JPS60130640U - Semiconductor device manufacturing equipment - Google Patents

Semiconductor device manufacturing equipment

Info

Publication number
JPS60130640U
JPS60130640U JP1823884U JP1823884U JPS60130640U JP S60130640 U JPS60130640 U JP S60130640U JP 1823884 U JP1823884 U JP 1823884U JP 1823884 U JP1823884 U JP 1823884U JP S60130640 U JPS60130640 U JP S60130640U
Authority
JP
Japan
Prior art keywords
semiconductor device
device manufacturing
manufacturing equipment
ring
stirring rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1823884U
Other languages
Japanese (ja)
Other versions
JPH0230837Y2 (en
Inventor
西川　治夫
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1823884U priority Critical patent/JPS60130640U/en
Publication of JPS60130640U publication Critical patent/JPS60130640U/en
Application granted granted Critical
Publication of JPH0230837Y2 publication Critical patent/JPH0230837Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は半導体装置の側断面図、第２図は半田部材の攪
拌方法を説明するための一部断面図、第３図は半田部材
の基板へのなじみ状態を示す平面　　−図、第４図は本
案の一実施例を示す側断面図、第５図は第４図の下面図
、第６図は半田部材の攪拌　　　　□方法を説明するた
めの一部断面図である。 図中、Ａは基板、Ｃは半田部材、２は攪拌装置、５は撹
拌棒、６は突出部、７は凹部（空間部）、８は羽根であ
る。FIG. 1 is a side sectional view of the semiconductor device, FIG. 2 is a partial sectional view for explaining the method of stirring the solder material, FIG. 3 is a plan view showing how the solder material is adapted to the substrate, and FIG. The figure is a side sectional view showing an embodiment of the present invention, FIG. 5 is a bottom view of FIG. 4, and FIG. 6 is a partial sectional view for explaining a method of stirring a solder member. In the figure, A is a substrate, C is a solder member, 2 is a stirring device, 5 is a stirring rod, 6 is a protrusion, 7 is a recess (space), and 8 is a blade.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 耐熱性部材よりなる撹拌棒の下端面を基板に載置され、
かつ溶融状態の半田部材に押しつけて回転することによ
り、半田部材を基板になじませるものにおいて、上記撹
拌棒の下端面の周縁部にリング状の突出部を形成すると
共に、突出部にて囲繞された凹部に攪拌用の羽根を形成
したことを特徴とする半導体装置の製造装置。The lower end of the stirring rod made of a heat-resistant material is placed on the substrate,
and a ring-shaped protrusion is formed on the periphery of the lower end surface of the stirring rod, and the ring-shaped protrusion is surrounded by the protrusion. 1. An apparatus for manufacturing a semiconductor device, characterized in that a stirring blade is formed in a recessed portion.
JP1823884U 1984-02-09 1984-02-09 Semiconductor device manufacturing equipment Granted JPS60130640U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1823884U JPS60130640U (en) 1984-02-09 1984-02-09 Semiconductor device manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1823884U JPS60130640U (en) 1984-02-09 1984-02-09 Semiconductor device manufacturing equipment

Publications (2)

Publication Number Publication Date
JPS60130640U true JPS60130640U (en) 1985-09-02
JPH0230837Y2 JPH0230837Y2 (en) 1990-08-20

Family

ID=30506682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1823884U Granted JPS60130640U (en) 1984-02-09 1984-02-09 Semiconductor device manufacturing equipment

Country Status (1)

Country Link
JP (1) JPS60130640U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127644U (en) * 1982-02-23 1983-08-30 日本電気ホームエレクトロニクス株式会社 semiconductor manufacturing equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127644U (en) * 1982-02-23 1983-08-30 日本電気ホームエレクトロニクス株式会社 semiconductor manufacturing equipment

Also Published As

Publication number Publication date
JPH0230837Y2 (en) 1990-08-20

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