JPS60138090A - 部分銀めつき方法 - Google Patents

部分銀めつき方法

Info

Publication number
JPS60138090A
JPS60138090A JP24720783A JP24720783A JPS60138090A JP S60138090 A JPS60138090 A JP S60138090A JP 24720783 A JP24720783 A JP 24720783A JP 24720783 A JP24720783 A JP 24720783A JP S60138090 A JPS60138090 A JP S60138090A
Authority
JP
Japan
Prior art keywords
plating
silver
silver plating
matte
partial silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24720783A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0421000B2 (enrdf_load_stackoverflow
Inventor
Sotaro Toki
土岐　荘太郎
Fuminobu Noguchi
野口　文信
Tomoo Narishima
智夫 成島
Takeo Fujii
武夫 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP24720783A priority Critical patent/JPS60138090A/ja
Publication of JPS60138090A publication Critical patent/JPS60138090A/ja
Publication of JPH0421000B2 publication Critical patent/JPH0421000B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
JP24720783A 1983-12-26 1983-12-26 部分銀めつき方法 Granted JPS60138090A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24720783A JPS60138090A (ja) 1983-12-26 1983-12-26 部分銀めつき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24720783A JPS60138090A (ja) 1983-12-26 1983-12-26 部分銀めつき方法

Publications (2)

Publication Number Publication Date
JPS60138090A true JPS60138090A (ja) 1985-07-22
JPH0421000B2 JPH0421000B2 (enrdf_load_stackoverflow) 1992-04-07

Family

ID=17160035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24720783A Granted JPS60138090A (ja) 1983-12-26 1983-12-26 部分銀めつき方法

Country Status (1)

Country Link
JP (1) JPS60138090A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259341A (ja) * 1992-03-11 1993-10-08 Hitachi Cable Ltd リードフレーム用金属条及びその製造方法
JP2002094130A (ja) * 1999-01-05 2002-03-29 Nichia Chem Ind Ltd 発光ダイオード及びその製造方法、並びにそれを用いた表示装置
JP2002121698A (ja) * 2000-10-13 2002-04-26 Sony Corp 半導体製造装置および半導体装置の製造方法
US20080169566A1 (en) * 2003-08-08 2008-07-17 Richard Spitz Press-Fit Diode Having a Silver-Plated Wire Termination

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259341A (ja) * 1992-03-11 1993-10-08 Hitachi Cable Ltd リードフレーム用金属条及びその製造方法
JP2002094130A (ja) * 1999-01-05 2002-03-29 Nichia Chem Ind Ltd 発光ダイオード及びその製造方法、並びにそれを用いた表示装置
JP2002121698A (ja) * 2000-10-13 2002-04-26 Sony Corp 半導体製造装置および半導体装置の製造方法
US20080169566A1 (en) * 2003-08-08 2008-07-17 Richard Spitz Press-Fit Diode Having a Silver-Plated Wire Termination

Also Published As

Publication number Publication date
JPH0421000B2 (enrdf_load_stackoverflow) 1992-04-07

Similar Documents

Publication Publication Date Title
JP3739929B2 (ja) プリント配線板用銅箔及びその製造方法
US2814589A (en) Method of plating silicon
JPH08250865A (ja) 電子ハウジングの製作に利用するシート上での金属ウイスカの形成を防止することにより電子ハウジングの信頼性をより高くする方法
JPH0441696A (ja) 印刷回路用銅箔の表面処理方法
JPS59123789A (ja) 陽極酸化膜を有するアルミニウム被処理体をめつきのために処理する方法
US3699018A (en) Method of electrodepositing coral copper on copper foil
US4076599A (en) Method and composition for plating palladium
US3867265A (en) Process for electroplating an aluminum wire
JP3361914B2 (ja) 印刷回路用銅箔の製造方法
JPS60138090A (ja) 部分銀めつき方法
US2966448A (en) Methods of electroplating aluminum and alloys thereof
JPS585983B2 (ja) 無電解金属析出用に安定して金属錯化物を製造する方法及び装置
JPS6136596B2 (enrdf_load_stackoverflow)
JPH0350839B2 (enrdf_load_stackoverflow)
JP3450098B2 (ja) 金めっき用非水性浴
JPH0154438B2 (enrdf_load_stackoverflow)
JPH0423000B2 (enrdf_load_stackoverflow)
JPS6123790A (ja) ＮｉまたはＮｉ合金表面へのメツキ方法
US3075894A (en) Method of electroplating on aluminum surfaces
JPS63274795A (ja) 複合箔およびその製造方法
JPS59145793A (ja) 部分銀めつき方法
JPH07300696A (ja) 電着錫めっき方法
JPH0148354B2 (enrdf_load_stackoverflow)
US490841A (en) Georg wegner
CN114318433A (zh) 一种镀锡、除锡溶液配方及在零件表面镀锡的工艺