JPH0329177B2 - - Google Patents

Info

Publication number
JPH0329177B2
JPH0329177B2 JP58231363A JP23136383A JPH0329177B2 JP H0329177 B2 JPH0329177 B2 JP H0329177B2 JP 58231363 A JP58231363 A JP 58231363A JP 23136383 A JP23136383 A JP 23136383A JP H0329177 B2 JPH0329177 B2 JP H0329177B2
Authority
JP
Japan
Prior art keywords
circuit pattern
light
lsi wafer
optical system
polarized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58231363A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60124833A (ja
Inventor
Shunji Maeda
Mitsuyoshi Koizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58231363A priority Critical patent/JPS60124833A/ja
Publication of JPS60124833A publication Critical patent/JPS60124833A/ja
Publication of JPH0329177B2 publication Critical patent/JPH0329177B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP58231363A 1983-12-09 1983-12-09 多層回路パターン検査装置 Granted JPS60124833A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58231363A JPS60124833A (ja) 1983-12-09 1983-12-09 多層回路パターン検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58231363A JPS60124833A (ja) 1983-12-09 1983-12-09 多層回路パターン検査装置

Publications (2)

Publication Number Publication Date
JPS60124833A JPS60124833A (ja) 1985-07-03
JPH0329177B2 true JPH0329177B2 (enrdf_load_stackoverflow) 1991-04-23

Family

ID=16922443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58231363A Granted JPS60124833A (ja) 1983-12-09 1983-12-09 多層回路パターン検査装置

Country Status (1)

Country Link
JP (1) JPS60124833A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270222A (en) * 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
JP6168383B2 (ja) * 2012-12-27 2017-07-26 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 欠陥検査装置及び欠陥検査方法
JP6119785B2 (ja) * 2015-03-17 2017-04-26 大日本印刷株式会社 異物検査装置、異物検査方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208153A (en) * 1981-06-17 1982-12-21 Hitachi Ltd Inspecting method for defective aluminum pattern of semiconductor or the like
JPS5852335A (ja) * 1981-09-21 1983-03-28 Tokuyama Soda Co Ltd ポリプロピレン組成物

Also Published As

Publication number Publication date
JPS60124833A (ja) 1985-07-03

Similar Documents

Publication Publication Date Title
US8804109B2 (en) Defect inspection system
JP2796316B2 (ja) 欠陥または異物の検査方法およびその装置
JPH0437922B2 (enrdf_load_stackoverflow)
JP4001653B2 (ja) 試料からの多重チャネル応答を用いた試料の光学的検査
US20020093647A1 (en) Surface inspection apparatus and surface inspection method
TWI829958B (zh) 用於檢驗半導體裝置之系統及方法
JP2000046532A (ja) パターン検査装置
JPS62127652A (ja) 半導体ウエハの表面欠陥検査装置
JPH0329177B2 (enrdf_load_stackoverflow)
JP2005214980A (ja) ウエハのマクロ検査方法および自動ウエハマクロ検査装置
JPH0868618A (ja) 半導体装置の製造システム及び製造方法
JP3657076B2 (ja) ウエハのマクロ検査方法および自動ウエハマクロ検査装置
JP2000028535A (ja) 欠陥検査装置
JP2705764B2 (ja) 透明ガラス基板の欠陥検出装置
JP2007107960A (ja) 欠陥検査装置
JPH0254494B2 (enrdf_load_stackoverflow)
JP2011180145A (ja) 欠陥検査装置
TWI898376B (zh) 半導體元件檢測裝置及其檢測方法
JPH11326228A (ja) 鏡面体外観検査装置
JPH01143904A (ja) 薄膜検査装置
JPH09218162A (ja) 表面欠陥検査装置
JPS62223651A (ja) 検査方法および装置
JPS62223649A (ja) 検査方法および装置
JPS6243504A (ja) 透明薄膜パタ−ンの欠陥検査方法
JPH0739993B2 (ja) 検査方法および装置