JPS60115293A - ハイブリッド集積回路装置の製造方法 - Google Patents

ハイブリッド集積回路装置の製造方法

Info

Publication number
JPS60115293A
JPS60115293A JP58222964A JP22296483A JPS60115293A JP S60115293 A JPS60115293 A JP S60115293A JP 58222964 A JP58222964 A JP 58222964A JP 22296483 A JP22296483 A JP 22296483A JP S60115293 A JPS60115293 A JP S60115293A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
outside
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58222964A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0254676B2 (enrdf_load_stackoverflow
Inventor
治 古川
柾木　一彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58222964A priority Critical patent/JPS60115293A/ja
Publication of JPS60115293A publication Critical patent/JPS60115293A/ja
Publication of JPH0254676B2 publication Critical patent/JPH0254676B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Led Device Packages (AREA)
JP58222964A 1983-11-27 1983-11-27 ハイブリッド集積回路装置の製造方法 Granted JPS60115293A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58222964A JPS60115293A (ja) 1983-11-27 1983-11-27 ハイブリッド集積回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58222964A JPS60115293A (ja) 1983-11-27 1983-11-27 ハイブリッド集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60115293A true JPS60115293A (ja) 1985-06-21
JPH0254676B2 JPH0254676B2 (enrdf_load_stackoverflow) 1990-11-22

Family

ID=16790639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58222964A Granted JPS60115293A (ja) 1983-11-27 1983-11-27 ハイブリッド集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60115293A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006124582A1 (en) * 2005-05-13 2006-11-23 Sandisk Corporation Method of assembling semiconductor devices with leds

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103195A (ja) * 1981-12-16 1983-06-20 アルプス電気株式会社 回路板
JPS5961093A (ja) * 1982-09-29 1984-04-07 東京コスモス電機株式会社 複合電子部品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103195A (ja) * 1981-12-16 1983-06-20 アルプス電気株式会社 回路板
JPS5961093A (ja) * 1982-09-29 1984-04-07 東京コスモス電機株式会社 複合電子部品の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006124582A1 (en) * 2005-05-13 2006-11-23 Sandisk Corporation Method of assembling semiconductor devices with leds
US7384817B2 (en) 2005-05-13 2008-06-10 Sandisk Corporation Method of assembling semiconductor devices with LEDs
US7812356B2 (en) 2005-05-13 2010-10-12 Sandisk Corporation Method of assembling semiconductor devices with LEDS
US8022417B2 (en) 2005-05-13 2011-09-20 Sandisk Technologies Inc. Method of assembling semiconductor devices with LEDS

Also Published As

Publication number Publication date
JPH0254676B2 (enrdf_load_stackoverflow) 1990-11-22

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