JPS60116156A - アルミニウム合金パッケ−ジ - Google Patents

アルミニウム合金パッケ−ジ

Info

Publication number
JPS60116156A
JPS60116156A JP22463583A JP22463583A JPS60116156A JP S60116156 A JPS60116156 A JP S60116156A JP 22463583 A JP22463583 A JP 22463583A JP 22463583 A JP22463583 A JP 22463583A JP S60116156 A JPS60116156 A JP S60116156A
Authority
JP
Japan
Prior art keywords
package
aluminum alloy
glass
terminal
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22463583A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04597B2 (cg-RX-API-DMAC7.html
Inventor
Tsutomu Iikawa
勤 飯川
Shigeki Okamoto
岡本　茂樹
Katsuhide Natori
名取　勝英
Isao Kawamura
勲 川村
Takeaki Sakai
酒井　武明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP22463583A priority Critical patent/JPS60116156A/ja
Publication of JPS60116156A publication Critical patent/JPS60116156A/ja
Publication of JPH04597B2 publication Critical patent/JPH04597B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP22463583A 1983-11-29 1983-11-29 アルミニウム合金パッケ−ジ Granted JPS60116156A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22463583A JPS60116156A (ja) 1983-11-29 1983-11-29 アルミニウム合金パッケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22463583A JPS60116156A (ja) 1983-11-29 1983-11-29 アルミニウム合金パッケ−ジ

Publications (2)

Publication Number Publication Date
JPS60116156A true JPS60116156A (ja) 1985-06-22
JPH04597B2 JPH04597B2 (cg-RX-API-DMAC7.html) 1992-01-08

Family

ID=16816796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22463583A Granted JPS60116156A (ja) 1983-11-29 1983-11-29 アルミニウム合金パッケ−ジ

Country Status (1)

Country Link
JP (1) JPS60116156A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2642257A1 (fr) * 1989-01-20 1990-07-27 Dassault Electronique Procede de scellement verre-aluminium, notamment pour traversee electrique de boitier de circuit hybride, objet composite et composition de verre correspondants

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2642257A1 (fr) * 1989-01-20 1990-07-27 Dassault Electronique Procede de scellement verre-aluminium, notamment pour traversee electrique de boitier de circuit hybride, objet composite et composition de verre correspondants
US5538527A (en) * 1989-01-20 1996-07-23 Dassault Electronique Method of sealing glass to aluminum, particularly for electrical feed-through connectors

Also Published As

Publication number Publication date
JPH04597B2 (cg-RX-API-DMAC7.html) 1992-01-08

Similar Documents

Publication Publication Date Title
US4656499A (en) Hermetically sealed semiconductor casing
US4542259A (en) High density packages
US4784974A (en) Method of making a hermetically sealed semiconductor casing
US3020454A (en) Sealing of electrical semiconductor devices
JPH05508259A (ja) 改善された電磁障害抵抗を有する金属電子パッケージ
KR20000069623A (ko) 직접 접촉 다이 부착 방법 및 장치
US5105258A (en) Metal system for semiconductor die attach
JP3816821B2 (ja) 高周波用パワーモジュール基板及びその製造方法
JPS58169942A (ja) 半導体装置
US3451122A (en) Methods of making soldered connections
JPS60116156A (ja) アルミニウム合金パッケ−ジ
EP0100817B1 (en) A hermetically sealed casing of an electrical device and process of manufacturing
US3039175A (en) Sealing of electrical semiconductor devices
JPS60224237A (ja) 半導体装置およびその製造方法
JPS6083356A (ja) 半導体装置
JPS60165745A (ja) 樹脂封止型半導体装置
JP2531441B2 (ja) 半導体装置
KR810001418Y1 (ko) 반도체 장치
JPS5927537A (ja) 半導体装置
JPS62213270A (ja) 半導体装置用リ−ドフレ−ム
JPH085563Y2 (ja) 高電力ハイブリッドｉｃ用金属パッケージ
JPH0140514B2 (cg-RX-API-DMAC7.html)
JPS58123744A (ja) リ−ドフレ−ム及び半導体装置の製造方法
JPH03285347A (ja) ハイブリッドｉｃおよび金属容器
JPH03285348A (ja) ハイブリッドｉｃ