JPS60133644U - Lead frame for integrated circuits - Google Patents

Lead frame for integrated circuits

Info

Publication number
JPS60133644U
JPS60133644U JP1952984U JP1952984U JPS60133644U JP S60133644 U JPS60133644 U JP S60133644U JP 1952984 U JP1952984 U JP 1952984U JP 1952984 U JP1952984 U JP 1952984U JP S60133644 U JPS60133644 U JP S60133644U
Authority
JP
Japan
Prior art keywords
coining
lead frame
internal
integrated circuits
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1952984U
Other languages
Japanese (ja)
Other versions
JPS642445Y2 (en
Inventor
浩司 大下
Original Assignee
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Priority to JP1952984U priority Critical patent/JPS60133644U/en
Publication of JPS60133644U publication Critical patent/JPS60133644U/en
Application granted granted Critical
Publication of JPS642445Y2 publication Critical patent/JPS642445Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図は、本考案の一実施例を示す集積回路
用リードフレームの平面図及び要部半面図である。1 and 2 are a plan view and a half-view of a main part of a lead frame for an integrated circuit showing an embodiment of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チ゛ツブを載せ侘ツド部分と、当該チップと電気
的接続をとるボンディングワイヤーを固着する内部ノー
ドから溝高され、そのベッド部分の周辺と内部リード９
の先端に所定の距離に設定され、−この内部リード各先
蝉部分にコイニング部を゛設けた集積回路用リードフレ
ームにおいて、少なくとも１つの前記内部リードの俸端
部分のコイ子ング部の形状が、他の前記内部リードのコ
イニング部の形状と異なることを特徴とする集積回路用
　、The height of the groove is raised from the part where the semiconductor chip is placed and the internal node to which the bonding wire for electrical connection with the chip is fixed, and the periphery of the bed part and the internal lead 9.
In a lead frame for an integrated circuit, the coining portion is set at a predetermined distance from the tip of at least one of the internal leads, and the coining portion of each tip of the internal lead is provided with a coining portion. , for an integrated circuit, characterized in that the shape of the coining part of the other internal leads is different from that of the coining part;
JP1952984U 1984-02-13 1984-02-13 Lead frame for integrated circuits Granted JPS60133644U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1952984U JPS60133644U (en) 1984-02-13 1984-02-13 Lead frame for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1952984U JPS60133644U (en) 1984-02-13 1984-02-13 Lead frame for integrated circuits

Publications (2)

Publication Number Publication Date
JPS60133644U true JPS60133644U (en) 1985-09-06
JPS642445Y2 JPS642445Y2 (en) 1989-01-20

Family

ID=30509186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1952984U Granted JPS60133644U (en) 1984-02-13 1984-02-13 Lead frame for integrated circuits

Country Status (1)

Country Link
JP (1) JPS60133644U (en)

Also Published As

Publication number Publication date
JPS642445Y2 (en) 1989-01-20

Similar Documents

Publication Publication Date Title
JPS5827934U (en) semiconductor equipment
JPS60133644U (en) Lead frame for integrated circuits
JPS60141129U (en) Terminal structure of leadless chip carrier
JPS60181051U (en) Structure of lead frame
JPS6059541U (en) Lead frame for integrated circuits
JPS59143051U (en) integrated circuit device
JPS60125742U (en) Lead frame for hybrid integrated circuits
JPS63187330U (en)
JPS59145047U (en) semiconductor equipment
JPS5999447U (en) Package for semiconductors
JPS5825050U (en) Lead terminal arrangement structure of integrated circuit package
JPS63147831U (en)
JPS5881940U (en) Mounting structure of semiconductor elements
JPS59185790U (en) Soft package
JPS59171350U (en) Semiconductor element mounting structure
JPS606244U (en) Mold package type semiconductor device
JPS59121839U (en) Package cage for integrated circuits
JPS5869952U (en) Resin-encapsulated semiconductor device
JPS60169860U (en) hybrid integrated circuit
JPS59164250U (en) Lead frame for integrated circuits
JPS5918430U (en) Mounting structure of semiconductor chip with crossover wiring
JPS6035547U (en) lead frame
JPS60149166U (en) Hybrid integrated circuit device
JPS60133632U (en) Semiconductor element mounting structure
JPS6081664U (en) integrated circuit package