JPS60111788A - レーザー加工装置 - Google Patents

レーザー加工装置

Info

Publication number
JPS60111788A
JPS60111788A JP59222317A JP22231784A JPS60111788A JP S60111788 A JPS60111788 A JP S60111788A JP 59222317 A JP59222317 A JP 59222317A JP 22231784 A JP22231784 A JP 22231784A JP S60111788 A JPS60111788 A JP S60111788A
Authority
JP
Japan
Prior art keywords
diaphragm
laser
laser processing
laser beam
resonator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59222317A
Other languages
English (en)
Japanese (ja)
Inventor
リノ　エー．クンツ
ウルス　ムルバツハ
エルンスト　フーバー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gretag AG
Original Assignee
Gretag AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4300314&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPS60111788(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gretag AG filed Critical Gretag AG
Publication of JPS60111788A publication Critical patent/JPS60111788A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0988—Diaphragms, spatial filters, masks for removing or filtering a part of the beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/005—Diaphragms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/007—Marks, e.g. trade marks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2301/00—Functional characteristics
    • H01S2301/20—Lasers with a special output beam profile or cross-section, e.g. non-Gaussian
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • H01S3/08018—Mode suppression
    • H01S3/0804—Transverse or lateral modes
    • H01S3/08045—Single-mode emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • H01S3/08018—Mode suppression
    • H01S3/0804—Transverse or lateral modes
    • H01S3/0805—Transverse or lateral modes by apertures, e.g. pin-holes or knife-edges

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Lasers (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Laser Beam Processing (AREA)
JP59222317A 1983-10-28 1984-10-24 レーザー加工装置 Pending JPS60111788A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH584883 1983-10-28
CH5848/83-1 1983-10-28

Publications (1)

Publication Number Publication Date
JPS60111788A true JPS60111788A (ja) 1985-06-18

Family

ID=4300314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59222317A Pending JPS60111788A (ja) 1983-10-28 1984-10-24 レーザー加工装置

Country Status (4)

Country Link
US (1) US4675500A (de)
EP (1) EP0143743B2 (de)
JP (1) JPS60111788A (de)
DE (1) DE3462568D1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990013390A1 (en) * 1989-05-08 1990-11-15 Fanuc Ltd Laser beam machining device

Families Citing this family (44)

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US4887019A (en) * 1985-09-11 1989-12-12 G. Rodenstock Instruments Gmbh Device for the generation of a laser beam spot of adjustable size
LU86927A1 (de) * 1987-06-19 1988-07-14 Europ Communities Kontinuierlich variables laserstrahl-daempfungsglied
US4910739A (en) * 1988-03-21 1990-03-20 Spectra-Physics Adjustable aperture
DE3914070A1 (de) * 1988-09-19 1990-03-29 Zeiss Carl Fa Laseranordnung mit ein- und ausschaltbarer frequenzkonversion
GB2228440A (en) * 1988-12-08 1990-08-29 Andrew Victor Polijanczuk Improvements to soldering by laser
DE3916264A1 (de) * 1989-05-18 1990-11-22 Diehl Gmbh & Co Einrichtung zur strahlfuehrung bei der laser-werkstueckbearbeitung
US4977575A (en) * 1989-08-24 1990-12-11 Spectra-Physics, Inc. Adjustable aperture comprising a shape memory alloy and laser using same
DE3930495C2 (de) * 1989-09-12 1996-11-07 Rofin Sinar Laser Gmbh Einrichtung zum Einstellen von Fokusdurchmesser und Fokuslage eines Laserstrahls
JPH03216287A (ja) * 1990-01-19 1991-09-24 Fanuc Ltd レーザ切断加工方法
DE4018006A1 (de) * 1990-06-05 1991-12-12 Baasel Carl Lasertech Laser mit modenblende
EP0599154A1 (de) * 1992-11-20 1994-06-01 Ascom Tech Ag Modulator für einen Lichtstrahl
US5455709A (en) * 1993-03-23 1995-10-03 Martin Marietta Corporation Total internal reflection spatial light modulation apparatus and method of fabrication thereof
JP3399590B2 (ja) * 1993-08-04 2003-04-21 富士通株式会社 配線の切断装置
US5444723A (en) * 1993-08-18 1995-08-22 Institut National D'optique Optical switch and Q-switched laser
AUPM316293A0 (en) * 1993-12-24 1994-07-28 Electro Optic Systems Pty Limited Improved laser cavity assembly
JP3159593B2 (ja) * 1994-02-28 2001-04-23 三菱電機株式会社 レーザ加工方法及びその装置
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
DE19549531B4 (de) * 1994-10-14 2007-12-13 Mitsubishi Denki K.K. Festkörperlaservorrichtung und Laserbearbeitungsvorrichtung
US5491319A (en) * 1994-12-19 1996-02-13 International Business Machines Corporation Laser ablation apparatus and method
WO1997016387A1 (fr) * 1995-11-03 1997-05-09 Anatoly Valentinovich Vasilev Procede de formation par laser d'une image dans des objets transparents
US5834094A (en) * 1996-09-30 1998-11-10 Surface Technologies Ltd. Bearing having micropores and design method thereof
US5808780A (en) * 1997-06-09 1998-09-15 Texas Instruments Incorporated Non-contacting micromechanical optical switch
US6926487B1 (en) 1998-04-28 2005-08-09 Rexam Ab Method and apparatus for manufacturing marked articles to be included in cans
JP3178524B2 (ja) * 1998-11-26 2001-06-18 住友重機械工業株式会社 レーザマーキング方法と装置及びマーキングされた部材
US6449081B1 (en) * 1999-06-16 2002-09-10 Canon Kabushiki Kaisha Optical element and optical device having it
US6479787B1 (en) * 1999-10-05 2002-11-12 Rexam Ab Laser unit and method for engraving articles to be included in cans
US6455806B1 (en) 2000-01-14 2002-09-24 Rexam Ab Arrangement for shaping and marking a target
US6872913B1 (en) 2000-01-14 2005-03-29 Rexam Ab Marking of articles to be included in cans
US6926456B1 (en) 2000-01-20 2005-08-09 Rexam Ab Guiding device for a marking arrangement
US6341009B1 (en) 2000-02-24 2002-01-22 Quantronix Corporation Laser delivery system and method for photolithographic mask repair
US6576871B1 (en) 2000-04-03 2003-06-10 Rexam Ab Method and device for dust protection in a laser processing apparatus
DE10245617A1 (de) * 2002-09-30 2004-04-08 Eos Gmbh Electro Optical Systems Vorrichtung und Verfahren zum schichtweisen Herstellen von dreidimensionalen Objekten
EP1498213B1 (de) * 2003-07-18 2008-10-22 TRUMPF Laser GmbH + Co. KG Laserbearbeitungsmaschine mit Modulator zum Verändern der Laserleistung
US7645300B2 (en) 2004-02-02 2010-01-12 Visiogen, Inc. Injector for intraocular lens system
DE102004027621A1 (de) * 2004-06-05 2006-01-12 Rehau Ag + Co. Laserstrahlmarkiervorrichtung, Laserstrahlmarkierverfahren sowie Verwendung einer Laserstrahlmarkiervorrichtung
US7249855B2 (en) * 2004-12-21 2007-07-31 Hewlett-Packard Development Company, L.P. System and method of image enhancement through light intensity modulation in digital projectors
US20090096997A1 (en) * 2005-11-09 2009-04-16 Mark Alan Schultz Optical Seaming Adjuster
US20070211352A1 (en) * 2006-03-09 2007-09-13 Nikon Corporation Aperture changing apparatus and method
JP4847201B2 (ja) 2006-04-27 2011-12-28 株式会社リコー 光源システム、光走査装置、画像形成装置、光量制御方法、光走査方法、及び画像形成方法
US20080169273A1 (en) * 2007-01-12 2008-07-17 Nickolas Bizzio Laser cavity particularly for laser welding apparatus
CN101862901A (zh) * 2010-06-21 2010-10-20 苏州市博海激光科技有限公司 聚焦光点无规则偏转的激光辊类表面毛化加工方法及装置
US8598488B2 (en) * 2011-12-23 2013-12-03 Electro Scientific Industries, Inc. Method and apparatus for adjusting radiation spot size
JP5964621B2 (ja) * 2012-03-16 2016-08-03 株式会社ディスコ レーザー加工装置
JP6306659B1 (ja) * 2016-10-19 2018-04-04 ファナック株式会社 ビーム分配器

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US3500240A (en) * 1964-11-30 1970-03-10 Us Navy Simple traveling wave laser using total - internal - reflection resonator
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US4032861A (en) * 1973-11-15 1977-06-28 Union Carbide Corporation Laser device for altering surfaces in accordance with given patterns
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JPS5368499A (en) * 1976-11-30 1978-06-17 Komatsu Ltd Method of shaping laser beam used for machining
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DE3013302A1 (de) 1980-04-05 1981-10-08 Eltro GmbH, Gesellschaft für Strahlungstechnik, 6900 Heidelberg Wellenleiterlaser mit frustrationselement
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990013390A1 (en) * 1989-05-08 1990-11-15 Fanuc Ltd Laser beam machining device

Also Published As

Publication number Publication date
DE3462568D1 (en) 1987-04-09
EP0143743B1 (de) 1987-03-04
US4675500A (en) 1987-06-23
EP0143743B2 (de) 1991-03-13
EP0143743A1 (de) 1985-06-05

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