JPS60130640U - 半導体装置の製造装置 - Google Patents

半導体装置の製造装置

Info

Publication number
JPS60130640U
JPS60130640U JP1823884U JP1823884U JPS60130640U JP S60130640 U JPS60130640 U JP S60130640U JP 1823884 U JP1823884 U JP 1823884U JP 1823884 U JP1823884 U JP 1823884U JP S60130640 U JPS60130640 U JP S60130640U
Authority
JP
Japan
Prior art keywords
semiconductor device
device manufacturing
manufacturing equipment
ring
stirring rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1823884U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0230837Y2 (enrdf_load_stackoverflow
Inventor
西川　治夫
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1823884U priority Critical patent/JPS60130640U/ja
Publication of JPS60130640U publication Critical patent/JPS60130640U/ja
Application granted granted Critical
Publication of JPH0230837Y2 publication Critical patent/JPH0230837Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1823884U 1984-02-09 1984-02-09 半導体装置の製造装置 Granted JPS60130640U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1823884U JPS60130640U (ja) 1984-02-09 1984-02-09 半導体装置の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1823884U JPS60130640U (ja) 1984-02-09 1984-02-09 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JPS60130640U true JPS60130640U (ja) 1985-09-02
JPH0230837Y2 JPH0230837Y2 (enrdf_load_stackoverflow) 1990-08-20

Family

ID=30506682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1823884U Granted JPS60130640U (ja) 1984-02-09 1984-02-09 半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JPS60130640U (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127644U (ja) * 1982-02-23 1983-08-30 日本電気ホームエレクトロニクス株式会社 半導体製造装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127644U (ja) * 1982-02-23 1983-08-30 日本電気ホームエレクトロニクス株式会社 半導体製造装置

Also Published As

Publication number Publication date
JPH0230837Y2 (enrdf_load_stackoverflow) 1990-08-20

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