JPS5989432A - ウエハ−整列方法及びその整列装置 - Google Patents

ウエハ−整列方法及びその整列装置

Info

Publication number
JPS5989432A
JPS5989432A JP57199091A JP19909182A JPS5989432A JP S5989432 A JPS5989432 A JP S5989432A JP 57199091 A JP57199091 A JP 57199091A JP 19909182 A JP19909182 A JP 19909182A JP S5989432 A JPS5989432 A JP S5989432A
Authority
JP
Japan
Prior art keywords
wafer
rotating shaft
groove
rotation
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57199091A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0532904B2 (enExample
Inventor
Takeshi Yoneyama
剛 米山
Mitsuo Sato
佐藤　満雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP57199091A priority Critical patent/JPS5989432A/ja
Publication of JPS5989432A publication Critical patent/JPS5989432A/ja
Publication of JPH0532904B2 publication Critical patent/JPH0532904B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
JP57199091A 1982-11-15 1982-11-15 ウエハ−整列方法及びその整列装置 Granted JPS5989432A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57199091A JPS5989432A (ja) 1982-11-15 1982-11-15 ウエハ−整列方法及びその整列装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57199091A JPS5989432A (ja) 1982-11-15 1982-11-15 ウエハ−整列方法及びその整列装置

Publications (2)

Publication Number Publication Date
JPS5989432A true JPS5989432A (ja) 1984-05-23
JPH0532904B2 JPH0532904B2 (enExample) 1993-05-18

Family

ID=16401956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57199091A Granted JPS5989432A (ja) 1982-11-15 1982-11-15 ウエハ−整列方法及びその整列装置

Country Status (1)

Country Link
JP (1) JPS5989432A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1096112C (zh) * 1996-12-28 2002-12-11 Lg半导体株式会社 晶片支承和/或输送机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014357U (enExample) * 1973-06-08 1975-02-14
JPS53117977A (en) * 1977-03-25 1978-10-14 Hitachi Ltd Datum level direction aligner

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014357U (enExample) * 1973-06-08 1975-02-14
JPS53117977A (en) * 1977-03-25 1978-10-14 Hitachi Ltd Datum level direction aligner

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1096112C (zh) * 1996-12-28 2002-12-11 Lg半导体株式会社 晶片支承和/或输送机

Also Published As

Publication number Publication date
JPH0532904B2 (enExample) 1993-05-18

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