JPS60111446A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60111446A
JPS60111446A JP21912883A JP21912883A JPS60111446A JP S60111446 A JPS60111446 A JP S60111446A JP 21912883 A JP21912883 A JP 21912883A JP 21912883 A JP21912883 A JP 21912883A JP S60111446 A JPS60111446 A JP S60111446A
Authority
JP
Japan
Prior art keywords
melting point
wiring board
metal
temperature
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21912883A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6355215B2 (enrdf_load_stackoverflow
Inventor
Yoshitaka Fukuoka
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21912883A priority Critical patent/JPS60111446A/ja
Publication of JPS60111446A publication Critical patent/JPS60111446A/ja
Publication of JPS6355215B2 publication Critical patent/JPS6355215B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP21912883A 1983-11-21 1983-11-21 半導体装置 Granted JPS60111446A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21912883A JPS60111446A (ja) 1983-11-21 1983-11-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21912883A JPS60111446A (ja) 1983-11-21 1983-11-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS60111446A true JPS60111446A (ja) 1985-06-17
JPS6355215B2 JPS6355215B2 (enrdf_load_stackoverflow) 1988-11-01

Family

ID=16730674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21912883A Granted JPS60111446A (ja) 1983-11-21 1983-11-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS60111446A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100370231B1 (ko) * 2000-06-13 2003-01-29 페어차일드코리아반도체 주식회사 리드프레임의 배면에 직접 부착되는 절연방열판을구비하는 전력 모듈 패키지
JP2004311820A (ja) * 2003-04-09 2004-11-04 Mitsubishi Electric Corp 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100370231B1 (ko) * 2000-06-13 2003-01-29 페어차일드코리아반도체 주식회사 리드프레임의 배면에 직접 부착되는 절연방열판을구비하는 전력 모듈 패키지
JP2004311820A (ja) * 2003-04-09 2004-11-04 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPS6355215B2 (enrdf_load_stackoverflow) 1988-11-01

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