JPS59132681U - Microwave integrated circuit mounting structure - Google Patents
Microwave integrated circuit mounting structureInfo
- Publication number
- JPS59132681U JPS59132681U JP2666483U JP2666483U JPS59132681U JP S59132681 U JPS59132681 U JP S59132681U JP 2666483 U JP2666483 U JP 2666483U JP 2666483 U JP2666483 U JP 2666483U JP S59132681 U JPS59132681 U JP S59132681U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- microwave integrated
- mounting structure
- circuit mounting
- subcarrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図は従来のＭＩＣ実装構造の断面図、第３
図、第４図は本考案の実施例の正面図およびそのＡ−Ａ
線における断面図である。図において
１・・・ＭＩＣ基板、２・・・（導体）回路、３・・・
接地導体、４・・・金ワイヤ−，５・・・スルーホール
、６・・・サブキャリア、７・・・導電性接合材、８・
・・金属板、９・・・導電性接合材、１０・・・外囲筐
体、である。Figures 1 and 2 are cross-sectional views of conventional MIC mounting structures;
Figure 4 is a front view of the embodiment of the present invention and its A-A
FIG. In the figure, 1... MIC board, 2... (conductor) circuit, 3...
Ground conductor, 4... Gold wire, 5... Through hole, 6... Subcarrier, 7... Conductive bonding material, 8...
. . . metal plate, 9 . . . conductive bonding material, 10 . . . outer enclosure.
Claims (1)
板を収容できる凹部を有するサブキャリアと、このサブ
キャリアを固定する外囲筐体とを備え、前記サブキャリ
ア凹部の突出部と前記マイクロ波集積基板上の回路とを
薄い金属板により接合したことを特徴とするマイクロ波
集積回路の実装構造。A microwave integrated circuit board, a subcarrier having a recess capable of accommodating the microwave integrated circuit board, and an outer housing for fixing the subcarrier, the protrusion of the subcarrier recess and the microwave integrated circuit board. A mounting structure for a microwave integrated circuit characterized by joining the circuit above with a thin metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2666483U JPS59132681U (en) | 1983-02-25 | 1983-02-25 | Microwave integrated circuit mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2666483U JPS59132681U (en) | 1983-02-25 | 1983-02-25 | Microwave integrated circuit mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59132681U true JPS59132681U (en) | 1984-09-05 |
Family
ID=30157572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2666483U Pending JPS59132681U (en) | 1983-02-25 | 1983-02-25 | Microwave integrated circuit mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59132681U (en) |
-
1983
- 1983-02-25 JP JP2666483U patent/JPS59132681U/en active Pending
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