JPS6011525A - 低粘度エポキシ含浸樹脂の製造法 - Google Patents
低粘度エポキシ含浸樹脂の製造法Info
- Publication number
- JPS6011525A JPS6011525A JP11963483A JP11963483A JPS6011525A JP S6011525 A JPS6011525 A JP S6011525A JP 11963483 A JP11963483 A JP 11963483A JP 11963483 A JP11963483 A JP 11963483A JP S6011525 A JPS6011525 A JP S6011525A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- parts
- resin
- viscosity
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11963483A JPS6011525A (ja) | 1983-06-29 | 1983-06-29 | 低粘度エポキシ含浸樹脂の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11963483A JPS6011525A (ja) | 1983-06-29 | 1983-06-29 | 低粘度エポキシ含浸樹脂の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6011525A true JPS6011525A (ja) | 1985-01-21 |
| JPS6257649B2 JPS6257649B2 (enrdf_load_stackoverflow) | 1987-12-02 |
Family
ID=14766299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11963483A Granted JPS6011525A (ja) | 1983-06-29 | 1983-06-29 | 低粘度エポキシ含浸樹脂の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6011525A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006022693A1 (en) * | 2004-08-05 | 2006-03-02 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
| US7247683B2 (en) | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
| US8053587B2 (en) | 2000-03-31 | 2011-11-08 | Henkel Corporation | Reworkable thermosetting resin composition |
-
1983
- 1983-06-29 JP JP11963483A patent/JPS6011525A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8053587B2 (en) | 2000-03-31 | 2011-11-08 | Henkel Corporation | Reworkable thermosetting resin composition |
| WO2006022693A1 (en) * | 2004-08-05 | 2006-03-02 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
| US7247683B2 (en) | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6257649B2 (enrdf_load_stackoverflow) | 1987-12-02 |
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