JPS5991171A - 接着剤組成物 - Google Patents
接着剤組成物Info
- Publication number
- JPS5991171A JPS5991171A JP20004682A JP20004682A JPS5991171A JP S5991171 A JPS5991171 A JP S5991171A JP 20004682 A JP20004682 A JP 20004682A JP 20004682 A JP20004682 A JP 20004682A JP S5991171 A JPS5991171 A JP S5991171A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- epoxy
- glycidyl
- adhesive
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20004682A JPS5991171A (ja) | 1982-11-15 | 1982-11-15 | 接着剤組成物 |
US06/467,207 US4465542A (en) | 1982-02-19 | 1983-02-17 | Adhesive composition |
EP19830300899 EP0087311B1 (en) | 1982-02-19 | 1983-02-21 | Adhesive compositions, method of making laminates using the composition, and laminates made thereby |
DE8383300899T DE3368434D1 (en) | 1982-02-19 | 1983-02-21 | Adhesive compositions, method of making laminates using the composition, and laminates made thereby |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20004682A JPS5991171A (ja) | 1982-11-15 | 1982-11-15 | 接着剤組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5991171A true JPS5991171A (ja) | 1984-05-25 |
JPH0321587B2 JPH0321587B2 (enrdf_load_stackoverflow) | 1991-03-25 |
Family
ID=16417920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20004682A Granted JPS5991171A (ja) | 1982-02-19 | 1982-11-15 | 接着剤組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5991171A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6460679A (en) * | 1987-08-28 | 1989-03-07 | Shinko Chem | Adhesive composition for bonding electronic component |
WO2000002091A1 (fr) * | 1998-07-07 | 2000-01-13 | Kansai Paint Co., Ltd. | Composition de resist de soudage a base d'eau |
JP2008183286A (ja) * | 2007-01-31 | 2008-08-14 | Toyota Boshoku Corp | シートカバーの端末係止構造 |
-
1982
- 1982-11-15 JP JP20004682A patent/JPS5991171A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6460679A (en) * | 1987-08-28 | 1989-03-07 | Shinko Chem | Adhesive composition for bonding electronic component |
WO2000002091A1 (fr) * | 1998-07-07 | 2000-01-13 | Kansai Paint Co., Ltd. | Composition de resist de soudage a base d'eau |
US6602651B1 (en) | 1998-07-07 | 2003-08-05 | Kansai Paint Co., Ltd. | Water-based solder resist composition |
JP2008183286A (ja) * | 2007-01-31 | 2008-08-14 | Toyota Boshoku Corp | シートカバーの端末係止構造 |
Also Published As
Publication number | Publication date |
---|---|
JPH0321587B2 (enrdf_load_stackoverflow) | 1991-03-25 |
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