JPS60148148A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60148148A
JPS60148148A JP59004327A JP432784A JPS60148148A JP S60148148 A JPS60148148 A JP S60148148A JP 59004327 A JP59004327 A JP 59004327A JP 432784 A JP432784 A JP 432784A JP S60148148 A JPS60148148 A JP S60148148A
Authority
JP
Japan
Prior art keywords
metal
pads
semiconductor element
metal layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59004327A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0160941B2 (cg-RX-API-DMAC10.html
Inventor
Takashi Miyamoto
隆 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP59004327A priority Critical patent/JPS60148148A/ja
Publication of JPS60148148A publication Critical patent/JPS60148148A/ja
Publication of JPH0160941B2 publication Critical patent/JPH0160941B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W70/682—
    • H10W72/5449—
    • H10W72/5524—
    • H10W90/754—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP59004327A 1984-01-13 1984-01-13 半導体装置 Granted JPS60148148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59004327A JPS60148148A (ja) 1984-01-13 1984-01-13 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59004327A JPS60148148A (ja) 1984-01-13 1984-01-13 半導体装置

Publications (2)

Publication Number Publication Date
JPS60148148A true JPS60148148A (ja) 1985-08-05
JPH0160941B2 JPH0160941B2 (cg-RX-API-DMAC10.html) 1989-12-26

Family

ID=11581352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59004327A Granted JPS60148148A (ja) 1984-01-13 1984-01-13 半導体装置

Country Status (1)

Country Link
JP (1) JPS60148148A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01111342A (ja) * 1987-10-26 1989-04-28 Nec Corp 集積回路用パッケージ
JPH06140529A (ja) * 1992-10-29 1994-05-20 Kyocera Corp 電子部品収納用パッケージ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55165662A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Semiconductor device
JPS56129348A (en) * 1980-03-14 1981-10-09 Nec Corp Semiconductor device
JPS57107059A (en) * 1980-12-25 1982-07-03 Fujitsu Ltd Semiconductor package
JPS5821848A (ja) * 1981-07-31 1983-02-08 Nec Corp 集積回路装置用容器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55165662A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Semiconductor device
JPS56129348A (en) * 1980-03-14 1981-10-09 Nec Corp Semiconductor device
JPS57107059A (en) * 1980-12-25 1982-07-03 Fujitsu Ltd Semiconductor package
JPS5821848A (ja) * 1981-07-31 1983-02-08 Nec Corp 集積回路装置用容器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01111342A (ja) * 1987-10-26 1989-04-28 Nec Corp 集積回路用パッケージ
JPH06140529A (ja) * 1992-10-29 1994-05-20 Kyocera Corp 電子部品収納用パッケージ

Also Published As

Publication number Publication date
JPH0160941B2 (cg-RX-API-DMAC10.html) 1989-12-26

Similar Documents

Publication Publication Date Title
US4021838A (en) Semiconductor integrated circuit devices
US5384488A (en) Configuration and method for positioning semiconductor device bond pads using additional process layers
KR100241476B1 (ko) 집적 회로용 절연 리드 프레임 및 그의 제조 방법
JPH0362934A (ja) 集積回路パツケージ
US7489023B2 (en) Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device
US6828687B2 (en) Cavity down ball grid array package structure and carrier thereof
JP7532747B2 (ja) 発光装置
JPS61287254A (ja) 半導体装置
CN112885808B (zh) 封装基板以及封装结构
JPS60148148A (ja) 半導体装置
US20030080418A1 (en) Semiconductor device having power supply pads arranged between signal pads and substrate edge
US20150364439A1 (en) Semiconductor device having power distribution using bond wires
JPS6070742A (ja) マスタ・スライス型半導体装置
JPS5910240A (ja) 半導体装置
JP2002270643A (ja) 半導体チップ及び半導体装置
US8089164B2 (en) Substrate having optional circuits and structure of flip chip bonding
US20060220219A1 (en) Substrate for IC package
JP2924853B2 (ja) 半導体装置用パッケージ及び半導体装置
JPS62123744A (ja) 半導体装置
JPS6322615B2 (cg-RX-API-DMAC10.html)
JP2026013691A (ja) 半導体装置及び半導体装置の製造方法
JP3346334B2 (ja) 半導体集積回路の製造方法
JP2000077559A (ja) 半導体装置
JPH06334065A (ja) 半導体搭載用多層基板
JPS60136346A (ja) 半導体装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term