied Materials, Inc. | Methods and apparatus for testing semiconductor and integrated circuit structures |
| US6252412B1 (en) | 1999-01-08 | 2001-06-26 | Schlumberger Technologies, Inc. | Method of detecting defects in patterned substrates |
| US6232787B1 (en) * | 1999-01-08 | 2001-05-15 | Schlumberger Technologies, Inc. | Microstructure defect detection |
| JP4312910B2 (ja) * | 1999-12-02 | 2009-08-12 | 株式会社日立製作所 | レビューsem |
| US6359451B1 (en) | 2000-02-11 | 2002-03-19 | Image Graphics Incorporated | System for contactless testing of printed circuit boards |
| WO2001058558A2 (en) | 2000-02-14 | 2001-08-16 | Eco 3 Max Inc. | Process for removing volatile organic compounds from an air stream and apparatus therefor |
| JP4034500B2 (ja) * | 2000-06-19 | 2008-01-16 | 株式会社日立製作所 | 半導体装置の検査方法及び検査装置、及びそれを用いた半導体装置の製造方法 |
| US7528614B2 (en) * | 2004-12-22 | 2009-05-05 | Applied Materials, Inc. | Apparatus and method for voltage contrast analysis of a wafer using a tilted pre-charging beam |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3772520A (en) * | 1972-03-21 | 1973-11-13 | Us Air Force | Method for the investigation of thin films on a semiconductor substrate in a scanning electron microscope |
| US3984683A (en) * | 1975-05-27 | 1976-10-05 | Rca Corporation | Apparatus and method for analyzing biological cells for malignancy |
| US4056716A (en) * | 1976-06-30 | 1977-11-01 | International Business Machines Corporation | Defect inspection of objects such as electronic circuits |
| US4238686A (en) * | 1979-09-05 | 1980-12-09 | Bell Telephone Laboratories, Incorporated | Method of analyzing localized nonuniformities in luminescing materials |
| US4417203A (en) | 1981-05-26 | 1983-11-22 | International Business Machines Corporation | System for contactless electrical property testing of multi-layer ceramics |
-
1984
- 1984-01-30 US US06/575,353 patent/US4575630A/en not_active Expired - Fee Related
- 1984-11-29 JP JP59250663A patent/JPS60165734A/ja active Granted
- 1984-12-04 EP EP84114671A patent/EP0151720B1/en not_active Expired
- 1984-12-04 DE DE8484114671T patent/DE3464804D1/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| EP0151720A1 (en) | 1985-08-21 |
| DE3464804D1 (en) | 1987-08-20 |
| JPH0248139B2 (enExample) | 1990-10-24 |
| EP0151720B1 (en) | 1987-07-15 |
| US4575630A (en) | 1986-03-11 |
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