JPS5989432A - Method for wafer alignment and device thereof - Google Patents

Method for wafer alignment and device thereof

Info

Publication number
JPS5989432A
JPS5989432A JP19909182A JP19909182A JPS5989432A JP S5989432 A JPS5989432 A JP S5989432A JP 19909182 A JP19909182 A JP 19909182A JP 19909182 A JP19909182 A JP 19909182A JP S5989432 A JPS5989432 A JP S5989432A
Authority
JP
Japan
Prior art keywords
wafer
rotating shaft
groove
rotation
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19909182A
Other languages
Japanese (ja)
Other versions
JPH0532904B2 (en
Inventor
Takeshi Yoneyama
剛 米山
Mitsuo Sato
佐藤 満雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP19909182A priority Critical patent/JPS5989432A/en
Publication of JPS5989432A publication Critical patent/JPS5989432A/en
Publication of JPH0532904B2 publication Critical patent/JPH0532904B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To properly align a wafer and to transfer it smoothly to a wafer holder by a method wherein the thin disc-shaped wafer is arranged on the groove part provided on a rotating shaft, and the chord part of the wafer is contacted to a stop mechanism by rotation. CONSTITUTION:A wafer 7 is arranged on the groove provided on a rotating shaft 4 in such a manner that its circumferential part is supported by the groove. Then, when the rotating shaft is rotated, the wafer 7 is rotated by the friction with the rotating shaft 4, and after a short time has passed, the OF8 of the wafer comes in contact with the stop mechanism 3 which is provided on the side of the rotating shaft, and the wafer 7 is aligned by stopping the rotation of the wafer. At this time, as the wafer is supported by the groove, it is maintained leaving a regular interval. As a result, when the wafer is transferred to the wafer holder, no damage is given to the wafer, and the transfer work can be performed smoothly.

Description

【発明の詳細な説明】 「発明の技m分野」 本発明6−を半導体装置の製造に使用されるウェハー活
動方法及びその整列装置+RK関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention 6- relates to a wafer activation method and alignment apparatus +RK used for manufacturing semiconductor devices.

[J汽明の技術的バ1夛とその問題・、飄]1色導体装
置1・yの製造にし・いては、加熱炉内で弧部(オリエ
ンテーノヨンフラット・以ド01−と略す)紐付する薄
円板状の半導体ウニ・・−の表面をC便化さすたり1表
面に不純物を拡牧、さ)−!′たりする熱処理1渫/)
<行われる。この工程ではウニ・〜−をボートと呼ばれ
る、熱処理用ウニ・・−保持具に収納し一度シて多[k
故の、ノル環が行われる51シかし、この時01?υ−
ばらばらの位+、fにあると、ウニ・・−のボート上で
の高さθ(まら老ちとなり、ウニ−・−全1+11での
均一な熱処2哩が行わFLないため、不良古な6チツプ
数が多くなるうそこて熱処理工程を行う場合には、ウニ
・・−の〇[−を1曲えてボート上に配置代することが
必要である。
[J Steam Company's technical equipment and its problems] When manufacturing the one-color conductor device 1, the arc section (orientation flat, hereafter abbreviated as 01-) is manufactured in a heating furnace. The surface of the thin disk-shaped semiconductor sea urchin that is attached to the string is converted into C, and impurities are spread on the surface. 1 layer of heat treatment/)
<It will be done. In this process, the sea urchins are stored in a holder for heat treatment called a boat, and once the sea urchins are
Therefore, the Nor ring is performed at 51, but at this time 01? υ−
If the position of the sea urchins is at +, f, the height θ on the boat of the sea urchins... When performing a heat treatment process that increases the number of old 6 chips, it is necessary to bend the 〇[- of the sea urchin...- by 1 and place it on the boat.

泥液、この作業はピンセットまたはバキュームビン−ヒ
ツト(ウェハーをチャックして、OFを目硯’C、In
hえて行りれ−rい?’C。
This work can be done using tweezers or a vacuum bottle (chuck the wafer and aim for the OF).
Hey, let's go! 'C.

しかしこの方法は手作業のだめ作業性が悪く、また、作
業中tA−ってウェノ・−に傷をつけてしまう泳れもあ
った。
However, this method requires manual work, has poor workability, and also has the disadvantage of causing damage to the weno during the work.

釘こで、この作業を簡単にするため、本件出願人はすで
にt臣願昭56−71G83号を出1須しているO前記
発明は、ウニ・・−をキャリアからボードに、OFを揃
えて移し侍える作業を自動的に行うものであるが、その
概略は以下の通りである。回転軸を、その円周部の一部
を露出させてブロック部に埋め込Jir oこの回転軸
にウニ/・−をのせ、回転軸を回転さする。ウエノ・−
の回転はOFがブロック部に当った時、+hまるため適
切な時間、回転軸を回転させてやれば、OFを揃えるこ
とができる0このとき、ウニ・・−は、回転軸上方に配
置されたガイドにより回転軸方向の位置間隔が保たれて
いるのであるが、ウニ・・−の回転につれて1回転軸上
の位置は除々にずれてくる場合が多かった0このため次
の工程でウエノ〜−をボードに収納する際ボードの溝に
ウエノヘーが円、′hに入らないことが多く、ウニI・
−に損傷を与えることがあった。
In order to simplify this work, the applicant has already published Application No. 56-71G83. The system automatically performs the tasks that can be transferred and attended to, and the outline is as follows. A rotating shaft is embedded in the block part with a part of its circumference exposed, a sea urchin is placed on this rotating shaft, and the rotating shaft is rotated. Ueno・-
When the OF hits the block part, the rotation of the OF is +h, so if you rotate the rotation axis for an appropriate amount of time, the OF can be aligned.0 At this time, the sea urchin...- is placed above the rotation axis. However, as the sea urchin rotates, the position on the rotation axis often shifts gradually. Therefore, in the next process, the position on the rotation axis is gradually shifted. When storing the - on the board, the sea urchin often does not fit into the groove of the board, and the sea urchin I.
- could cause damage.

し発明の目的」 本発明は前記のような欠点を鑑みてなされたものであり
、ウエノ・−を損傷させろことなく、円滑にウニ・・−
保持具に移し替えることができるようウェー・−の回転
軸方向の位置を制御しつつOFを揃えることを目的とす
る。
OBJECT OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and it can smoothly remove sea urchins without damaging the sea urchins.
The purpose is to align the OF while controlling the position of the wafer in the direction of the rotation axis so that the wafer can be transferred to the holder.

[@明の限゛星と効果] ウニ・・−1亡その周囲部を支持すべく回転軸に設けら
れた溝の上に配置iJする。次に回転軸を1弓11侭さ
1するとウェノ・−は回転軸との摩擦により回転し、醍
時峰局すらと、ウニ・・−のOF y:+(、回転’t
ill l’1方に配置される止め磯(隣に当接し、ウ
ニ・・−の11男1云計止めることによりウニノ・−が
整列さJする。この際、つ℃・・−は溝により支持され
ているため、つニー・−間隔は一定に保持さFLも。こ
のだめ、・ンエ・・−をウニ・・−保持具等に移し替え
る際、ウニ・・−に損傷が加わることは/、<、円滑な
移し替えを行うこと・)3できろ0 [発明の実施例1 本発明の一実施例イヒ図を用いて説明rろ。まず第1.
A、第2図によ)整列装置を説明する。
[@Ming's limit star and effect] Sea urchin...-1 Place it on the groove provided on the rotating shaft to support its surroundings. Next, when the axis of rotation is moved 1 bow 11, Ueno - rotates due to friction with the axis of rotation, and even the peak of the season and the OF y: + (, rotation 't
ill l' The sea urchins are lined up by the stopping rocks placed on one side (by coming into contact with them and stopping the 11 men of the sea urchins). Because it is supported, the spacing between the knees is maintained constant and FL is also maintained constant.In this case, when transferring the needle to the holder, etc., there is no chance of damage to the needle. /, <, To perform smooth transfer・)3 0 [Embodiment 1 of the Invention An embodiment of the present invention will be explained using diagrams. First of all.
A) The alignment device will be described (see FIG. 2).

ボードlは複数の溝を有する2本の円柱、la、lbと
、その下方に固着される2本の円柱1c、1dと、。
The board 1 includes two cylinders la and lb having a plurality of grooves, and two cylinders 1c and 1d fixed below the cylinders la and lb.

これら4本の円柱を平行に保持するために、la、lb
の2本の円柱の一端付近に固着される円柱1eと、la
、lbの2本の円柱の他端及びその近傍に固着される2
本の円柱1f、Igとから成る。なお、2本の円柱1a
、lbの溝は、同一ピッチで設けられ、その11ff 
utは互いに対応しておシ、かつ内側に向は傾/lFF
しCいる。
To keep these four cylinders parallel, la, lb
A cylinder 1e fixed near one end of two cylinders, la
, 2 fixed to the other ends of the two cylinders of lb and their vicinity
It consists of book cylinders 1f and Ig. In addition, two cylinders 1a
, lb grooves are provided at the same pitch, and the 11ff grooves are provided at the same pitch.
ut corresponds to each other, and the inward direction is /lFF
There is a C.

前記ボードlは中空部を汀し、周囲に囲みが設けらhだ
受台2上に載dされている。上部が平面となっているブ
ロック部3に前記受台2の中空部に対して挿脱自在に配
設置る。この挿脱は、ブロック部:うの下方に伸びる支
持棒3aを垂直方向に動かすことにより行う。
The board 1 is placed on a pedestal 2 with a hollow part and a surrounding area. The block part 3 having a flat upper part is installed in a manner that it can be inserted into and removed from the hollow part of the pedestal 2. This insertion/removal is performed by vertically moving the support rod 3a extending below the block.

前記ブロック部3に複数の溝を有する回転軸4をその円
周部の一部かに露出するように埋設する。
A rotary shaft 4 having a plurality of grooves is embedded in the block portion 3 so that only a part of its circumference is exposed.

この回転軸4に設けられている溝は、ボート′1の溝と
同一ピッチであり、その幅はボード1の2木の円柱1a
、 ibの溝の幅よりも狭い。埋設の徨度は回・旨軸4
の溝の峙頂部が、ブロック部3の上面よりもわずかに上
方になるようにする。
The grooves provided on this rotating shaft 4 have the same pitch as the grooves on the boat '1, and their width is the same as that of the two wooden cylinders 1a of the board 1.
, narrower than the width of the ib groove. The depth of burial is 4 times
The top of the groove is slightly above the upper surface of the block part 3.

l111記ボードの溝をffする2木の円柱1a、lb
それぞれの上方には、ウェハーの円周部を保持仁るため
の溝を有する2つのガイド5,6が設けられている。2
つのガイド5,6は、その間隔を変えることができるよ
うに水平方向に移動可能に;tつCいる。+たこれらに
設けられている溝はボー)1の溝、L同一ピノtであり
、溝の6γj、tが回転1油4の1肯と7付応した立1
樅に、なるようシ・こ2一つのガイド5゜6は配)I9
さ比る。
2 wooden cylinders 1a, lb that ff the grooves of the l111 board
Two guides 5 and 6 having grooves for holding the circumference of the wafer are provided above each guide. 2
The two guides 5, 6 are horizontally movable so that their spacing can be changed. The grooves provided in these are the grooves of bow) 1, L the same pinot, and the grooves 6γj, t are the rotation 1 oil 4 1 positive and 7 associated vertical 1
One guide 5゜6 is placed on a fir tree) I9
Compare.

なお、支持棒3a及び2つのガイド5,6の動力部はに
1略した。
Note that the power parts of the support rod 3a and the two guides 5 and 6 are omitted.

次に第2図、・容3図、第4図を用いて動作を説明する
Next, the operation will be explained using FIGS. 2, 3, and 4.

まずボー)1を、2の溝の位置が回転軸4の溝に対応す
るように固定する。ブロック11賃3ヲ、2のL面がボ
ー)1の一ト端とほぼ回し高さになるように位置させる
。さらに2つのガイド5,60間隔をウェハーを保持す
るのに適切・2間隔にする。
First, the bow 1 is fixed so that the groove 2 corresponds to the groove of the rotating shaft 4. Position the block 11 so that the L side of block 11 is approximately at the same height as one end of block 1. Furthermore, the distance between the two guides 5 and 60 is set to an appropriate distance of 2 to hold the wafer.

次にウェハーを2つのガイド5,6の対応しだfx′1
ittの劣情へ挿入する。すると、ウェハーはガイドの
溝に案内され、回転軸4の対応した位置の溝に納まる。
Next, the wafer is placed between the two guides 5 and 6, fx'1
Insert into itt's lewdness. Then, the wafer is guided by the groove of the guide and is placed in the groove of the rotating shaft 4 at the corresponding position.

(第2図) な訃、この時OF8がどの位1直になるかは不定である
。又、OF8が回転軸上にない場合、ウニハートフロッ
ク部3は当接しないようにブロック1部3が配置されて
いる。
(Figure 2) Unfortunately, it is uncertain how long OF8 will be on shift at this time. Further, when the OF 8 is not on the rotation axis, the block 1 part 3 is arranged so that the sea urchin heart flock part 3 does not come into contact with it.

次に、回転軸4をたとえば第2図において向って右回り
に回転さする。するとウェハー7は回転軸4の溝との摩
)撃力にLリノE回りの回転を始める。
Next, the rotating shaft 4 is rotated, for example, clockwise in FIG. 2. Then, the wafer 7 begins to rotate around the L-reno E due to the frictional force with the groove of the rotating shaft 4.

暫)寺経過する七、OF端8aが回転軸を通過し、千の
後OF端8bがブロック部3に当り、ウェハー7は回転
をIEめる。(第3図)っ士りブロック部3は止め機構
として働く。又回転軸4はこの後も回転を続け、全ての
ウェハーのOF端8bがブロック部3に当り回転を止め
るまで回転させろ。そして所定時間経過後回転軸の回転
を止める。回転軸を回転させる時間は、ウニノー−7と
同じ直後を持つ円板が1.5回転する程度の時間とすれ
ば充分である。このようにすれば、第2図の状態におい
て、OFの位置がどこにあるウニ・・−も、回転軸の回
転が止った時には第3図のごとくそのOF’が揃った伏
)川と、tっている。このOF8を揃える動作中ウニ・
・−7の回転軸方向の位置は回転軸4に溝が設けである
ため、す“れることはなく、所定の位置に渫たI″L乙
At the end of the 7th period, the OF end 8a passes through the rotation axis, and the OF end 8b hits the block part 3, and the wafer 7 stops rotating. (FIG. 3) The solid block portion 3 functions as a stop mechanism. Further, the rotating shaft 4 should continue to rotate after this until the OF ends 8b of all the wafers hit the block part 3 and stop rotating. After a predetermined period of time has elapsed, the rotation of the rotating shaft is stopped. It is sufficient to rotate the rotary shaft for 1.5 rotations of a disc having the same rear end as Uni-No-7. In this way, in the state shown in Figure 2, no matter where the OF's are located, when the rotating shaft stops rotating, the OF' will be aligned as shown in Figure 3. ing. A working sea urchin that prepares this OF8.
・Since the position of -7 in the direction of the rotation axis is provided with a groove on the rotation axis 4, it will not be lost and the I"L can be moved to the specified position.

次にブロック)$3・とゆっくりと降′Fさすも。ウニ
・・−7は、ブロック部3と回転軸4により支持されC
いるだめ、ブロック部3の降ドと共に降下tも。セがC
、ウェハー7の円周部932つのガイド5,6、回転軸
4の溝に対応し7だ(S″L置のボートIの碑に入り、
ウェハー7はブロック部3と回転l1II4による支持
から藺れ、ボーF1により支持されるようになる。この
時、回転軸の溝はボートの溝よりもその幅を狭く形成さ
れでいるだめ、つ工・・−(は円を斤にボートの溝に収
納(fするcsc’X4図)最v;、K、ガイド5,6
を水平方向に移Nhシてガイド間の間隔を広げ、ボー)
1を取り出す。
Next block) $3 and slowly descended 'F as expected. Sea urchin...-7 is supported by the block part 3 and the rotating shaft 4, and C
Unfortunately, as the block part 3 descends, so does the t. Ce is C
, the circumference of the wafer 7 corresponds to the two guides 5, 6, and the groove of the rotating shaft 4.
The wafer 7 is moved from being supported by the block portion 3 and the rotation l1II4 and is now supported by the bow F1. At this time, the width of the groove on the rotating shaft must be narrower than the groove on the boat, so the tool... , K, Guide 5, 6
horizontally to increase the spacing between the guides (bow)
Take out 1.

前記の実−施例においては止め機構として、フ゛ロック
部を用いたが、この他、回転軸側方に、回転軸と平行に
棒を配設し、止め機構としてもよい。
In the above-mentioned embodiment, a lock portion was used as the stopping mechanism, but it is also possible to use a bar disposed on the side of the rotating shaft in parallel with the rotating shaft to serve as the stopping mechanism.

また、受台を駆動してウニノ・−をボートに収納するこ
とも可能である0 さらに前記実施例は、複数のウニz”−全一度に整列さ
せるものであったが、これを1枚のみのウニ・・−を汲
う装置に応用することも容易に行える。
It is also possible to store the sea urchins in the boat by driving the pedestal. Furthermore, in the above embodiment, a plurality of sea urchins z"- were all arranged at once, but only one It can also be easily applied to a device for collecting sea urchins.

【図面の簡単な説明】[Brief explanation of the drawing]

°套1図は本発明の一実施例の装置を示す平面図、第2
 +g 、 、:K :3図、;$4図は木表(’l 
作’Jh 中(7J) A−A’所面iuである。 l・・・フビート、2・・受 台、3・・・グロック部
、3a・・・支持棒、 5・・・ガイド、6・・・ガイ
ド、7  ・・ ウ ェ ノ〜 −、8・・・ OF 
Figure 1 is a plan view showing an apparatus according to an embodiment of the present invention, Figure 2
+g, , :K :3 figure, ;$4 figure is wooden table ('l
Work 'Jh middle (7J) A-A' place iu. l...Fubito, 2...Base, 3...Glock part, 3a...Support rod, 5...Guide, 6...Guide, 7...Weno~-, 8...・OF
.

Claims (1)

【特許請求の範囲】 11)一部に法部を有する薄円板状のウェノ・−を回転
軸に設けられた溝部の上に配j次する工程と、前記口伝
=111金回転さく+ることてより、前「ICウェー・
−を回転さする工程と、前記つわノ・−の文部が前記回
転・袖側力に配置されるIJr:、め(a構に当接した
さき、前記ウェハーの与の回転を止める工程とから成る
ウェハー整列方法。 (2)腹敢の溝部θ1一定間隔で設けられている回転軸
を用いることを特徴とする特許請求の範囲第1項記載の
ウニ・・−整列方法。 (3)回転軸がその円周部の一部を露出されて埋め込ま
れているブロック部を止め機構上して用いることを特徴
とする特許請求の範囲第1項記載のつt・・−整列方法
。 (4)一部に法部を有する薄円板状のウェ・・−全文I
I J−もだめの溝を有しる回転軸、L、前記回転軸の
測方に配lItされ、前記ウェノ・−の法部が当接した
ときその回転を止める止め機構と、前記回転軸の近傍に
配置され、ウヱノ・−を収納するだめの保持具を・載(
!さ拷る受台と、前記回転軸上に支持されCいるウェ・
・−をウェー・−保持具に収納するために前記回転軸と
受台との位IIf1.l[1係そ変化させる駆動機溝と
から成るウェー・−整列装置。 (5)回転軸に設けらルた溝り5復孜であり、溝の11
1隔が一定であることを特徴とする特許請求の範囲z8
4項記載のウェハー整列族+d Q(6)凹陥部を灯し
、前記凹陥部に回転軸がその円周部の一部が露出された
状態で埋め色まれているブロック部を、止めi長溝さし
て用いることを特徴とする特許請求の範囲第4項d己載
のウニ・・−整列牌;6.。 (7)受台に中空部が設けられており、かつ駆動機構が
ブロック部に設けられ、ブロック1fμが前記中2P部
に挿脱可能となっていることを特徴とする特許請求の範
囲第6項記載のウヱノ・−整列牌(置。
[Claims] 11) A step of disposing a thin disk-shaped weno sheet having a lateral portion on a groove portion provided on a rotating shaft, and a step of rolling the gold plate according to the oral tradition = 111. By the way, the previous “IC Way・
a step of rotating the wafer, and a step of stopping the rotation of the wafer before the text of the wafer comes into contact with the rotation/arm side force. A wafer alignment method comprising: (2) a sea urchin alignment method according to claim 1, characterized in that a rotating shaft provided at regular intervals between the grooves θ1 is used; (3) rotation. The alignment method according to claim 1, characterized in that a block portion in which the shaft is embedded with a part of its circumference exposed is used as a stop mechanism. ) Thin disk-shaped wafer with a part of the lateral part...-Full text I
I J-A rotating shaft having a groove, L, a stop mechanism disposed in the direction of the rotating shaft and stopping the rotation when the base part of the welding abuts, and the rotating shaft. It is placed near the
! A pedestal to be crushed, and a cradle supported on the rotating shaft.
・The position of the rotating shaft and the pedestal is adjusted to accommodate the holder in the holder. A way-aligning device consisting of a drive groove and a drive groove for changing the groove. (5) Groove 5 provided on the rotating shaft, and groove 11
Claim z8 characterized in that one interval is constant.
Wafer alignment group +d Q (6) Illuminate the recessed part, and place the rotating shaft in the recessed part with a part of its circumference exposed and fill the block part with a color, and fix it in the i long groove. Claim 4, d, characterized in that it is used as a self-mounted sea urchin... - aligned tiles; 6. . (7) Claim 6, characterized in that the pedestal is provided with a hollow part, the drive mechanism is provided in the block part, and the block 1fμ can be inserted into and removed from the middle 2P part. Ueno--aligned tiles (placement) as described in the section.
JP19909182A 1982-11-15 1982-11-15 Method for wafer alignment and device thereof Granted JPS5989432A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19909182A JPS5989432A (en) 1982-11-15 1982-11-15 Method for wafer alignment and device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19909182A JPS5989432A (en) 1982-11-15 1982-11-15 Method for wafer alignment and device thereof

Publications (2)

Publication Number Publication Date
JPS5989432A true JPS5989432A (en) 1984-05-23
JPH0532904B2 JPH0532904B2 (en) 1993-05-18

Family

ID=16401956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19909182A Granted JPS5989432A (en) 1982-11-15 1982-11-15 Method for wafer alignment and device thereof

Country Status (1)

Country Link
JP (1) JPS5989432A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1096112C (en) * 1996-12-28 2002-12-11 Lg半导体株式会社 Wafer supporting and/or conveying apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014357U (en) * 1973-06-08 1975-02-14
JPS53117977A (en) * 1977-03-25 1978-10-14 Hitachi Ltd Datum level direction aligner

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014357U (en) * 1973-06-08 1975-02-14
JPS53117977A (en) * 1977-03-25 1978-10-14 Hitachi Ltd Datum level direction aligner

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1096112C (en) * 1996-12-28 2002-12-11 Lg半导体株式会社 Wafer supporting and/or conveying apparatus

Also Published As

Publication number Publication date
JPH0532904B2 (en) 1993-05-18

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