JPS5990034A - Apparatus for inspecting material state - Google Patents

Apparatus for inspecting material state

Info

Publication number
JPS5990034A
JPS5990034A JP17295583A JP17295583A JPS5990034A JP S5990034 A JPS5990034 A JP S5990034A JP 17295583 A JP17295583 A JP 17295583A JP 17295583 A JP17295583 A JP 17295583A JP S5990034 A JPS5990034 A JP S5990034A
Authority
JP
Japan
Prior art keywords
wiring
circuit
pulse
output
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17295583A
Other languages
Japanese (ja)
Inventor
Kiyoshi Nakagawa
清 中川
Hiroyuki Ibe
伊部 宏幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17295583A priority Critical patent/JPS5990034A/en
Publication of JPS5990034A publication Critical patent/JPS5990034A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects

Abstract

PURPOSE:To inspect exactly a surface state of a material by supplying an electric signal outputted from a photoelectric converter corresponding to a pattern of a surface of a material to be inspected to two detection circuits having different threshold voltages to discriminate a pulse signal outputted from each detection circuit by a discriminating circuit. CONSTITUTION:If a defect 6 exists at wiring part of a printed board to be inspected and an unnecessary wiring material 7 exists at the part where the wiring should not be formed, the output signal of a photoelectric converting element 5 is shown as a figure (b). The output waveform of a detecting circuit A1 is shown as a figure (c) where pulse is generated at the part in which there are no defect 6 and no wiring due to low circuit Vth. Inversely the output waveform of the detecting circuit A2 is shown as a figure (e) where pulse is generated at the part in which there are no wiring and no wiring material 7 due to high Vth of the circuit. The output signal of the detecting circuit and the signal stored in the discriminating circuit are compared in each discriminating circuit B1, B2, and the output is sent to the display part. The output of a discriminating circuit C1 appears as the pulse indicating the existence of the defect 6 caused in the wiring 3 as shown in a figure (g).

Description

【発明の詳細な説明】 本発明は、物体状態検査装置、特に電子装置用の配線基
板、あるいは半導体素子等の外観検査装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for inspecting the condition of an object, and particularly to an apparatus for inspecting the appearance of wiring boards for electronic devices, semiconductor elements, and the like.

配線基板もしくは半導体素子の表面に形成された配線も
しくは電極のパターンを自動的に検査する1こめに、先
ず光電変換手段により上記配線もしくは電極パターンに
対応した電気信号が形成される。上記電気信号は、ディ
ジタル演算処理が可能となるように2値のパルス信号に
変換される。上記パルス信号が、上記配線もしくは電極
の基準パターンと対応したパルス信号と比較されること
により、上記基板もしくは半導体素子の表面に不所望に
残存している物及び配線もしくは電極の欠陥が検出され
ることになる。
When a wiring or electrode pattern formed on the surface of a wiring board or a semiconductor element is automatically inspected, an electric signal corresponding to the wiring or electrode pattern is first generated by photoelectric conversion means. The electrical signal is converted into a binary pulse signal to enable digital arithmetic processing. By comparing the pulse signal with a pulse signal corresponding to the reference pattern of the wiring or electrode, undesirable remaining objects on the surface of the substrate or semiconductor element and defects in the wiring or electrode are detected. It turns out.

上記のような検査において、上記パルス信号は上記配線
もしくは電極のパターンと正確に対応していることが必
要である。
In the above-mentioned inspection, it is necessary that the pulse signal corresponds accurately to the pattern of the wiring or electrode.

しかしながら、例えば第41!XI(a)のように表面
に。
However, for example, the 41st! on the surface as in XI(a).

傷のような欠陥61.62を含む配線6と、不要な配線
材料71.72が残っている基板2を走査することによ
って得られる電気信号は同図(b)のようになり、その
ためこの電気信号を1つのしきい値電圧V1hによって
2値化するのでは同図(C)のように比較的小さい欠陥
もしくは不要物に応答しないパルス信号しか得られない
ことが明らかになった。
The electrical signal obtained by scanning the wiring 6 containing defects such as scratches 61, 62 and the board 2 where unnecessary wiring material 71, 72 remains is as shown in the same figure (b). It has become clear that if the signal is binarized using one threshold voltage V1h, only a pulse signal that does not respond to relatively small defects or unnecessary objects can be obtained, as shown in FIG. 3(C).

従って本発明の1つの目的は、物体の表面状態を正確に
検査できる検査装置を提供することにあり、他の目的は
、表面に存在すべき物体および傷の存否ならびに存在す
べきでない不要物の存否を同時に検査できる検査装置を
提供することにある。
Therefore, one object of the present invention is to provide an inspection device that can accurately inspect the surface condition of an object, and another object of the present invention is to provide an inspection device that can accurately inspect the surface condition of an object. An object of the present invention is to provide an inspection device that can simultaneously inspect the presence or absence of an object.

本発明によると、被検査物体表面のパターンに応じて出
力される光電変換装置からの電気信号が低しきい値電圧
の検出回路と高しきい値電圧の検出回路に供給され、各
検出回路から出力されるパルス信号が判定回路によって
判定される。
According to the present invention, an electrical signal from a photoelectric conversion device output according to a pattern on the surface of an object to be inspected is supplied to a low threshold voltage detection circuit and a high threshold voltage detection circuit, and from each detection circuit. The output pulse signal is determined by a determination circuit.

以下本発明を実施例により説明する。The present invention will be explained below with reference to Examples.

第1図は本発明の一実施例を示すブロック図である。FIG. 1 is a block diagram showing one embodiment of the present invention.

同図において1は発光ランプ、2はガラスからなる配線
基板、3はCrからなる配線膜、4は拡大用光学レンズ
、5は光電変換素子である。上記発光ランプ1からの光
は配線基板2を通して光電変換素子1に照射される。基
板2はこの光線によって一定時間で全面的に走査される
In the figure, 1 is a light emitting lamp, 2 is a wiring board made of glass, 3 is a wiring film made of Cr, 4 is a magnifying optical lens, and 5 is a photoelectric conversion element. Light from the light emitting lamp 1 is irradiated onto the photoelectric conversion element 1 through the wiring board 2. The entire surface of the substrate 2 is scanned by this light beam in a certain period of time.

上記光電変換素子5は光の強弱をリニアに電圧の変化に
変換する。光電変換素子5から出力する電気信号は二つ
の検出回路A、、A2に印加される。この検出回路AI
と検出回路A2とはしきい値電圧■t11が異なるよう
に設定されている。すなわち検出回路A1のしきい値電
圧■thlは低く、検出回路A、のしぎい値電圧■th
2は高く設定されている。上記検出回路A、、A2の各
出力はそれぞれ判定回路B1とB、に印加される。この
判定回路B、、B2においては基準バター・ンを信号化
し1こものがメモリされている。そして、各判定回路B
、、B2において検出回路の出力信号と、メモリされた
基準パターンを示す信乞どを比較し、判定回路の出力を
表示部C,,C2に送る。
The photoelectric conversion element 5 linearly converts the intensity of light into a change in voltage. The electrical signal output from the photoelectric conversion element 5 is applied to two detection circuits A, , A2. This detection circuit AI
The threshold voltage t11 is set to be different between the detection circuit A2 and the detection circuit A2. That is, the threshold voltage ■thl of the detection circuit A1 is low, and the threshold voltage ■th of the detection circuit A1 is low.
2 is set high. The respective outputs of the detection circuits A, . . . A2 are applied to determination circuits B1 and B, respectively. In the judgment circuits B, B2, the reference pattern is converted into a signal and one signal is stored in memory. And each judgment circuit B
, , B2 compares the output signal of the detection circuit with the signal indicating the memorized reference pattern, and sends the output of the determination circuit to the display sections C, , C2.

第2図は配線基板の一部において光を走査させた場合に
おける各部に生じる信号を示したものである。例えば同
図(a)に示すように被検査配線基板の配線部分に欠陥
6があり、さらに配線が形成されるべきではない部分に
不要な配線拐料7がある場合、光電変換素子5の出力信
号は同図(blに示すようになる。そして、検出回路A
、の出力波形は、回路のvtllが低いため同図(cl
に示すように、欠陥6および配線の存在しない部分にお
いてパルスが発生したものとなる。逆に検出回路A2の
出力波形は、回路のvthが高いため同図(e)に示す
ように配線も不要な配線材料7もない部分においてパル
スが発生したものとなる。
FIG. 2 shows signals generated in each part when light is scanned over a part of the wiring board. For example, if there is a defect 6 in the wiring part of the wiring board to be inspected as shown in FIG. The signal becomes as shown in the same figure (bl).Then, the detection circuit A
The output waveform of , in the same figure (cl
As shown in FIG. 2, a pulse is generated in a portion where there is no defect 6 and no wiring. On the contrary, since the vth of the circuit is high, the output waveform of the detection circuit A2 is such that a pulse is generated in a portion where there is no wiring or unnecessary wiring material 7, as shown in FIG. 2(e).

そして、各判定回路1131.B2において、検出回路
の出力信号と判定回路内にメモリされた信号とを比較し
その出力を表示部に送る。そして判定回路C,の出力は
同図(g)に示す如く配線3に生ずる欠陥6の存在を示
すパルスとなって現われる。
Then, each determination circuit 1131. At B2, the output signal of the detection circuit is compared with the signal stored in the determination circuit, and the output is sent to the display section. The output of the determination circuit C appears as a pulse indicating the existence of a defect 6 occurring in the wiring 3, as shown in FIG. 3(g).

一方、判定回路C7の出力は同図(hlに示す如く不要
物7の存在を示すパルスとなって現われる。
On the other hand, the output of the determination circuit C7 appears as a pulse indicating the presence of the unnecessary substance 7, as shown in FIG.

このように、検出回路A、のVtblを、欠陥の全くな
い配線が存在する基板部分からの光を受けたときの光電
変換素子5の出力信号レベルよりやや高くし、検出回路
A2のvth2を配線材料が全く存在しない基板部分か
らの光を受けたときの光電変換素子5の出力信号レベル
よりやや低くしておくことにより、配線の欠陥の有無、
不要な配線材料その他の不要物の有無を判定することが
できる。
In this way, the Vtbl of the detection circuit A is set to be slightly higher than the output signal level of the photoelectric conversion element 5 when receiving light from the part of the board where wiring with no defects exists, and the Vth2 of the detection circuit A2 is set to By keeping the output signal level of the photoelectric conversion element 5 slightly lower than when receiving light from a part of the substrate where no material is present, it is possible to determine whether or not there are defects in the wiring.
It is possible to determine the presence or absence of unnecessary wiring materials and other unnecessary materials.

すなわち、本発明によれば、光電変換された電気信号を
、しきい値の異なる二つの検出回路に同時に印加し、そ
の出力をそれぞれ別個の判定回路内において、基準パタ
ーンを信号化したものと比較するので、一方においては
配線の欠陥の有無を、他方においては不要配線材料の有
無を表示する出力を生じる。したがって、その出力とし
て得られるパルスの幅から欠陥又は不要物の犬ぎさを判
断し、それが許容することができるものであるか否かを
判定することができる。そして、この場合、不要物が許
容することができない大ぎさのものであっても一般に修
正が可能である。
That is, according to the present invention, a photoelectrically converted electrical signal is simultaneously applied to two detection circuits with different threshold values, and the output is compared with a signal obtained from a reference pattern in separate judgment circuits. Therefore, outputs are produced that indicate the presence or absence of wiring defects on the one hand, and the presence or absence of unnecessary wiring material on the other hand. Therefore, it is possible to judge the harshness of defects or unnecessary objects from the width of the pulse obtained as the output, and to judge whether or not it is acceptable. In this case, even if the unnecessary items are of an unacceptable size, they can generally be corrected.

これに対し、一つの回路系で検査装置を構成した場合に
は、予め設定された一つのしきい値を越えるような信号
変化がない限り第4図に示すように、欠陥あるいは不要
物の存在を示す出力が生じない。したがって、微少な欠
陥、不要物についてはその存在を示す測定結果が得られ
ない。
On the other hand, when an inspection device is configured with a single circuit system, as shown in Figure 4, unless there is a signal change that exceeds one preset threshold, the presence of defects or unnecessary objects is detected. There is no output indicating this. Therefore, measurement results indicating the existence of minute defects and unnecessary objects cannot be obtained.

しかし、本発明のように、光電変換素子5の出力信号を
異なるしきい値の検出回路A、とA2に印加し、低レベ
ルの信号の有無と高レベルの信号の有無を別個に検出す
ることにより微少な欠陥。
However, as in the present invention, the output signal of the photoelectric conversion element 5 is applied to detection circuits A and A2 with different threshold values, and the presence or absence of a low-level signal and the presence or absence of a high-level signal are detected separately. Due to slight defects.

不要物の存在をも見逃すことはない。Don't overlook the existence of unnecessary items.

本発明は前記実施例以外に下記に示すような態様におい
ても実施することができる。
In addition to the embodiments described above, the present invention can also be implemented in the following embodiments.

つまり、基準パターンにおいて存在する配線相互間の最
小幅に対応するパルス幅よりもやや狭い幅のパルスを低
■thの検出回路A1の出力を受ける判定回路B、に記
憶させておき検査用の光を走査する。そして、判定回路
B、により記憶されたパルスより幅の狭いパルスが有る
か否かを検出するようにする。この場合、記憶されたパ
ルスより幅の狭いパルスがあるならば、基準パターンに
はないはずの配線の凹部即ち欠陥があることになる。
In other words, a pulse with a width slightly narrower than the pulse width corresponding to the minimum width between interconnections existing in the reference pattern is stored in the judgment circuit B that receives the output of the low ■th detection circuit A1, and the pulse is used as the inspection light. scan. Then, the determination circuit B detects whether there is a pulse whose width is narrower than the stored pulse. In this case, if there is a pulse narrower in width than the stored pulse, there is a recess or defect in the wiring that should not be present in the reference pattern.

同様に基準パターンにおいて存在する配線の最小幅に対
応するパルスよりもやや幅い幅のパルスを高Vtbの検
出回路A、の出力を受ける判定回路B2に記憶させてお
く。そしてメモリされたパルスよりも幅の狭い幅のパル
スがあるか否かを検出する。この場合、記憶されたパル
スよりも狭い幅のパルスがあるならば、基準パターンに
はない凸部すなわち不要物のあることになる。前述の実
施例によれば基準パターンと被検査配線基板との間に寸
法上の僅かな差異があると、その不一致によって、欠陥
、不要物の存在を示すパルス出力を生み、誤った表示を
するおそれがあるが、、この実施例によればそのような
おそれがない。この場合、X方向の全面走査を終えたの
ち、さらにX方向の全面走査をして、より完全な検査を
行う。
Similarly, a pulse having a width slightly wider than the pulse corresponding to the minimum width of the wiring existing in the reference pattern is stored in the determination circuit B2 that receives the output of the high Vtb detection circuit A. Then, it is detected whether there is a pulse whose width is narrower than the memorized pulse. In this case, if there is a pulse with a narrower width than the stored pulse, this means that there is a convex portion, that is, an unnecessary object that is not present in the reference pattern. According to the above-described embodiment, if there is a slight difference in dimensions between the reference pattern and the wiring board to be inspected, the mismatch will generate a pulse output indicating the presence of defects or unnecessary items, resulting in a false display. However, according to this embodiment, there is no such fear. In this case, after completing the entire surface scan in the X direction, a further full surface scan is performed in the X direction to perform a more complete inspection.

このように本発明は諸々の態様で実施することができる
As described above, the present invention can be implemented in various ways.

第3図は光電変換素子としてフォトダイオードアレイを
用い実施例を示したもので、このフォトダイオードアレ
イとシーケンス動作するスイッチング回路を用いて一定
長さにおける配線基板な極めて短時間に検出する。
FIG. 3 shows an embodiment using a photodiode array as a photoelectric conversion element, and a switching circuit operating in sequence with this photodiode array is used to detect a wiring board over a certain length in an extremely short time.

なお、本発明に係る検査装置により欠陥あるいは不要物
の有無のみならず、配緋幅、配線相互間幅についても基
準と一致しているか否かの検査をすることができる。ま
fこ、これら実施例は被検査物体の透過光を検出するも
のである。表面の配線と基板との反射率の相違を利用し
て反射光を検査用光線として用いることもできる。
It should be noted that the inspection apparatus according to the present invention can inspect not only the presence or absence of defects or unnecessary materials, but also whether or not the width of the wiring and the width between the wires match the standards. These embodiments detect transmitted light of an object to be inspected. The reflected light can also be used as an inspection light beam by utilizing the difference in reflectance between the surface wiring and the substrate.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示すブロック線図である。 第2図(a)は配線の被検査部分の断面図であり、同図
(bl〜(h)は第1図の各ブロックにおける各信号波
形図である。第3図は本発明の他の実施例を示す回路図
である。第4図(a)は従来の場合の問題点を示す配線
の被検査部分の断面図であり、同図(b)、 (c)は
それに対応して得られる信号波形図である。 1・・・発光ランプ、2・・・基板、3・・・配線、4
・・・拡大レンズ、5・・・光電変換素子、6・・・欠
陥、7・・・不要物、A、、A、・・・検出回路、B、
、Bよ・・・判定回路、C,、C2・・・表示部、d・
・・走査線。
FIG. 1 is a block diagram showing one embodiment of the present invention. FIG. 2(a) is a cross-sectional view of a portion of the wiring to be inspected, and FIG. 2(h) is a diagram of each signal waveform in each block of FIG. 1. FIG. 4 is a circuit diagram showing an embodiment. FIG. 4(a) is a cross-sectional view of the inspected portion of the wiring showing problems in the conventional case, and FIG. 4(b) and (c) are corresponding results. 1 is a signal waveform diagram shown in FIG. 1. 1... Light emitting lamp, 2... Board, 3... Wiring, 4
... Magnifying lens, 5... Photoelectric conversion element, 6... Defect, 7... Unnecessary matter, A, , A,... Detection circuit, B,
, B...judgment circuit, C,, C2... display section, d.
...Scanning line.

Claims (1)

【特許請求の範囲】[Claims] 1、表面に所望の材料からなる所定パターンの膜が形成
されてなる基板の上記パターンの検査装置であって、上
記基板を走査した光に基づいて上記パターンに対応した
電気信号を形成する光電変換手段と、上記電気信号を、
上記膜における欠陥を検出するレベルとされた第1のし
きい値電圧と上記基板の上記膜が形成されるべきでない
表面部分におけろ不費物を検出するレベルとされ1こ第
2のしきい値電圧とにより第1.第2の2値化信号に変
換する検出回路と、上記第1.第2の2値化信号のそれ
ぞれのパルス幅のうち上記所定パターンによって決まる
最小パルス幅よりも狭いパルス幅を検出する判定回路と
を具備してなることを特徴とする物体状態検査装置。
1. A device for inspecting the pattern of a substrate having a predetermined pattern of film made of a desired material formed on the surface thereof, and a photoelectric conversion device for forming an electrical signal corresponding to the pattern based on light scanning the substrate. means, and the electrical signal,
A first threshold voltage is set to a level to detect defects in the film, and a second threshold voltage is set to a level to detect waste on a surface portion of the substrate where the film should not be formed. The first threshold voltage is determined by the threshold voltage. a detection circuit for converting into a second binary signal; and the first detection circuit. An object state inspection device comprising: a determination circuit that detects a pulse width narrower than the minimum pulse width determined by the predetermined pattern among the respective pulse widths of the second binary signal.
JP17295583A 1983-09-21 1983-09-21 Apparatus for inspecting material state Pending JPS5990034A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17295583A JPS5990034A (en) 1983-09-21 1983-09-21 Apparatus for inspecting material state

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17295583A JPS5990034A (en) 1983-09-21 1983-09-21 Apparatus for inspecting material state

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP49070246A Division JPS591978B2 (en) 1974-06-21 1974-06-21 Object condition inspection device

Publications (1)

Publication Number Publication Date
JPS5990034A true JPS5990034A (en) 1984-05-24

Family

ID=15951458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17295583A Pending JPS5990034A (en) 1983-09-21 1983-09-21 Apparatus for inspecting material state

Country Status (1)

Country Link
JP (1) JPS5990034A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63281038A (en) * 1987-05-13 1988-11-17 Iwaki Denshi Kk Flaw detector for circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63281038A (en) * 1987-05-13 1988-11-17 Iwaki Denshi Kk Flaw detector for circuit board

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