JPS60130128A - リ−ドフレ−ム供給装置 - Google Patents
リ−ドフレ−ム供給装置Info
- Publication number
- JPS60130128A JPS60130128A JP23768983A JP23768983A JPS60130128A JP S60130128 A JPS60130128 A JP S60130128A JP 23768983 A JP23768983 A JP 23768983A JP 23768983 A JP23768983 A JP 23768983A JP S60130128 A JPS60130128 A JP S60130128A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- frames
- movable
- guide rails
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000000078 claw Anatomy 0.000 claims abstract description 33
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23768983A JPS60130128A (ja) | 1983-12-16 | 1983-12-16 | リ−ドフレ−ム供給装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23768983A JPS60130128A (ja) | 1983-12-16 | 1983-12-16 | リ−ドフレ−ム供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60130128A true JPS60130128A (ja) | 1985-07-11 |
JPH04592B2 JPH04592B2 (enrdf_load_stackoverflow) | 1992-01-08 |
Family
ID=17019048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23768983A Granted JPS60130128A (ja) | 1983-12-16 | 1983-12-16 | リ−ドフレ−ム供給装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60130128A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6197835U (enrdf_load_stackoverflow) * | 1984-11-30 | 1986-06-23 | ||
US5186719A (en) * | 1990-04-23 | 1993-02-16 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for conveying semiconductor lead frame strip using guide rails |
US5264002A (en) * | 1990-04-23 | 1993-11-23 | Mitsubishi Danki Kabushiki Kaisha | Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails |
-
1983
- 1983-12-16 JP JP23768983A patent/JPS60130128A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6197835U (enrdf_load_stackoverflow) * | 1984-11-30 | 1986-06-23 | ||
US5186719A (en) * | 1990-04-23 | 1993-02-16 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for conveying semiconductor lead frame strip using guide rails |
US5264002A (en) * | 1990-04-23 | 1993-11-23 | Mitsubishi Danki Kabushiki Kaisha | Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails |
Also Published As
Publication number | Publication date |
---|---|
JPH04592B2 (enrdf_load_stackoverflow) | 1992-01-08 |
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