JPS60109184A - 車載用電子機器と外部機器との接続方法 - Google Patents
車載用電子機器と外部機器との接続方法Info
- Publication number
- JPS60109184A JPS60109184A JP58217289A JP21728983A JPS60109184A JP S60109184 A JPS60109184 A JP S60109184A JP 58217289 A JP58217289 A JP 58217289A JP 21728983 A JP21728983 A JP 21728983A JP S60109184 A JPS60109184 A JP S60109184A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- parts
- connection terminal
- electronic device
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 235000009300 Ehretia acuminata Nutrition 0.000 claims 1
- 244000046038 Ehretia acuminata Species 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58217289A JPS60109184A (ja) | 1983-11-18 | 1983-11-18 | 車載用電子機器と外部機器との接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58217289A JPS60109184A (ja) | 1983-11-18 | 1983-11-18 | 車載用電子機器と外部機器との接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60109184A true JPS60109184A (ja) | 1985-06-14 |
| JPH0139194B2 JPH0139194B2 (enrdf_load_stackoverflow) | 1989-08-18 |
Family
ID=16701799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58217289A Granted JPS60109184A (ja) | 1983-11-18 | 1983-11-18 | 車載用電子機器と外部機器との接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60109184A (enrdf_load_stackoverflow) |
-
1983
- 1983-11-18 JP JP58217289A patent/JPS60109184A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0139194B2 (enrdf_load_stackoverflow) | 1989-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4907991A (en) | Connective jumper | |
| KR910007103B1 (ko) | 도선형성 및 도선 없는 부품에 도선을 접착시키는 방법 | |
| US4417296A (en) | Method of connecting surface mounted packages to a circuit board and the resulting connector | |
| JPH0773152B2 (ja) | 電子パッケージおよびその作成方法 | |
| EP1058306B1 (en) | Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same | |
| JP2001168131A (ja) | 薄型相互接続構造 | |
| JPS60109184A (ja) | 車載用電子機器と外部機器との接続方法 | |
| JPH07312474A (ja) | 電子部品の搭載構造 | |
| JPH0738225A (ja) | 半導体装置及びその製造方法 | |
| JPS60254695A (ja) | 高密度実装構造 | |
| JPH0922960A (ja) | マルチチップモジュール装置とその製造方法 | |
| JPS6262533A (ja) | 半導体素子の高密度実装方法 | |
| JPH0125228B2 (enrdf_load_stackoverflow) | ||
| JPS6020930Y2 (ja) | 両面冷却形半導体装置 | |
| JPH0263111A (ja) | チップ電子部品の製造方法 | |
| JPH01191491A (ja) | 多重回路板 | |
| JPH0680891B2 (ja) | フレキシブルプリント回路の接続方法 | |
| JPS63220558A (ja) | 高密度集積素子用終端抵抗の実装，配線方法 | |
| JPS61183880A (ja) | フレキシブル基板と他の基板等との熱圧着接続方法 | |
| JPS63177582A (ja) | 混成集積回路装置の製造方法 | |
| JPS5999787A (ja) | 厚膜配線基板 | |
| JPH0344945A (ja) | 半導体装置の実装体およびその実装方法 | |
| JPS6079754A (ja) | 半導体素子搭載用基板 | |
| JPH04270066A (ja) | はんだ付方法 | |
| JPS63246899A (ja) | 半導体素子搭載用多層配線板 |