JPS60116157A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS60116157A
JPS60116157A JP22474483A JP22474483A JPS60116157A JP S60116157 A JPS60116157 A JP S60116157A JP 22474483 A JP22474483 A JP 22474483A JP 22474483 A JP22474483 A JP 22474483A JP S60116157 A JPS60116157 A JP S60116157A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
layer
made
powder
electrode
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22474483A
Other versions
JPH031828B2 (en )
Inventor
Takafumi Kashiwagi
Kazuyuki Shimada
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827Materials
    • H01L23/4828Conductive organic material or pastes, e.g. conductive adhesives, inks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83191Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]

Abstract

PURPOSE:To mount in a chip shape in the minimum area on a circuit board by forming an isotropic conductive layer made of photocurable resin and conductive powder for an aluminum pad, and an anisotropic conductive layer made of thermoplastic resin and conductive powder on the isotropic layer. CONSTITUTION:An aluminum pad 3 formed on the upper surface of a semiconductor element chip 1 made of Si substrate is coated partly with a passivation film 2. Then, an isotropic conductive layer 4 made of photocurable resin and conductive powder and an anisotropic conductive layer 5 made of thermoplastic resin and conductive powder are formed on the pad. This chip 1 is placed on an electrode 8 formed on the circuit board 7, the layer 5 is fusion-bonded to the electrode with the resin of the layer 5 melted, the powder 6 presented at points in the layer 5 is interposed between the layer 4 and the electrode 8 to electrically and mechanically couple the chip 1 and the electrode 8. In addition, the powder 6 of the not pressurized portion becomes completely insulated film.
JP22474483A 1983-11-29 1983-11-29 Expired - Lifetime JPH031828B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22474483A JPH031828B2 (en) 1983-11-29 1983-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22474483A JPH031828B2 (en) 1983-11-29 1983-11-29

Publications (2)

Publication Number Publication Date
JPS60116157A true true JPS60116157A (en) 1985-06-22
JPH031828B2 JPH031828B2 (en) 1991-01-11

Family

ID=16818554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22474483A Expired - Lifetime JPH031828B2 (en) 1983-11-29 1983-11-29

Country Status (1)

Country Link
JP (1) JPH031828B2 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243138A (en) * 1985-08-21 1987-02-25 Seiko Instr & Electronics Ltd Ic mounting structure of liquid crystal display apparatus
JPS6347942A (en) * 1986-08-18 1988-02-29 Fuji Xerox Co Ltd Semiconductor device
EP0265077A2 (en) * 1986-09-25 1988-04-27 Sheldahl, Inc. An anisotropic adhesive for bonding electrical components
FR2618254A1 (en) * 1987-07-16 1989-01-20 Thomson Semiconducteurs Method and structure for making contact on circuit pads integrated.
JPH0195553A (en) * 1987-10-08 1989-04-13 Sony Corp Solid-state image sensing device
JPH01132138A (en) * 1987-08-13 1989-05-24 Shin Etsu Polymer Co Ltd Electrical connection method of ic chip, material for resin bump formation and liquid crystal display
JPH0234951A (en) * 1988-04-20 1990-02-05 Seiko Epson Corp Mounting structure for semiconductor device
JPH02199847A (en) * 1989-01-27 1990-08-08 Shin Etsu Polymer Co Ltd Mounting of ic chip
JPH04262890A (en) * 1990-09-27 1992-09-18 Motorola Inc Adhesive material having fluxing agent and metal particle
EP0734065A2 (en) * 1995-03-24 1996-09-25 Shinko Electric Industries Co. Ltd. Chip sized semiconductor device
WO1997018584A1 (en) * 1995-11-15 1997-05-22 Citizen Watch Co., Ltd. Method for forming bump of semiconductor device
US6204164B1 (en) * 1995-08-21 2001-03-20 Mitel Corporation Method of making electrical connections to integrated circuit
US6396712B1 (en) * 1998-02-12 2002-05-28 Rose Research, L.L.C. Method and apparatus for coupling circuit components
JP2007294916A (en) * 2006-03-31 2007-11-08 Brother Ind Ltd Connecting structure, method of forming bump and the like

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243138A (en) * 1985-08-21 1987-02-25 Seiko Instr & Electronics Ltd Ic mounting structure of liquid crystal display apparatus
JPS6347942A (en) * 1986-08-18 1988-02-29 Fuji Xerox Co Ltd Semiconductor device
EP0265077A2 (en) * 1986-09-25 1988-04-27 Sheldahl, Inc. An anisotropic adhesive for bonding electrical components
EP0265077A3 (en) * 1986-09-25 1989-03-08 Sheldahl, Inc. An anisotropic adhesive for bonding electrical components
FR2618254A1 (en) * 1987-07-16 1989-01-20 Thomson Semiconducteurs Method and structure for making contact on circuit pads integrated.
JPH01132138A (en) * 1987-08-13 1989-05-24 Shin Etsu Polymer Co Ltd Electrical connection method of ic chip, material for resin bump formation and liquid crystal display
JPH0195553A (en) * 1987-10-08 1989-04-13 Sony Corp Solid-state image sensing device
JPH0234951A (en) * 1988-04-20 1990-02-05 Seiko Epson Corp Mounting structure for semiconductor device
JPH02199847A (en) * 1989-01-27 1990-08-08 Shin Etsu Polymer Co Ltd Mounting of ic chip
JPH04262890A (en) * 1990-09-27 1992-09-18 Motorola Inc Adhesive material having fluxing agent and metal particle
EP0734065A2 (en) * 1995-03-24 1996-09-25 Shinko Electric Industries Co. Ltd. Chip sized semiconductor device
EP0734065A3 (en) * 1995-03-24 1997-03-05 Shinko Electric Ind Co Chip sized semiconductor device
US6204164B1 (en) * 1995-08-21 2001-03-20 Mitel Corporation Method of making electrical connections to integrated circuit
WO1997018584A1 (en) * 1995-11-15 1997-05-22 Citizen Watch Co., Ltd. Method for forming bump of semiconductor device
US6066551A (en) * 1995-11-15 2000-05-23 Citizen Watch Co., Ltd. Method for forming bump of semiconductor device
US6396712B1 (en) * 1998-02-12 2002-05-28 Rose Research, L.L.C. Method and apparatus for coupling circuit components
JP2007294916A (en) * 2006-03-31 2007-11-08 Brother Ind Ltd Connecting structure, method of forming bump and the like

Also Published As

Publication number Publication date Type
JPH031828B2 (en) 1991-01-11 grant

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