JPS6013090A - 銅めっき浴組成物及び使用方法 - Google Patents
銅めっき浴組成物及び使用方法Info
- Publication number
- JPS6013090A JPS6013090A JP59117435A JP11743584A JPS6013090A JP S6013090 A JPS6013090 A JP S6013090A JP 59117435 A JP59117435 A JP 59117435A JP 11743584 A JP11743584 A JP 11743584A JP S6013090 A JPS6013090 A JP S6013090A
- Authority
- JP
- Japan
- Prior art keywords
- brightener
- bath
- plating bath
- plating
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50121183A | 1983-06-10 | 1983-06-10 | |
| US501211 | 1995-07-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6013090A true JPS6013090A (ja) | 1985-01-23 |
| JPS6112036B2 JPS6112036B2 (enExample) | 1986-04-05 |
Family
ID=23992559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59117435A Granted JPS6013090A (ja) | 1983-06-10 | 1984-06-07 | 銅めっき浴組成物及び使用方法 |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS6013090A (enExample) |
| AU (1) | AU554236B2 (enExample) |
| BR (1) | BR8402811A (enExample) |
| CA (1) | CA1255621A (enExample) |
| DE (1) | DE3420999A1 (enExample) |
| ES (1) | ES8601336A1 (enExample) |
| FR (1) | FR2547318B1 (enExample) |
| GB (1) | GB2141140B (enExample) |
| IT (1) | IT1177785B (enExample) |
| NL (1) | NL8401841A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006009079A (ja) * | 2004-06-25 | 2006-01-12 | Hitachi Ltd | プリント配線板の製造方法 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4126502C1 (enExample) * | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
| JPH10330983A (ja) | 1997-05-30 | 1998-12-15 | Fukuda Metal Foil & Powder Co Ltd | 電解銅箔及びその製造方法 |
| DE19758121C2 (de) * | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
| RU2215829C1 (ru) * | 2002-02-21 | 2003-11-10 | Калининградский государственный университет | Электролит блестящего меднения |
| DE10261852B3 (de) * | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad |
| DE10337669B4 (de) * | 2003-08-08 | 2006-04-27 | Atotech Deutschland Gmbh | Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung |
| GB0520793D0 (en) * | 2005-10-13 | 2005-11-23 | Avecia Inkjet Ltd | Phthalocyanine inks and their use in ink-jet printing |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE520209A (enExample) * | 1952-05-26 | |||
| BE520210A (enExample) * | 1952-05-26 | |||
| US2738318A (en) * | 1954-12-28 | 1956-03-13 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
| US2882209A (en) * | 1957-05-20 | 1959-04-14 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
| NL291575A (enExample) * | 1962-04-16 | |||
| US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
| US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
| GB1526076A (en) * | 1975-03-11 | 1978-09-27 | Oxy Metal Industries Corp | Electrodeposition of copper |
| DE2746938C2 (de) * | 1977-10-17 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
| US4272335A (en) * | 1980-02-19 | 1981-06-09 | Oxy Metal Industries Corporation | Composition and method for electrodeposition of copper |
| US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
-
1984
- 1984-06-04 AU AU29033/84A patent/AU554236B2/en not_active Ceased
- 1984-06-06 DE DE19843420999 patent/DE3420999A1/de active Granted
- 1984-06-07 JP JP59117435A patent/JPS6013090A/ja active Granted
- 1984-06-07 CA CA000456108A patent/CA1255621A/en not_active Expired
- 1984-06-08 ES ES533252A patent/ES8601336A1/es not_active Expired
- 1984-06-08 NL NL8401841A patent/NL8401841A/nl not_active Application Discontinuation
- 1984-06-08 BR BR8402811A patent/BR8402811A/pt unknown
- 1984-06-08 IT IT48351/84A patent/IT1177785B/it active
- 1984-06-08 FR FR848409048A patent/FR2547318B1/fr not_active Expired - Lifetime
- 1984-06-11 GB GB08414862A patent/GB2141140B/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006009079A (ja) * | 2004-06-25 | 2006-01-12 | Hitachi Ltd | プリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| ES533252A0 (es) | 1985-10-16 |
| IT8448351A1 (it) | 1985-12-08 |
| ES8601336A1 (es) | 1985-10-16 |
| NL8401841A (nl) | 1985-01-02 |
| FR2547318B1 (fr) | 1990-05-04 |
| IT8448351A0 (it) | 1984-06-08 |
| DE3420999A1 (de) | 1984-12-13 |
| AU554236B2 (en) | 1986-08-14 |
| GB8414862D0 (en) | 1984-07-18 |
| BR8402811A (pt) | 1985-05-21 |
| AU2903384A (en) | 1984-12-13 |
| GB2141140A (en) | 1984-12-12 |
| GB2141140B (en) | 1986-12-10 |
| CA1255621A (en) | 1989-06-13 |
| DE3420999C2 (enExample) | 1987-10-15 |
| IT1177785B (it) | 1987-08-26 |
| JPS6112036B2 (enExample) | 1986-04-05 |
| FR2547318A1 (fr) | 1984-12-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4272335A (en) | Composition and method for electrodeposition of copper | |
| US4336114A (en) | Electrodeposition of bright copper | |
| TWI404834B (zh) | 青銅之電鍍方法 | |
| CA1078323A (en) | Acid copper plating baths | |
| EP1644558B1 (en) | High purity electrolytic sulfonic acid solutions | |
| JPS6220278B2 (enExample) | ||
| JPS6362595B2 (enExample) | ||
| US4036711A (en) | Electrodeposition of copper | |
| JPS6056085A (ja) | 亜鉛/鉄合金めつき浴及び方法 | |
| GB2062009A (en) | Electroplacting Bath and Process | |
| JPS60169588A (ja) | 亜鉛用または亜鉛合金用酸性電着浴 | |
| US5849171A (en) | Acid bath for copper plating and process with the use of this combination | |
| JPH0246676B2 (enExample) | ||
| JPS6013090A (ja) | 銅めっき浴組成物及び使用方法 | |
| JPH07157890A (ja) | 酸性銅めっき浴及びこれを使用するめっき方法 | |
| US4772362A (en) | Zinc alloy electrolyte and process | |
| CA1255622A (en) | Process for electrodepositing copper | |
| US4134804A (en) | Cyanide-free zinc plating bath and process | |
| US4428804A (en) | High speed bright silver electroplating bath and process | |
| JPH0359995B2 (enExample) | ||
| JPH0578882A (ja) | ニツケル−リン合金メツキの形成方法 | |
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