JPS60124833A - 多層回路パターン検査装置 - Google Patents

多層回路パターン検査装置

Info

Publication number
JPS60124833A
JPS60124833A JP58231363A JP23136383A JPS60124833A JP S60124833 A JPS60124833 A JP S60124833A JP 58231363 A JP58231363 A JP 58231363A JP 23136383 A JP23136383 A JP 23136383A JP S60124833 A JPS60124833 A JP S60124833A
Authority
JP
Japan
Prior art keywords
light
lsi
lsi wafer
wafer
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58231363A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0329177B2 (enrdf_load_stackoverflow
Inventor
Shunji Maeda
俊二 前田
Mitsuyoshi Koizumi
小泉　光義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58231363A priority Critical patent/JPS60124833A/ja
Publication of JPS60124833A publication Critical patent/JPS60124833A/ja
Publication of JPH0329177B2 publication Critical patent/JPH0329177B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP58231363A 1983-12-09 1983-12-09 多層回路パターン検査装置 Granted JPS60124833A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58231363A JPS60124833A (ja) 1983-12-09 1983-12-09 多層回路パターン検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58231363A JPS60124833A (ja) 1983-12-09 1983-12-09 多層回路パターン検査装置

Publications (2)

Publication Number Publication Date
JPS60124833A true JPS60124833A (ja) 1985-07-03
JPH0329177B2 JPH0329177B2 (enrdf_load_stackoverflow) 1991-04-23

Family

ID=16922443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58231363A Granted JPS60124833A (ja) 1983-12-09 1983-12-09 多層回路パターン検査装置

Country Status (1)

Country Link
JP (1) JPS60124833A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270222A (en) * 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
KR20140085325A (ko) * 2012-12-27 2014-07-07 삼성전자주식회사 결함 검사 장치 및 결함 검사 방법
JP2015111161A (ja) * 2015-03-17 2015-06-18 大日本印刷株式会社 異物検査装置、異物検査方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208153A (en) * 1981-06-17 1982-12-21 Hitachi Ltd Inspecting method for defective aluminum pattern of semiconductor or the like
JPS5852335A (ja) * 1981-09-21 1983-03-28 Tokuyama Soda Co Ltd ポリプロピレン組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208153A (en) * 1981-06-17 1982-12-21 Hitachi Ltd Inspecting method for defective aluminum pattern of semiconductor or the like
JPS5852335A (ja) * 1981-09-21 1983-03-28 Tokuyama Soda Co Ltd ポリプロピレン組成物

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270222A (en) * 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
US5719495A (en) * 1990-12-31 1998-02-17 Texas Instruments Incorporated Apparatus for semiconductor device fabrication diagnosis and prognosis
KR20140085325A (ko) * 2012-12-27 2014-07-07 삼성전자주식회사 결함 검사 장치 및 결함 검사 방법
JP2014126557A (ja) * 2012-12-27 2014-07-07 Samsung R&D Institute Japan Co Ltd 欠陥検査装置及び欠陥検査方法
JP2015111161A (ja) * 2015-03-17 2015-06-18 大日本印刷株式会社 異物検査装置、異物検査方法

Also Published As

Publication number Publication date
JPH0329177B2 (enrdf_load_stackoverflow) 1991-04-23

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