New! View global litigation for patent families

JPH0234951A - Mounting structure for semiconductor device - Google Patents

Mounting structure for semiconductor device

Info

Publication number
JPH0234951A
JPH0234951A JP1161389A JP1161389A JPH0234951A JP H0234951 A JPH0234951 A JP H0234951A JP 1161389 A JP1161389 A JP 1161389A JP 1161389 A JP1161389 A JP 1161389A JP H0234951 A JPH0234951 A JP H0234951A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
element
pattern
formed
semiconductor
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1161389A
Inventor
Nobuaki Hashimoto
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Abstract

PURPOSE: To prevent a short-circuit between glass electrodes, and between a semiconductor element and the electrode by making an air gap exist between a semiconductor element active element forming face and a wiring pattern formed on an insulating substrate.
CONSTITUTION: A substrate 1 is formed of ceramics, resin, etc., and its surface is at least insulated. After the electrode 6 of a semiconductor element 7 is covered with metal, a metallic bump 5 is formed, and a wiring pattern 2 is formed at a position corresponding to the bump 5 of the element 7 on the board 1. An anisotropically conductive film 10 is thinner than the bump 5, an air gap 8 is resultantly formed between the active element forming face of the element 7 and the pattern 2, and an electric insulation between the board 1 and the element 7 is maintained. An anisotropically conductive film 10 is not presented to the pattern 2 directly under the element 7, and the insulation is held due to the gap 8. Thus, no short-circuit occurs between the element 7 and the pattern 2, and between the patterns 2.
COPYRIGHT: (C)1990,JPO&Japio
JP1161389A 1988-04-20 1989-01-20 Mounting structure for semiconductor device Pending JPH0234951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9763588 1988-04-20

Publications (1)

Publication Number Publication Date
JPH0234951A true true JPH0234951A (en) 1990-02-05

Family

ID=14197609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1161389A Pending JPH0234951A (en) 1988-04-20 1989-01-20 Mounting structure for semiconductor device

Country Status (1)

Country Link
JP (1) JPH0234951A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940180B1 (en) 1996-09-05 2005-09-06 Seiko Epson Corporation Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60116157A (en) * 1983-11-29 1985-06-22 Matsushita Electric Ind Co Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60116157A (en) * 1983-11-29 1985-06-22 Matsushita Electric Ind Co Ltd Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940180B1 (en) 1996-09-05 2005-09-06 Seiko Epson Corporation Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
US7084517B2 (en) 1996-09-05 2006-08-01 Seiko Epson Corporation Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit

Similar Documents

Publication Publication Date Title
JPH04355933A (en) Packaging structure of flip chip
JPS6352432A (en) Semiconductor device
JPS607149A (en) Manufacture of semiconductor device
JPH04126307A (en) Anisotropic conductive film and manufacture thereof
JPH03108350A (en) Measuring jig
JPS60136367A (en) Semiconductor integrated circuit device
JPH03178152A (en) Molded ic and its manufacture
JPH04218918A (en) Semiconductor device and its manufacture
JPH02310536A (en) Active matrix substrate
JPS5967649A (en) Manufacture of multilayer wiring
JPS6350102A (en) Dielectric resonator
JPH04118984A (en) Mounting structure for electronic component
JPS6216554A (en) Power semiconductor device with incorporated control circuit
JPH0396267A (en) Semiconductor integrated circuit device
JPS58190046A (en) Semiconductor device
JPS62120703A (en) Mounting structure for dielectric filter
JPS62149180A (en) Led device
JPH02134890A (en) Circuit element mounting board
JPH02151496A (en) Preparation of integrated circuit device
JPH02265294A (en) Formation of bump on printed wiring board
JPH0362927A (en) Semiconductor device and manufacture thereof
JPS6464285A (en) Printed board
JPS5944844A (en) Semiconductor device and manufacture thereof
JPS62133713A (en) Formation of electrode and electrode thereof
JPH01143388A (en) Printed wiring board with metal plate as base