JPH04592B2 - - Google Patents

Info

Publication number
JPH04592B2
JPH04592B2 JP23768983A JP23768983A JPH04592B2 JP H04592 B2 JPH04592 B2 JP H04592B2 JP 23768983 A JP23768983 A JP 23768983A JP 23768983 A JP23768983 A JP 23768983A JP H04592 B2 JPH04592 B2 JP H04592B2
Authority
JP
Japan
Prior art keywords
lead frame
guide rail
lead
movable
inner guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP23768983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60130128A (ja
Inventor
Kazuo Numajiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP23768983A priority Critical patent/JPS60130128A/ja
Publication of JPS60130128A publication Critical patent/JPS60130128A/ja
Publication of JPH04592B2 publication Critical patent/JPH04592B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
JP23768983A 1983-12-16 1983-12-16 リ−ドフレ−ム供給装置 Granted JPS60130128A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23768983A JPS60130128A (ja) 1983-12-16 1983-12-16 リ−ドフレ−ム供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23768983A JPS60130128A (ja) 1983-12-16 1983-12-16 リ−ドフレ−ム供給装置

Publications (2)

Publication Number Publication Date
JPS60130128A JPS60130128A (ja) 1985-07-11
JPH04592B2 true JPH04592B2 (enrdf_load_stackoverflow) 1992-01-08

Family

ID=17019048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23768983A Granted JPS60130128A (ja) 1983-12-16 1983-12-16 リ−ドフレ−ム供給装置

Country Status (1)

Country Link
JP (1) JPS60130128A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6197835U (enrdf_load_stackoverflow) * 1984-11-30 1986-06-23
US5264002A (en) * 1990-04-23 1993-11-23 Mitsubishi Danki Kabushiki Kaisha Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails
JPH0770550B2 (ja) * 1990-04-23 1995-07-31 三菱電機株式会社 半導体フレームの搬送装置および搬送方法

Also Published As

Publication number Publication date
JPS60130128A (ja) 1985-07-11

Similar Documents

Publication Publication Date Title
CN108820408B (zh) 一种撕膜机
US5195235A (en) Parts mounting apparatus
CN109692782B (zh) 一种贴合设备
JP2712960B2 (ja) ディップ装置
US6062795A (en) Wafer ring feeding apparatus
CN113804622B (zh) 外观检测设备
CN109049963B (zh) 手机电池板的智能化高速柔性制造流水线
CN119261358A (zh) 一种运用机器视觉算法的全自动移印镭雕检测设备
JPH04592B2 (enrdf_load_stackoverflow)
CN110539554B (zh) 移印机
JPH0147364B2 (enrdf_load_stackoverflow)
US3425687A (en) Handling apparatus for rigid sheet material
CN118323803A (zh) 一种电子元器件的排料上料装置及其使用方法
CN109256347B (zh) 制造芯片的智能化生产流水线
CN216836035U (zh) 自动移印设备
CN116040311A (zh) 一种棱镜产品排片设备
JPS6120339A (ja) リ−ドフレ−ム供給装置
US5038462A (en) Apparatus for assembling articles from two halves such as video cassette containers
CN109746162B (zh) 一种自动化点胶烘干设备及其工作方法
KR950012652B1 (ko) 이송장치
CN223102036U (zh) 一种新型头仔自动上下料设备
CN221607382U (zh) 一种自动双面胶贴胶机
JPH0240465B2 (ja) Purintokibannohansosochi
CN221968970U (zh) 一种汽车方向盘控制面板的装配生产线
CN219429028U (zh) 喂料设备