JPS60111065U - Mounting structure of electronic components - Google Patents

Mounting structure of electronic components

Info

Publication number
JPS60111065U
JPS60111065U JP20478783U JP20478783U JPS60111065U JP S60111065 U JPS60111065 U JP S60111065U JP 20478783 U JP20478783 U JP 20478783U JP 20478783 U JP20478783 U JP 20478783U JP S60111065 U JPS60111065 U JP S60111065U
Authority
JP
Japan
Prior art keywords
mounting structure
electronic components
circuit board
hole
film resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20478783U
Other languages
Japanese (ja)
Other versions
JPH0113427Y2 (en
Inventor
本庄　正秀
Original Assignee
カシオ計算機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by カシオ計算機株式会社 filed Critical カシオ計算機株式会社
Priority to JP20478783U priority Critical patent/JPS60111065U/en
Publication of JPS60111065U publication Critical patent/JPS60111065U/en
Application granted granted Critical
Publication of JPH0113427Y2 publication Critical patent/JPH0113427Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は従来品の縦断側面図、第３図は本
考案の一実施例を示す縦断側面図、第４図ａないしｇは
加工手順に従って本考案の取付構造を示す縦断側面図、
第５図は別の実施例の縦断側面図である。 １６・・・回路基板、１７・・・貫通孔、１８．１９・
・・電極パターン、２０．２１・・・感光性フィルムレ
ジスト、２２．２３・・・マスク部材、２４・・・メッ
キ、２５・・・電子部品、２６・・・半田、２７・・・
コイルスプリング、２８・・・ワイヤ、２９・・・封止
樹脂。Figures 1 and 2 are vertical side views of the conventional product, Figure 3 is a vertical side view showing an embodiment of the present invention, and Figures 4 a to g are vertical side views showing the mounting structure of the present invention according to the processing procedure. figure,
FIG. 5 is a longitudinal sectional side view of another embodiment. 16... Circuit board, 17... Through hole, 18.19.
...Electrode pattern, 20.21...Photosensitive film resist, 22.23...Mask member, 24...Plating, 25...Electronic component, 26...Solder, 27...
Coil spring, 28... wire, 29... sealing resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 貫通孔が形成された回路基板と、この回路基板の前記貫
通孔の一方の開口部を覆うようにして取付けられた感光
性フィルムレジストと、前記回路基板の前記貫通孔内に
配置された前記感光性フィルムレジスト上に載設される
電子部品とを具備したことを特徴とする電子部品の取付
構造。a circuit board in which a through hole is formed; a photosensitive film resist attached to cover one opening of the through hole of the circuit board; and a photosensitive film resist disposed in the through hole of the circuit board. 1. A mounting structure for an electronic component, comprising: an electronic component mounted on a transparent film resist.
JP20478783U 1983-12-28 1983-12-28 Mounting structure of electronic components Granted JPS60111065U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20478783U JPS60111065U (en) 1983-12-28 1983-12-28 Mounting structure of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20478783U JPS60111065U (en) 1983-12-28 1983-12-28 Mounting structure of electronic components

Publications (2)

Publication Number Publication Date
JPS60111065U true JPS60111065U (en) 1985-07-27
JPH0113427Y2 JPH0113427Y2 (en) 1989-04-19

Family

ID=30767175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20478783U Granted JPS60111065U (en) 1983-12-28 1983-12-28 Mounting structure of electronic components

Country Status (1)

Country Link
JP (1) JPS60111065U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5669888U (en) * 1979-10-31 1981-06-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5669888U (en) * 1979-10-31 1981-06-09

Also Published As

Publication number Publication date
JPH0113427Y2 (en) 1989-04-19

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