JPS6011525A - 低粘度エポキシ含浸樹脂の製造法 - Google Patents
低粘度エポキシ含浸樹脂の製造法Info
- Publication number
- JPS6011525A JPS6011525A JP11963483A JP11963483A JPS6011525A JP S6011525 A JPS6011525 A JP S6011525A JP 11963483 A JP11963483 A JP 11963483A JP 11963483 A JP11963483 A JP 11963483A JP S6011525 A JPS6011525 A JP S6011525A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- parts
- resin
- viscosity
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000003822 epoxy resin Substances 0.000 title description 3
- 229920000647 polyepoxide Polymers 0.000 title description 3
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 239000004593 Epoxy Substances 0.000 claims abstract description 25
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- 239000000203 mixture Substances 0.000 claims abstract description 15
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 claims abstract description 15
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 14
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 14
- -1 cyclic acid anhydride Chemical class 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical group C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 2
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 claims description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 2
- BQQUFAMSJAKLNB-UHFFFAOYSA-N dicyclopentadiene diepoxide Chemical compound C12C(C3OC33)CC3C2CC2C1O2 BQQUFAMSJAKLNB-UHFFFAOYSA-N 0.000 claims description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 2
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 4
- HJEORQYOUWYAMR-UHFFFAOYSA-N 2-[(2-butylphenoxy)methyl]oxirane Chemical compound CCCCC1=CC=CC=C1OCC1OC1 HJEORQYOUWYAMR-UHFFFAOYSA-N 0.000 abstract description 3
- XOQUTYDTROZTID-UHFFFAOYSA-N 2-[(4-tert-butylphenyl)-[(4-tert-butylphenyl)-(oxiran-2-yl)methoxy]methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1C(C1OC1)OC(C=1C=CC(=CC=1)C(C)(C)C)C1OC1 XOQUTYDTROZTID-UHFFFAOYSA-N 0.000 abstract description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 8
- 150000008065 acid anhydrides Chemical class 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 206010040880 Skin irritation Diseases 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003085 diluting agent Substances 0.000 description 5
- 230000036556 skin irritation Effects 0.000 description 5
- 231100000475 skin irritation Toxicity 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- 230000004580 weight loss Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 3
- OJVQNVMHJWSOSY-UHFFFAOYSA-N 3-methylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(O)=O)(C)C2C(O)=O OJVQNVMHJWSOSY-UHFFFAOYSA-N 0.000 description 2
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 206010061218 Inflammation Diseases 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 230000004054 inflammatory process Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11963483A JPS6011525A (ja) | 1983-06-29 | 1983-06-29 | 低粘度エポキシ含浸樹脂の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11963483A JPS6011525A (ja) | 1983-06-29 | 1983-06-29 | 低粘度エポキシ含浸樹脂の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6011525A true JPS6011525A (ja) | 1985-01-21 |
| JPS6257649B2 JPS6257649B2 (enrdf_load_stackoverflow) | 1987-12-02 |
Family
ID=14766299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11963483A Granted JPS6011525A (ja) | 1983-06-29 | 1983-06-29 | 低粘度エポキシ含浸樹脂の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6011525A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006022693A1 (en) * | 2004-08-05 | 2006-03-02 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
| US7247683B2 (en) | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
| US8053587B2 (en) | 2000-03-31 | 2011-11-08 | Henkel Corporation | Reworkable thermosetting resin composition |
-
1983
- 1983-06-29 JP JP11963483A patent/JPS6011525A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8053587B2 (en) | 2000-03-31 | 2011-11-08 | Henkel Corporation | Reworkable thermosetting resin composition |
| WO2006022693A1 (en) * | 2004-08-05 | 2006-03-02 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
| US7247683B2 (en) | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6257649B2 (enrdf_load_stackoverflow) | 1987-12-02 |
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