JPS5998186A - 剥離シ−ト - Google Patents

剥離シ−ト

Info

Publication number
JPS5998186A
JPS5998186A JP57207504A JP20750482A JPS5998186A JP S5998186 A JPS5998186 A JP S5998186A JP 57207504 A JP57207504 A JP 57207504A JP 20750482 A JP20750482 A JP 20750482A JP S5998186 A JPS5998186 A JP S5998186A
Authority
JP
Japan
Prior art keywords
sheet
release agent
acrylic resin
release
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57207504A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6354035B2 (enrdf_load_stackoverflow
Inventor
Yukio Hosoda
細田　幸男
Mitsutoshi Saito
斉藤　充利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Oji Paper Co Ltd
Original Assignee
Oji Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oji Paper Co Ltd filed Critical Oji Paper Co Ltd
Priority to JP57207504A priority Critical patent/JPS5998186A/ja
Publication of JPS5998186A publication Critical patent/JPS5998186A/ja
Publication of JPS6354035B2 publication Critical patent/JPS6354035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Adhesive Tapes (AREA)
JP57207504A 1982-11-29 1982-11-29 剥離シ−ト Granted JPS5998186A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57207504A JPS5998186A (ja) 1982-11-29 1982-11-29 剥離シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57207504A JPS5998186A (ja) 1982-11-29 1982-11-29 剥離シ−ト

Publications (2)

Publication Number Publication Date
JPS5998186A true JPS5998186A (ja) 1984-06-06
JPS6354035B2 JPS6354035B2 (enrdf_load_stackoverflow) 1988-10-26

Family

ID=16540809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57207504A Granted JPS5998186A (ja) 1982-11-29 1982-11-29 剥離シ−ト

Country Status (1)

Country Link
JP (1) JPS5998186A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6375199A (ja) * 1986-09-10 1988-04-05 新王子製紙株式会社 剥離紙
JPH01156598A (ja) * 1987-12-11 1989-06-20 Kanzaki Paper Mfg Co Ltd 剥離紙
JPH02501871A (ja) * 1986-11-13 1990-06-21 ジヨンストン，ジエイムズ・エイ 印刷回路板を製造する方法および装置
JPH0417603A (ja) * 1990-05-09 1992-01-22 Honda Motor Co Ltd スリップキャスティング製法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5089431A (enrdf_load_stackoverflow) * 1973-12-13 1975-07-17
JPS5442410A (en) * 1977-09-06 1979-04-04 Koyo Sangyo Co Production of release paper
JPS5488392A (en) * 1977-12-20 1979-07-13 Mitsui Toatsu Chemicals Coating finish composition
JPS5761061A (en) * 1980-09-30 1982-04-13 Nitto Electric Ind Co Ltd Peelable film-forming material
JPS57105432A (en) * 1980-12-22 1982-06-30 Asahi Chem Ind Co Ltd Aqueous dispersion

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5089431A (enrdf_load_stackoverflow) * 1973-12-13 1975-07-17
JPS5442410A (en) * 1977-09-06 1979-04-04 Koyo Sangyo Co Production of release paper
JPS5488392A (en) * 1977-12-20 1979-07-13 Mitsui Toatsu Chemicals Coating finish composition
JPS5761061A (en) * 1980-09-30 1982-04-13 Nitto Electric Ind Co Ltd Peelable film-forming material
JPS57105432A (en) * 1980-12-22 1982-06-30 Asahi Chem Ind Co Ltd Aqueous dispersion

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6375199A (ja) * 1986-09-10 1988-04-05 新王子製紙株式会社 剥離紙
JPH02501871A (ja) * 1986-11-13 1990-06-21 ジヨンストン，ジエイムズ・エイ 印刷回路板を製造する方法および装置
JPH01156598A (ja) * 1987-12-11 1989-06-20 Kanzaki Paper Mfg Co Ltd 剥離紙
JPH0417603A (ja) * 1990-05-09 1992-01-22 Honda Motor Co Ltd スリップキャスティング製法

Also Published As

Publication number Publication date
JPS6354035B2 (enrdf_load_stackoverflow) 1988-10-26

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