JPS5994435A - 真空処理装置 - Google Patents

真空処理装置

Info

Publication number
JPS5994435A
JPS5994435A JP57204413A JP20441382A JPS5994435A JP S5994435 A JPS5994435 A JP S5994435A JP 57204413 A JP57204413 A JP 57204413A JP 20441382 A JP20441382 A JP 20441382A JP S5994435 A JPS5994435 A JP S5994435A
Authority
JP
Japan
Prior art keywords
wafer
chamber
arm
vacuum
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57204413A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6233745B2 (member.php
Inventor
Hidetaka Jo
城　英孝
Noboru Kuriyama
昇 栗山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuda Seisakusho Co Ltd
Original Assignee
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuda Seisakusho Co Ltd filed Critical Tokuda Seisakusho Co Ltd
Priority to JP57204413A priority Critical patent/JPS5994435A/ja
Publication of JPS5994435A publication Critical patent/JPS5994435A/ja
Publication of JPS6233745B2 publication Critical patent/JPS6233745B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/0466—

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP57204413A 1982-11-20 1982-11-20 真空処理装置 Granted JPS5994435A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57204413A JPS5994435A (ja) 1982-11-20 1982-11-20 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57204413A JPS5994435A (ja) 1982-11-20 1982-11-20 真空処理装置

Publications (2)

Publication Number Publication Date
JPS5994435A true JPS5994435A (ja) 1984-05-31
JPS6233745B2 JPS6233745B2 (member.php) 1987-07-22

Family

ID=16490125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57204413A Granted JPS5994435A (ja) 1982-11-20 1982-11-20 真空処理装置

Country Status (1)

Country Link
JP (1) JPS5994435A (member.php)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230128A (ja) * 1988-05-18 1990-01-31 Veeco Instr Inc 基板移送及び冷却方法、並びにその方法を実施するための装置
JPH04226049A (ja) * 1985-10-24 1992-08-14 Texas Instr Inc <Ti> ウェーハ処理モジュールとウェーハ処理方法
US6446353B2 (en) 1990-08-29 2002-09-10 Hitachi, Ltd. Vacuum processing apparatus
US7132293B2 (en) 1989-02-27 2006-11-07 Hitachi, Ltd. Method and apparatus for processing samples
USRE39756E1 (en) 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39776E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04226049A (ja) * 1985-10-24 1992-08-14 Texas Instr Inc <Ti> ウェーハ処理モジュールとウェーハ処理方法
JPH0230128A (ja) * 1988-05-18 1990-01-31 Veeco Instr Inc 基板移送及び冷却方法、並びにその方法を実施するための装置
US7132293B2 (en) 1989-02-27 2006-11-07 Hitachi, Ltd. Method and apparatus for processing samples
US6505415B2 (en) 1990-08-29 2003-01-14 Hitachi, Ltd. Vacuum processing apparatus
US6625899B2 (en) 1990-08-29 2003-09-30 Hitachi, Ltd. Vacuum processing apparatus
US6463678B2 (en) 1990-08-29 2002-10-15 Hitachi, Ltd. Substrate changing-over mechanism in a vaccum tank
US6467187B2 (en) 1990-08-29 2002-10-22 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6467186B2 (en) 1990-08-29 2002-10-22 Hitachi, Ltd. Transferring device for a vacuum processing apparatus and operating method therefor
US6470596B2 (en) 1990-08-29 2002-10-29 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6473989B2 (en) 1990-08-29 2002-11-05 Hitachi, Ltd. Conveying system for a vacuum processing apparatus
US6484415B2 (en) 1990-08-29 2002-11-26 Hitachi, Ltd. Vacuum processing apparatus
US6487794B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Substrate changing-over mechanism in vacuum tank
US6487791B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Vacuum processing apparatus
US6499229B2 (en) 1990-08-29 2002-12-31 Hitachi, Ltd. Vacuum processing apparatus
US6457253B2 (en) 1990-08-29 2002-10-01 Hitachi, Ltd. Vacuum processing apparatus
US6588121B2 (en) 1990-08-29 2003-07-08 Hitachi, Ltd. Vacuum processing apparatus
US6460270B2 (en) 1990-08-29 2002-10-08 Hitachi, Ltd. Vacuum processing apparatus
US6655044B2 (en) 1990-08-29 2003-12-02 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6880264B2 (en) 1990-08-29 2005-04-19 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6886272B2 (en) 1990-08-29 2005-05-03 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6904699B2 (en) 1990-08-29 2005-06-14 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6968630B2 (en) 1990-08-29 2005-11-29 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6446353B2 (en) 1990-08-29 2002-09-10 Hitachi, Ltd. Vacuum processing apparatus
USRE39756E1 (en) 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39776E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
USRE39775E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39823E1 (en) 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39824E1 (en) 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
US7367135B2 (en) 1990-08-29 2008-05-06 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor

Also Published As

Publication number Publication date
JPS6233745B2 (member.php) 1987-07-22

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