JPS60113451A - 半導体パツケ−ジ - Google Patents

半導体パツケ−ジ

Info

Publication number
JPS60113451A
JPS60113451A JP22264383A JP22264383A JPS60113451A JP S60113451 A JPS60113451 A JP S60113451A JP 22264383 A JP22264383 A JP 22264383A JP 22264383 A JP22264383 A JP 22264383A JP S60113451 A JPS60113451 A JP S60113451A
Authority
JP
Japan
Prior art keywords
package
leads
ground
lead
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22264383A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0160949B2 (enrdf_load_stackoverflow
Inventor
Takashi Kondo
隆 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP22264383A priority Critical patent/JPS60113451A/ja
Publication of JPS60113451A publication Critical patent/JPS60113451A/ja
Publication of JPH0160949B2 publication Critical patent/JPH0160949B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP22264383A 1983-11-24 1983-11-24 半導体パツケ−ジ Granted JPS60113451A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22264383A JPS60113451A (ja) 1983-11-24 1983-11-24 半導体パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22264383A JPS60113451A (ja) 1983-11-24 1983-11-24 半導体パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS60113451A true JPS60113451A (ja) 1985-06-19
JPH0160949B2 JPH0160949B2 (enrdf_load_stackoverflow) 1989-12-26

Family

ID=16785663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22264383A Granted JPS60113451A (ja) 1983-11-24 1983-11-24 半導体パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS60113451A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020113656A (ja) * 2019-01-11 2020-07-27 株式会社デンソー 電子装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020113656A (ja) * 2019-01-11 2020-07-27 株式会社デンソー 電子装置およびその製造方法

Also Published As

Publication number Publication date
JPH0160949B2 (enrdf_load_stackoverflow) 1989-12-26

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