JPS60103869U - Mounting structure of electronic components - Google Patents
Mounting structure of electronic componentsInfo
- Publication number
- JPS60103869U JPS60103869U JP19508683U JP19508683U JPS60103869U JP S60103869 U JPS60103869 U JP S60103869U JP 19508683 U JP19508683 U JP 19508683U JP 19508683 U JP19508683 U JP 19508683U JP S60103869 U JPS60103869 U JP S60103869U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- electronic components
- circuit board
- hole
- film resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図および第２図は従来品の縦断側面図、第３図は本
考案の一実施例を示す縦断側面図、第４図ａないしｇは
加工手順に従って本考案の取付構造を示す縦断側面図、
第５図は別の実施例の縦断側面図である。
１６・・・・・・回路基板、１７・・・・・・貫通孔、
１８，１９・・・・・・電極パターン、２０．２１・・
・・・・感光性フィルムレジスト、２２，２３・・・・
・・マスク部材、２４・・・・・・メッキ、２５・・・
・・・電子部品、２６・・・・・・半田、２７・・・・
・・コイルスプリング、２８・・曲ワイヤ、２９・・・
・・・封止樹脂。
１３回
茅５回Figures 1 and 2 are vertical side views of the conventional product, Figure 3 is a vertical side view showing an embodiment of the present invention, and Figures 4 a to g are vertical side views showing the mounting structure of the present invention according to the processing procedure. figure,
FIG. 5 is a longitudinal sectional side view of another embodiment. 16... Circuit board, 17... Through hole,
18, 19... Electrode pattern, 20.21...
...Photosensitive film resist, 22,23...
...Mask member, 24...Plating, 25...
...electronic parts, 26...solder, 27...
...Coil spring, 28...Curved wire, 29...
...Sealing resin. 13 times Kaya 5 times
Claims (1)
通孔の一方の開口部を覆うようにして取付けられた感光
性フィルムレジストと、前記回路基板の前記貫通孔内に
配置され前記感光性フィルムレジスト上に載設される電
子部品とを具備したことを特徴とする電子部品の取付構
造。a circuit board in which a through hole is formed; a photosensitive film resist attached to cover one opening of the through hole of the circuit board; and a photosensitive film resist disposed in the through hole of the circuit board. An electronic component mounting structure characterized by comprising an electronic component mounted on a film resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19508683U JPS60103869U (en) | 1983-12-19 | 1983-12-19 | Mounting structure of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19508683U JPS60103869U (en) | 1983-12-19 | 1983-12-19 | Mounting structure of electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60103869U true JPS60103869U (en) | 1985-07-15 |
Family
ID=30419116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19508683U Pending JPS60103869U (en) | 1983-12-19 | 1983-12-19 | Mounting structure of electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60103869U (en) |
-
1983
- 1983-12-19 JP JP19508683U patent/JPS60103869U/en active Pending
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