JPS606240U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS606240U JPS606240U JP9901883U JP9901883U JPS606240U JP S606240 U JPS606240 U JP S606240U JP 9901883 U JP9901883 U JP 9901883U JP 9901883 U JP9901883 U JP 9901883U JP S606240 U JPS606240 U JP S606240U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- metal plate
- wiring board
- hole
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置の断面図、第２図は薄形化の
原理を説明するための外装ケース付きの半導体装置の断
面図、第３図は本考案の一実施例の断面図である。
１・・・・・・絶縁基板、２．３・・・・・・導電パタ
ーン、４゜１５・・・・・・素子搭載部穴、５・・・・
・・金属板、６．８・・・・・・半導体素子、７，９・
・・・・・封止樹脂（体）、１０・・・・・・金属細線
、１１．１２・・・・・・外装ケース板、１３．１４・
・・・・・他の電子部品、１６・・・・・・段部。Fig. 1 is a sectional view of a conventional semiconductor device, Fig. 2 is a sectional view of a semiconductor device with an outer case for explaining the principle of thinning, and Fig. 3 is a sectional view of an embodiment of the present invention. be. 1... Insulating board, 2.3... Conductive pattern, 4゜15... Element mounting hole, 5...
...Metal plate, 6.8...Semiconductor element, 7,9.
... Sealing resin (body), 10 ... Metal thin wire, 11.12 ... Exterior case plate, 13.14.
...Other electronic components, 16...Stepped section.
Claims (1)
覆って金属板が取付けられ、この金属板の表裏両面に半
導体素子を搭載してなる半導体装置において、前記穴内
壁に前記金属板の周辺が固定される段部が設けられ、こ
の段部の高さを変えることにより、前記半導体素子を封
止した封止樹脂体の前記プリント配線基板の表裏面のそ
れぞれからの高さが変えられるようにされていることを
特徴とする半導体装置。In a semiconductor device in which a printed wiring board has a hole in an element mounting portion, a metal plate is attached to cover the hole, and semiconductor elements are mounted on both the front and back surfaces of the metal plate, the metal plate is mounted on the inner wall of the hole. A stepped portion is provided to which the periphery of the printed wiring board is fixed, and by changing the height of the stepped portion, the height of the sealing resin body in which the semiconductor element is sealed from each of the front and back surfaces of the printed wiring board is changed. A semiconductor device characterized in that the semiconductor device is configured to be
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9901883U JPS606240U (en) | 1983-06-27 | 1983-06-27 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9901883U JPS606240U (en) | 1983-06-27 | 1983-06-27 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS606240U true JPS606240U (en) | 1985-01-17 |
Family
ID=30234836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9901883U Pending JPS606240U (en) | 1983-06-27 | 1983-06-27 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS606240U (en) |
-
1983
- 1983-06-27 JP JP9901883U patent/JPS606240U/en active Pending
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