JPS6014457A - 半導体装置用セラミツクパツケ−ジ - Google Patents

半導体装置用セラミツクパツケ−ジ

Info

Publication number
JPS6014457A
JPS6014457A JP58122590A JP12259083A JPS6014457A JP S6014457 A JPS6014457 A JP S6014457A JP 58122590 A JP58122590 A JP 58122590A JP 12259083 A JP12259083 A JP 12259083A JP S6014457 A JPS6014457 A JP S6014457A
Authority
JP
Japan
Prior art keywords
layer
thin
internal
ceramic
internal electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58122590A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0221656B2 (enExample
Inventor
Toshiro Kuroda
俊郎 黒田
Toshio Nonomura
野々村　俊夫
Kuniharu Noda
野田　邦治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Narumi China Corp
Original Assignee
Narumi China Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Narumi China Corp filed Critical Narumi China Corp
Priority to JP58122590A priority Critical patent/JPS6014457A/ja
Publication of JPS6014457A publication Critical patent/JPS6014457A/ja
Publication of JPH0221656B2 publication Critical patent/JPH0221656B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • H10W70/635—
    • H10W70/682—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/884—
    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58122590A 1983-07-06 1983-07-06 半導体装置用セラミツクパツケ−ジ Granted JPS6014457A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58122590A JPS6014457A (ja) 1983-07-06 1983-07-06 半導体装置用セラミツクパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58122590A JPS6014457A (ja) 1983-07-06 1983-07-06 半導体装置用セラミツクパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6014457A true JPS6014457A (ja) 1985-01-25
JPH0221656B2 JPH0221656B2 (enExample) 1990-05-15

Family

ID=14839687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58122590A Granted JPS6014457A (ja) 1983-07-06 1983-07-06 半導体装置用セラミツクパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6014457A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0211348U (enExample) * 1988-07-04 1990-01-24
JP2016111246A (ja) * 2014-12-09 2016-06-20 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126951A (en) * 1980-03-12 1981-10-05 Hitachi Ltd Semicondutor device
JPS56137659A (en) * 1980-03-31 1981-10-27 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device and its manufacture

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126951A (en) * 1980-03-12 1981-10-05 Hitachi Ltd Semicondutor device
JPS56137659A (en) * 1980-03-31 1981-10-27 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device and its manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0211348U (enExample) * 1988-07-04 1990-01-24
JP2016111246A (ja) * 2014-12-09 2016-06-20 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ

Also Published As

Publication number Publication date
JPH0221656B2 (enExample) 1990-05-15

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