JPH04597B2 - - Google Patents

Info

Publication number
JPH04597B2
JPH04597B2 JP22463583A JP22463583A JPH04597B2 JP H04597 B2 JPH04597 B2 JP H04597B2 JP 22463583 A JP22463583 A JP 22463583A JP 22463583 A JP22463583 A JP 22463583A JP H04597 B2 JPH04597 B2 JP H04597B2
Authority
JP
Japan
Prior art keywords
package
glass
aluminum alloy
terminals
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22463583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60116156A (ja
Inventor
Tsutomu Iikawa
Shigeki Okamoto
Katsuhide Natori
Isao Kawamura
Takeaki Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP22463583A priority Critical patent/JPS60116156A/ja
Publication of JPS60116156A publication Critical patent/JPS60116156A/ja
Publication of JPH04597B2 publication Critical patent/JPH04597B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP22463583A 1983-11-29 1983-11-29 アルミニウム合金パッケ−ジ Granted JPS60116156A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22463583A JPS60116156A (ja) 1983-11-29 1983-11-29 アルミニウム合金パッケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22463583A JPS60116156A (ja) 1983-11-29 1983-11-29 アルミニウム合金パッケ−ジ

Publications (2)

Publication Number Publication Date
JPS60116156A JPS60116156A (ja) 1985-06-22
JPH04597B2 true JPH04597B2 (cg-RX-API-DMAC7.html) 1992-01-08

Family

ID=16816796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22463583A Granted JPS60116156A (ja) 1983-11-29 1983-11-29 アルミニウム合金パッケ−ジ

Country Status (1)

Country Link
JP (1) JPS60116156A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2642257B1 (fr) * 1989-01-20 1996-05-24 Dassault Electronique Procede de scellement verre-aluminium, notamment pour traversee electrique de boitier de circuit hybride, objet composite et composition de verre correspondants

Also Published As

Publication number Publication date
JPS60116156A (ja) 1985-06-22

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