JPS60110869A - 真空成膜用導電性マスキング材 - Google Patents
真空成膜用導電性マスキング材Info
- Publication number
- JPS60110869A JPS60110869A JP21850683A JP21850683A JPS60110869A JP S60110869 A JPS60110869 A JP S60110869A JP 21850683 A JP21850683 A JP 21850683A JP 21850683 A JP21850683 A JP 21850683A JP S60110869 A JPS60110869 A JP S60110869A
- Authority
- JP
- Japan
- Prior art keywords
- masking material
- film formation
- conductive
- vacuum film
- weight ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21850683A JPS60110869A (ja) | 1983-11-18 | 1983-11-18 | 真空成膜用導電性マスキング材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21850683A JPS60110869A (ja) | 1983-11-18 | 1983-11-18 | 真空成膜用導電性マスキング材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60110869A true JPS60110869A (ja) | 1985-06-17 |
| JPS6315344B2 JPS6315344B2 (enrdf_load_stackoverflow) | 1988-04-04 |
Family
ID=16720989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21850683A Granted JPS60110869A (ja) | 1983-11-18 | 1983-11-18 | 真空成膜用導電性マスキング材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60110869A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007003572A3 (de) * | 2005-07-01 | 2007-04-26 | Siemens Ag | Verfahren zum abscheiden eines materials in ein loch in einem elektrisch leitenden werkstück |
| JP2012140644A (ja) * | 2009-12-04 | 2012-07-26 | Siemens Ag | マスキング材料、マスキング層、基板のマスキング方法および基板の被覆方法 |
-
1983
- 1983-11-18 JP JP21850683A patent/JPS60110869A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007003572A3 (de) * | 2005-07-01 | 2007-04-26 | Siemens Ag | Verfahren zum abscheiden eines materials in ein loch in einem elektrisch leitenden werkstück |
| JP2012140644A (ja) * | 2009-12-04 | 2012-07-26 | Siemens Ag | マスキング材料、マスキング層、基板のマスキング方法および基板の被覆方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6315344B2 (enrdf_load_stackoverflow) | 1988-04-04 |
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