JPS60147729A - ホトレジスト組成物 - Google Patents

ホトレジスト組成物

Info

Publication number
JPS60147729A
JPS60147729A JP59002614A JP261484A JPS60147729A JP S60147729 A JPS60147729 A JP S60147729A JP 59002614 A JP59002614 A JP 59002614A JP 261484 A JP261484 A JP 261484A JP S60147729 A JPS60147729 A JP S60147729A
Authority
JP
Japan
Prior art keywords
water
soluble
adhesion
photoresist
compd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59002614A
Other languages
English (en)
Japanese (ja)
Other versions
JPH058418B2 (index.php
Inventor
Norio Koike
小池　教雄
Hatsuo Tsukagoshi
塚越　初雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59002614A priority Critical patent/JPS60147729A/ja
Priority to DE19853500576 priority patent/DE3500576A1/de
Priority to US06/690,988 priority patent/US4596755A/en
Publication of JPS60147729A publication Critical patent/JPS60147729A/ja
Publication of JPH058418B2 publication Critical patent/JPH058418B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/008—Azides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP59002614A 1984-01-12 1984-01-12 ホトレジスト組成物 Granted JPS60147729A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP59002614A JPS60147729A (ja) 1984-01-12 1984-01-12 ホトレジスト組成物
DE19853500576 DE3500576A1 (de) 1984-01-12 1985-01-10 Photoresist-verbindung
US06/690,988 US4596755A (en) 1984-01-12 1985-01-14 Photoresist composition with azide having alkoxy silane as adhesion agent for glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59002614A JPS60147729A (ja) 1984-01-12 1984-01-12 ホトレジスト組成物

Publications (2)

Publication Number Publication Date
JPS60147729A true JPS60147729A (ja) 1985-08-03
JPH058418B2 JPH058418B2 (index.php) 1993-02-02

Family

ID=11534271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59002614A Granted JPS60147729A (ja) 1984-01-12 1984-01-12 ホトレジスト組成物

Country Status (3)

Country Link
US (1) US4596755A (index.php)
JP (1) JPS60147729A (index.php)
DE (1) DE3500576A1 (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110809737A (zh) * 2017-06-30 2020-02-18 住友电木株式会社 感光性树脂组合物、树脂膜和电子装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181234A (ja) * 1987-01-22 1988-07-26 Toshiba Corp カラ−受像管蛍光面の形成方法
JPH0693118B2 (ja) * 1987-06-15 1994-11-16 日本製紙株式会社 感光性シート
US5183723A (en) * 1988-10-21 1993-02-02 Hoechst Celanese Corporation Colored image on a degradable sheet material and method of formation
US5100757A (en) * 1988-10-21 1992-03-31 Hoechst Celanese Corporation Method for forming a colored image on a degradable sheet material
US6262216B1 (en) 1998-10-13 2001-07-17 Affymetrix, Inc. Functionalized silicon compounds and methods for their synthesis and use
US6565920B1 (en) * 2000-06-08 2003-05-20 Honeywell International Inc. Edge bead removal for spin-on materials containing low volatility solvents fusing carbon dioxide cleaning
KR20020077948A (ko) 2001-04-03 2002-10-18 삼성에스디아이 주식회사 칼라음극선관용 포토레지스트 제조용 단량체,칼라음극선관용 포토레지스트 중합체, 칼라음극선관용포토레지스트 조성물 및 칼라음극선관용 형광막 조성물
US20020146385A1 (en) * 2001-04-10 2002-10-10 Lin Tung Liang Ionic antimicrobial coating
JP4373260B2 (ja) * 2004-03-29 2009-11-25 一則 片岡 高分子複合体
US20080156346A1 (en) * 2006-12-28 2008-07-03 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for cleaning a substrate
KR102394824B1 (ko) * 2019-12-30 2022-05-06 주식회사 프로텍 연성 회로 기판 제조용 기판 처리 장치 및 기판 처리 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3549368A (en) * 1968-07-02 1970-12-22 Ibm Process for improving photoresist adhesion
US3586554A (en) * 1969-01-15 1971-06-22 Ibm Process for increasing photoresist adhesion to a semiconductor by treating the semiconductor with a disilylamide
US3702766A (en) * 1971-01-29 1972-11-14 Eastman Kodak Co Photoresist compositions containing n-halo cyclic imides
US3758306A (en) * 1971-03-25 1973-09-11 Du Pont Photopolymerizable compositions and elements containing organosilanes
JPS5119982B2 (index.php) * 1972-01-26 1976-06-22
JPS4968803A (index.php) * 1972-11-02 1974-07-03
JPS5547383B2 (index.php) * 1972-12-13 1980-11-29
JPS5525418B2 (index.php) * 1972-12-20 1980-07-05
US4099973A (en) * 1973-10-24 1978-07-11 Hitachi, Ltd. Photo-sensitive bis-azide containing composition
JPS5119982A (en) * 1974-08-12 1976-02-17 Nippon Electric Co Denkatensodebaisuno nyuryokukozo
US4491629A (en) * 1982-02-22 1985-01-01 Tokyo Shibaura Denki Kabushiki Kaisha Water soluble photoresist composition with bisazide, diazo, polymer and silane
JPS58143340A (ja) * 1982-02-22 1983-08-25 Toshiba Corp ホトレジスト組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110809737A (zh) * 2017-06-30 2020-02-18 住友电木株式会社 感光性树脂组合物、树脂膜和电子装置

Also Published As

Publication number Publication date
DE3500576C2 (index.php) 1989-02-09
US4596755A (en) 1986-06-24
JPH058418B2 (index.php) 1993-02-02
DE3500576A1 (de) 1985-07-25

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term