JPS60116157A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS60116157A JPS60116157A JP22474483A JP22474483A JPS60116157A JP S60116157 A JPS60116157 A JP S60116157A JP 22474483 A JP22474483 A JP 22474483A JP 22474483 A JP22474483 A JP 22474483A JP S60116157 A JPS60116157 A JP S60116157A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- powder
- electrode
- chip
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000843 powder Substances 0.000 abstract 6
- 229920005989 resin Polymers 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound 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[Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
- 229920005992 thermoplastic resin Polymers 0.000 abstract 2
- 238000002161 passivation Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
Abstract
PURPOSE:To mount in a chip shape in the minimum area on a circuit board by forming an isotropic conductive layer made of photocurable resin and conductive powder for an aluminum pad, and an anisotropic conductive layer made of thermoplastic resin and conductive powder on the isotropic layer. CONSTITUTION:An aluminum pad 3 formed on the upper surface of a semiconductor element chip 1 made of Si substrate is coated partly with a passivation film 2. Then, an isotropic conductive layer 4 made of photocurable resin and conductive powder and an anisotropic conductive layer 5 made of thermoplastic resin and conductive powder are formed on the pad. This chip 1 is placed on an electrode 8 formed on the circuit board 7, the layer 5 is fusion-bonded to the electrode with the resin of the layer 5 melted, the powder 6 presented at points in the layer 5 is interposed between the layer 4 and the electrode 8 to electrically and mechanically couple the chip 1 and the electrode 8. In addition, the powder 6 of the not pressurized portion becomes completely insulated film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22474483A JPH031828B2 (en) | 1983-11-29 | 1983-11-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22474483A JPH031828B2 (en) | 1983-11-29 | 1983-11-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60116157A true JPS60116157A (en) | 1985-06-22 |
JPH031828B2 JPH031828B2 (en) | 1991-01-11 |
Family
ID=16818554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22474483A Expired JPH031828B2 (en) | 1983-11-29 | 1983-11-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH031828B2 (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6243138A (en) * | 1985-08-21 | 1987-02-25 | Seiko Instr & Electronics Ltd | Ic mounting structure of liquid crystal display apparatus |
JPS6347942A (en) * | 1986-08-18 | 1988-02-29 | Fuji Xerox Co Ltd | Semiconductor device |
EP0265077A2 (en) * | 1986-09-25 | 1988-04-27 | Sheldahl, Inc. | An anisotropic adhesive for bonding electrical components |
FR2618254A1 (en) * | 1987-07-16 | 1989-01-20 | Thomson Semiconducteurs | METHOD AND STRUCTURE FOR TAKING CONTACT ON INTEGRATED CIRCUIT PLOTS. |
JPH0195553A (en) * | 1987-10-08 | 1989-04-13 | Sony Corp | Solid-state image sensing device |
JPH01132138A (en) * | 1987-08-13 | 1989-05-24 | Shin Etsu Polymer Co Ltd | Electrical connection method of ic chip, material for resin bump formation and liquid crystal display |
JPH0234951A (en) * | 1988-04-20 | 1990-02-05 | Seiko Epson Corp | Mounting structure for semiconductor device |
JPH02199847A (en) * | 1989-01-27 | 1990-08-08 | Shin Etsu Polymer Co Ltd | Mounting of ic chip |
JPH04262890A (en) * | 1990-09-27 | 1992-09-18 | Motorola Inc | Adhesive material having fluxing agent and metal particle |
EP0734065A2 (en) * | 1995-03-24 | 1996-09-25 | Shinko Electric Industries Co. Ltd. | Chip sized semiconductor device |
WO1997018584A1 (en) * | 1995-11-15 | 1997-05-22 | Citizen Watch Co., Ltd. | Method for forming bump of semiconductor device |
US6204164B1 (en) * | 1995-08-21 | 2001-03-20 | Mitel Corporation | Method of making electrical connections to integrated circuit |
US6396712B1 (en) * | 1998-02-12 | 2002-05-28 | Rose Research, L.L.C. | Method and apparatus for coupling circuit components |
JP2007294916A (en) * | 2006-03-31 | 2007-11-08 | Brother Ind Ltd | Connecting structure, method of forming bump and the like |
-
1983
- 1983-11-29 JP JP22474483A patent/JPH031828B2/ja not_active Expired
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6243138A (en) * | 1985-08-21 | 1987-02-25 | Seiko Instr & Electronics Ltd | Ic mounting structure of liquid crystal display apparatus |
JPS6347942A (en) * | 1986-08-18 | 1988-02-29 | Fuji Xerox Co Ltd | Semiconductor device |
EP0265077A2 (en) * | 1986-09-25 | 1988-04-27 | Sheldahl, Inc. | An anisotropic adhesive for bonding electrical components |
EP0265077A3 (en) * | 1986-09-25 | 1989-03-08 | Sheldahl, Inc. | An anisotropic adhesive for bonding electrical components |
FR2618254A1 (en) * | 1987-07-16 | 1989-01-20 | Thomson Semiconducteurs | METHOD AND STRUCTURE FOR TAKING CONTACT ON INTEGRATED CIRCUIT PLOTS. |
JPH01132138A (en) * | 1987-08-13 | 1989-05-24 | Shin Etsu Polymer Co Ltd | Electrical connection method of ic chip, material for resin bump formation and liquid crystal display |
JPH0195553A (en) * | 1987-10-08 | 1989-04-13 | Sony Corp | Solid-state image sensing device |
JPH0234951A (en) * | 1988-04-20 | 1990-02-05 | Seiko Epson Corp | Mounting structure for semiconductor device |
JPH02199847A (en) * | 1989-01-27 | 1990-08-08 | Shin Etsu Polymer Co Ltd | Mounting of ic chip |
JPH04262890A (en) * | 1990-09-27 | 1992-09-18 | Motorola Inc | Adhesive material having fluxing agent and metal particle |
EP0734065A2 (en) * | 1995-03-24 | 1996-09-25 | Shinko Electric Industries Co. Ltd. | Chip sized semiconductor device |
EP0734065A3 (en) * | 1995-03-24 | 1997-03-05 | Shinko Electric Ind Co | Chip sized semiconductor device |
US6204164B1 (en) * | 1995-08-21 | 2001-03-20 | Mitel Corporation | Method of making electrical connections to integrated circuit |
WO1997018584A1 (en) * | 1995-11-15 | 1997-05-22 | Citizen Watch Co., Ltd. | Method for forming bump of semiconductor device |
US6066551A (en) * | 1995-11-15 | 2000-05-23 | Citizen Watch Co., Ltd. | Method for forming bump of semiconductor device |
US6396712B1 (en) * | 1998-02-12 | 2002-05-28 | Rose Research, L.L.C. | Method and apparatus for coupling circuit components |
JP2007294916A (en) * | 2006-03-31 | 2007-11-08 | Brother Ind Ltd | Connecting structure, method of forming bump and the like |
Also Published As
Publication number | Publication date |
---|---|
JPH031828B2 (en) | 1991-01-11 |
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