JPS5989432A - Method for wafer alignment and device thereof - Google Patents
Method for wafer alignment and device thereofInfo
- Publication number
- JPS5989432A JPS5989432A JP19909182A JP19909182A JPS5989432A JP S5989432 A JPS5989432 A JP S5989432A JP 19909182 A JP19909182 A JP 19909182A JP 19909182 A JP19909182 A JP 19909182A JP S5989432 A JPS5989432 A JP S5989432A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- rotating shaft
- groove
- rotation
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
「発明の技ｍ分野」
本発明６−を半導体装置の製造に使用されるウェハー活
動方法及びその整列装置＋ＲＫ関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention 6- relates to a wafer activation method and alignment apparatus +RK used for manufacturing semiconductor devices.
［Ｊ汽明の技術的バ１夛とその問題・、飄］１色導体装
置１・ｙの製造にし・いては、加熱炉内で弧部（オリエ
ンテーノヨンフラット・以ド０１−と略す）紐付する薄
円板状の半導体ウニ・・−の表面をＣ便化さすたり１表
面に不純物を拡牧、さ）−！′たりする熱処理１渫／）
＜行われる。この工程ではウニ・〜−をボートと呼ばれ
る、熱処理用ウニ・・−保持具に収納し一度シて多［ｋ
故の、ノル環が行われる５１シかし、この時０１？υ−
ばらばらの位＋、ｆにあると、ウニ・・−のボート上で
の高さθ（まら老ちとなり、ウニ−・−全１＋１１での
均一な熱処２哩が行わＦＬないため、不良古な６チツプ
数が多くなるうそこて熱処理工程を行う場合には、ウニ
・・−の〇［−を１曲えてボート上に配置代することが
必要である。[J Steam Company's technical equipment and its problems] When manufacturing the one-color conductor device 1, the arc section (orientation flat, hereafter abbreviated as 01-) is manufactured in a heating furnace. The surface of the thin disk-shaped semiconductor sea urchin that is attached to the string is converted into C, and impurities are spread on the surface. 1 layer of heat treatment/)
<It will be done. In this process, the sea urchins are stored in a holder for heat treatment called a boat, and once the sea urchins are
Therefore, the Nor ring is performed at 51, but at this time 01? υ−
If the position of the sea urchins is at +, f, the height θ on the boat of the sea urchins... When performing a heat treatment process that increases the number of old 6 chips, it is necessary to bend the 〇[- of the sea urchin...- by 1 and place it on the boat.
泥液、この作業はピンセットまたはバキュームビン−ヒ
ツト（ウェハーをチャックして、ＯＦを目硯’Ｃ、Ｉｎ
ｈえて行りれ−ｒい？’Ｃ。This work can be done using tweezers or a vacuum bottle (chuck the wafer and aim for the OF).
Hey, let's go! 'C.
しかしこの方法は手作業のだめ作業性が悪く、また、作
業中ｔＡ−ってウェノ・−に傷をつけてしまう泳れもあ
った。However, this method requires manual work, has poor workability, and also has the disadvantage of causing damage to the weno during the work.
釘こで、この作業を簡単にするため、本件出願人はすで
にｔ臣願昭５６−７１Ｇ８３号を出１須しているＯ前記
発明は、ウニ・・−をキャリアからボードに、ＯＦを揃
えて移し侍える作業を自動的に行うものであるが、その
概略は以下の通りである。回転軸を、その円周部の一部
を露出させてブロック部に埋め込Ｊｉｒ ｏこの回転軸
にウニ／・−をのせ、回転軸を回転さする。ウエノ・−
の回転はＯＦがブロック部に当った時、＋ｈまるため適
切な時間、回転軸を回転させてやれば、ＯＦを揃えるこ
とができる０このとき、ウニ・・−は、回転軸上方に配
置されたガイドにより回転軸方向の位置間隔が保たれて
いるのであるが、ウニ・・−の回転につれて１回転軸上
の位置は除々にずれてくる場合が多かった０このため次
の工程でウエノ〜−をボードに収納する際ボードの溝に
ウエノヘーが円、′ｈに入らないことが多く、ウニＩ・
−に損傷を与えることがあった。In order to simplify this work, the applicant has already published Application No. 56-71G83. The system automatically performs the tasks that can be transferred and attended to, and the outline is as follows. A rotating shaft is embedded in the block part with a part of its circumference exposed, a sea urchin is placed on this rotating shaft, and the rotating shaft is rotated. Ueno・-
When the OF hits the block part, the rotation of the OF is +h, so if you rotate the rotation axis for an appropriate amount of time, the OF can be aligned.0 At this time, the sea urchin...- is placed above the rotation axis. However, as the sea urchin rotates, the position on the rotation axis often shifts gradually. Therefore, in the next process, the position on the rotation axis is gradually shifted. When storing the - on the board, the sea urchin often does not fit into the groove of the board, and the sea urchin I.
- could cause damage.
し発明の目的」
本発明は前記のような欠点を鑑みてなされたものであり
、ウエノ・−を損傷させろことなく、円滑にウニ・・−
保持具に移し替えることができるようウェー・−の回転
軸方向の位置を制御しつつＯＦを揃えることを目的とす
る。OBJECT OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and it can smoothly remove sea urchins without damaging the sea urchins.
The purpose is to align the OF while controlling the position of the wafer in the direction of the rotation axis so that the wafer can be transferred to the holder.
［＠明の限゛星と効果］
ウニ・・−１亡その周囲部を支持すべく回転軸に設けら
れた溝の上に配置ｉＪする。次に回転軸を１弓１１侭さ
１するとウェノ・−は回転軸との摩擦により回転し、醍
時峰局すらと、ウニ・・−のＯＦ ｙ：＋（、回転’ｔ
ｉｌｌ ｌ’１方に配置される止め磯（隣に当接し、ウ
ニ・・−の１１男１云計止めることによりウニノ・−が
整列さＪする。この際、つ℃・・−は溝により支持され
ているため、つニー・−間隔は一定に保持さＦＬも。こ
のだめ、・ンエ・・−をウニ・・−保持具等に移し替え
る際、ウニ・・−に損傷が加わることは／、＜、円滑な
移し替えを行うこと・）３できろ０
［発明の実施例１
本発明の一実施例イヒ図を用いて説明ｒろ。まず第１．
Ａ、第２図によ）整列装置を説明する。[@Ming's limit star and effect] Sea urchin...-1 Place it on the groove provided on the rotating shaft to support its surroundings. Next, when the axis of rotation is moved 1 bow 11, Ueno - rotates due to friction with the axis of rotation, and even the peak of the season and the OF y: + (, rotation 't
ill l' The sea urchins are lined up by the stopping rocks placed on one side (by coming into contact with them and stopping the 11 men of the sea urchins). Because it is supported, the spacing between the knees is maintained constant and FL is also maintained constant.In this case, when transferring the needle to the holder, etc., there is no chance of damage to the needle. /, <, To perform smooth transfer・)3 0 [Embodiment 1 of the Invention An embodiment of the present invention will be explained using diagrams. First of all.
A) The alignment device will be described (see FIG. 2).
ボードｌは複数の溝を有する２本の円柱、ｌａ、ｌｂと
、その下方に固着される２本の円柱１ｃ、１ｄと、。The board 1 includes two cylinders la and lb having a plurality of grooves, and two cylinders 1c and 1d fixed below the cylinders la and lb.
これら４本の円柱を平行に保持するために、ｌａ、ｌｂ
の２本の円柱の一端付近に固着される円柱１ｅと、ｌａ
、ｌｂの２本の円柱の他端及びその近傍に固着される２
本の円柱１ｆ、Ｉｇとから成る。なお、２本の円柱１ａ
、ｌｂの溝は、同一ピッチで設けられ、その１１ｆｆ
ｕｔは互いに対応しておシ、かつ内側に向は傾／ｌＦＦ
しＣいる。To keep these four cylinders parallel, la, lb
A cylinder 1e fixed near one end of two cylinders, la
, 2 fixed to the other ends of the two cylinders of lb and their vicinity
It consists of book cylinders 1f and Ig. In addition, two cylinders 1a
, lb grooves are provided at the same pitch, and the 11ff grooves are provided at the same pitch.
ut corresponds to each other, and the inward direction is /lFF
There is a C.
前記ボードｌは中空部を汀し、周囲に囲みが設けらｈだ
受台２上に載ｄされている。上部が平面となっているブ
ロック部３に前記受台２の中空部に対して挿脱自在に配
設置る。この挿脱は、ブロック部：うの下方に伸びる支
持棒３ａを垂直方向に動かすことにより行う。The board 1 is placed on a pedestal 2 with a hollow part and a surrounding area. The block part 3 having a flat upper part is installed in a manner that it can be inserted into and removed from the hollow part of the pedestal 2. This insertion/removal is performed by vertically moving the support rod 3a extending below the block.
前記ブロック部３に複数の溝を有する回転軸４をその円
周部の一部かに露出するように埋設する。A rotary shaft 4 having a plurality of grooves is embedded in the block portion 3 so that only a part of its circumference is exposed.
この回転軸４に設けられている溝は、ボート′１の溝と
同一ピッチであり、その幅はボード１の２木の円柱１ａ
、 ｉｂの溝の幅よりも狭い。埋設の徨度は回・旨軸４
の溝の峙頂部が、ブロック部３の上面よりもわずかに上
方になるようにする。The grooves provided on this rotating shaft 4 have the same pitch as the grooves on the boat '1, and their width is the same as that of the two wooden cylinders 1a of the board 1.
, narrower than the width of the ib groove. The depth of burial is 4 times
The top of the groove is slightly above the upper surface of the block part 3.
ｌ１１１記ボードの溝をｆｆする２木の円柱１ａ、ｌｂ
それぞれの上方には、ウェハーの円周部を保持仁るため
の溝を有する２つのガイド５，６が設けられている。２
つのガイド５，６は、その間隔を変えることができるよ
うに水平方向に移動可能に；ｔつＣいる。＋たこれらに
設けられている溝はボー）１の溝、Ｌ同一ピノｔであり
、溝の６γｊ、ｔが回転１油４の１肯と７付応した立１
樅に、なるようシ・こ２一つのガイド５゜６は配）Ｉ９
さ比る。2 wooden cylinders 1a, lb that ff the grooves of the l111 board
Two guides 5 and 6 having grooves for holding the circumference of the wafer are provided above each guide. 2
The two guides 5, 6 are horizontally movable so that their spacing can be changed. The grooves provided in these are the grooves of bow) 1, L the same pinot, and the grooves 6γj, t are the rotation 1 oil 4 1 positive and 7 associated vertical 1
One guide 5゜6 is placed on a fir tree) I9
Compare.
なお、支持棒３ａ及び２つのガイド５，６の動力部はに
１略した。Note that the power parts of the support rod 3a and the two guides 5 and 6 are omitted.
次に第２図、・容３図、第４図を用いて動作を説明する
。Next, the operation will be explained using FIGS. 2, 3, and 4.
まずボー）１を、２の溝の位置が回転軸４の溝に対応す
るように固定する。ブロック１１賃３ヲ、２のＬ面がボ
ー）１の一ト端とほぼ回し高さになるように位置させる
。さらに２つのガイド５，６０間隔をウェハーを保持す
るのに適切・２間隔にする。First, the bow 1 is fixed so that the groove 2 corresponds to the groove of the rotating shaft 4. Position the block 11 so that the L side of block 11 is approximately at the same height as one end of block 1. Furthermore, the distance between the two guides 5 and 60 is set to an appropriate distance of 2 to hold the wafer.
次にウェハーを２つのガイド５，６の対応しだｆｘ′１
ｉｔｔの劣情へ挿入する。すると、ウェハーはガイドの
溝に案内され、回転軸４の対応した位置の溝に納まる。Next, the wafer is placed between the two guides 5 and 6, fx'1
Insert into itt's lewdness. Then, the wafer is guided by the groove of the guide and is placed in the groove of the rotating shaft 4 at the corresponding position.
（第２図）
な訃、この時ＯＦ８がどの位１直になるかは不定である
。又、ＯＦ８が回転軸上にない場合、ウニハートフロッ
ク部３は当接しないようにブロック１部３が配置されて
いる。(Figure 2) Unfortunately, it is uncertain how long OF8 will be on shift at this time. Further, when the OF 8 is not on the rotation axis, the block 1 part 3 is arranged so that the sea urchin heart flock part 3 does not come into contact with it.
次に、回転軸４をたとえば第２図において向って右回り
に回転さする。するとウェハー７は回転軸４の溝との摩
）撃力にＬリノＥ回りの回転を始める。Next, the rotating shaft 4 is rotated, for example, clockwise in FIG. 2. Then, the wafer 7 begins to rotate around the L-reno E due to the frictional force with the groove of the rotating shaft 4.
暫）寺経過する七、ＯＦ端８ａが回転軸を通過し、千の
後ＯＦ端８ｂがブロック部３に当り、ウェハー７は回転
をＩＥめる。（第３図）っ士りブロック部３は止め機構
として働く。又回転軸４はこの後も回転を続け、全ての
ウェハーのＯＦ端８ｂがブロック部３に当り回転を止め
るまで回転させろ。そして所定時間経過後回転軸の回転
を止める。回転軸を回転させる時間は、ウニノー−７と
同じ直後を持つ円板が１．５回転する程度の時間とすれ
ば充分である。このようにすれば、第２図の状態におい
て、ＯＦの位置がどこにあるウニ・・−も、回転軸の回
転が止った時には第３図のごとくそのＯＦ’が揃った伏
）川と、ｔっている。このＯＦ８を揃える動作中ウニ・
・−７の回転軸方向の位置は回転軸４に溝が設けである
ため、す“れることはなく、所定の位置に渫たＩ″Ｌ乙
。At the end of the 7th period, the OF end 8a passes through the rotation axis, and the OF end 8b hits the block part 3, and the wafer 7 stops rotating. (FIG. 3) The solid block portion 3 functions as a stop mechanism. Further, the rotating shaft 4 should continue to rotate after this until the OF ends 8b of all the wafers hit the block part 3 and stop rotating. After a predetermined period of time has elapsed, the rotation of the rotating shaft is stopped. It is sufficient to rotate the rotary shaft for 1.5 rotations of a disc having the same rear end as Uni-No-7. In this way, in the state shown in Figure 2, no matter where the OF's are located, when the rotating shaft stops rotating, the OF' will be aligned as shown in Figure 3. ing. A working sea urchin that prepares this OF8.
・Since the position of -7 in the direction of the rotation axis is provided with a groove on the rotation axis 4, it will not be lost and the I"L can be moved to the specified position.
次にブロック）＄３・とゆっくりと降′Ｆさすも。ウニ
・・−７は、ブロック部３と回転軸４により支持されＣ
いるだめ、ブロック部３の降ドと共に降下ｔも。セがＣ
、ウェハー７の円周部９３２つのガイド５，６、回転軸
４の溝に対応し７だ（Ｓ″Ｌ置のボートＩの碑に入り、
ウェハー７はブロック部３と回転ｌ１ＩＩ４による支持
から藺れ、ボーＦ１により支持されるようになる。この
時、回転軸の溝はボートの溝よりもその幅を狭く形成さ
れでいるだめ、つ工・・−（は円を斤にボートの溝に収
納（ｆするｃｓｃ’Ｘ４図）最ｖ；、Ｋ、ガイド５，６
を水平方向に移Ｎｈシてガイド間の間隔を広げ、ボー）
１を取り出す。Next block) $3 and slowly descended 'F as expected. Sea urchin...-7 is supported by the block part 3 and the rotating shaft 4, and C
Unfortunately, as the block part 3 descends, so does the t. Ce is C
, the circumference of the wafer 7 corresponds to the two guides 5, 6, and the groove of the rotating shaft 4.
The wafer 7 is moved from being supported by the block portion 3 and the rotation l1II4 and is now supported by the bow F1. At this time, the width of the groove on the rotating shaft must be narrower than the groove on the boat, so the tool... , K, Guide 5, 6
horizontally to increase the spacing between the guides (bow)
Take out 1.
前記の実−施例においては止め機構として、フ゛ロック
部を用いたが、この他、回転軸側方に、回転軸と平行に
棒を配設し、止め機構としてもよい。In the above-mentioned embodiment, a lock portion was used as the stopping mechanism, but it is also possible to use a bar disposed on the side of the rotating shaft in parallel with the rotating shaft to serve as the stopping mechanism.
また、受台を駆動してウニノ・−をボートに収納するこ
とも可能である０
さらに前記実施例は、複数のウニｚ”−全一度に整列さ
せるものであったが、これを１枚のみのウニ・・−を汲
う装置に応用することも容易に行える。It is also possible to store the sea urchins in the boat by driving the pedestal. Furthermore, in the above embodiment, a plurality of sea urchins z"- were all arranged at once, but only one It can also be easily applied to a device for collecting sea urchins.
°套１図は本発明の一実施例の装置を示す平面図、第２
＋ｇ 、 、：Ｋ ：３図、；＄４図は木表（’ｌ
作’Ｊｈ 中（７Ｊ） Ａ−Ａ’所面ｉｕである。
ｌ・・・フビート、２・・受 台、３・・・グロック部
、３ａ・・・支持棒、 ５・・・ガイド、６・・・ガイ
ド、７ ・・ ウ ェ ノ〜 −、８・・・ ＯＦ
。Figure 1 is a plan view showing an apparatus according to an embodiment of the present invention, Figure 2
+g, , :K :3 figure, ;$4 figure is wooden table ('l
Work 'Jh middle (7J) A-A' place iu. l...Fubito, 2...Base, 3...Glock part, 3a...Support rod, 5...Guide, 6...Guide, 7...Weno~-, 8...・OF
.
Claims (1)
軸に設けられた溝部の上に配ｊ次する工程と、前記口伝
＝１１１金回転さく＋ることてより、前「ＩＣウェー・
−を回転さする工程と、前記つわノ・−の文部が前記回
転・袖側力に配置されるＩＪｒ：、め（ａ構に当接した
さき、前記ウェハーの与の回転を止める工程とから成る
ウェハー整列方法。 （２）腹敢の溝部θ１一定間隔で設けられている回転軸
を用いることを特徴とする特許請求の範囲第１項記載の
ウニ・・−整列方法。 （３）回転軸がその円周部の一部を露出されて埋め込ま
れているブロック部を止め機構上して用いることを特徴
とする特許請求の範囲第１項記載のつｔ・・−整列方法
。 （４）一部に法部を有する薄円板状のウェ・・−全文Ｉ
Ｉ Ｊ−もだめの溝を有しる回転軸、Ｌ、前記回転軸の
測方に配ｌＩｔされ、前記ウェノ・−の法部が当接した
ときその回転を止める止め機構と、前記回転軸の近傍に
配置され、ウヱノ・−を収納するだめの保持具を・載（
！さ拷る受台と、前記回転軸上に支持されＣいるウェ・
・−をウェー・−保持具に収納するために前記回転軸と
受台との位ＩＩｆ１．ｌ［１係そ変化させる駆動機溝と
から成るウェー・−整列装置。 （５）回転軸に設けらルた溝り５復孜であり、溝の１１
１隔が一定であることを特徴とする特許請求の範囲ｚ８
４項記載のウェハー整列族＋ｄ Ｑ（６）凹陥部を灯し
、前記凹陥部に回転軸がその円周部の一部が露出された
状態で埋め色まれているブロック部を、止めｉ長溝さし
て用いることを特徴とする特許請求の範囲第４項ｄ己載
のウニ・・−整列牌；６．。 （７）受台に中空部が設けられており、かつ駆動機構が
ブロック部に設けられ、ブロック１ｆμが前記中２Ｐ部
に挿脱可能となっていることを特徴とする特許請求の範
囲第６項記載のウヱノ・−整列牌（置。[Claims] 11) A step of disposing a thin disk-shaped weno sheet having a lateral portion on a groove portion provided on a rotating shaft, and a step of rolling the gold plate according to the oral tradition = 111. By the way, the previous “IC Way・
a step of rotating the wafer, and a step of stopping the rotation of the wafer before the text of the wafer comes into contact with the rotation/arm side force. A wafer alignment method comprising: (2) a sea urchin alignment method according to claim 1, characterized in that a rotating shaft provided at regular intervals between the grooves θ1 is used; (3) rotation. The alignment method according to claim 1, characterized in that a block portion in which the shaft is embedded with a part of its circumference exposed is used as a stop mechanism. ) Thin disk-shaped wafer with a part of the lateral part...-Full text I
I J-A rotating shaft having a groove, L, a stop mechanism disposed in the direction of the rotating shaft and stopping the rotation when the base part of the welding abuts, and the rotating shaft. It is placed near the
! A pedestal to be crushed, and a cradle supported on the rotating shaft.
・The position of the rotating shaft and the pedestal is adjusted to accommodate the holder in the holder. A way-aligning device consisting of a drive groove and a drive groove for changing the groove. (5) Groove 5 provided on the rotating shaft, and groove 11
Claim z8 characterized in that one interval is constant.
Wafer alignment group +d Q (6) Illuminate the recessed part, and place the rotating shaft in the recessed part with a part of its circumference exposed and fill the block part with a color, and fix it in the i long groove. Claim 4, d, characterized in that it is used as a self-mounted sea urchin... - aligned tiles; 6. . (7) Claim 6, characterized in that the pedestal is provided with a hollow part, the drive mechanism is provided in the block part, and the block 1fμ can be inserted into and removed from the middle 2P part. Ueno--aligned tiles (placement) as described in the section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19909182A JPS5989432A (en) | 1982-11-15 | 1982-11-15 | Method for wafer alignment and device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19909182A JPS5989432A (en) | 1982-11-15 | 1982-11-15 | Method for wafer alignment and device thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5989432A true JPS5989432A (en) | 1984-05-23 |
| JPH0532904B2 JPH0532904B2 (en) | 1993-05-18 |
Family
ID=16401956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19909182A Granted JPS5989432A (en) | 1982-11-15 | 1982-11-15 | Method for wafer alignment and device thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5989432A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096112C (en) * | 1996-12-28 | 2002-12-11 | Lg半导体株式会社 | Wafer supporting and/or conveying apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014357U (en) * | 1973-06-08 | 1975-02-14 | ||
| JPS53117977A (en) * | 1977-03-25 | 1978-10-14 | Hitachi Ltd | Datum level direction aligner |
-
1982
- 1982-11-15 JP JP19909182A patent/JPS5989432A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014357U (en) * | 1973-06-08 | 1975-02-14 | ||
| JPS53117977A (en) * | 1977-03-25 | 1978-10-14 | Hitachi Ltd | Datum level direction aligner |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096112C (en) * | 1996-12-28 | 2002-12-11 | Lg半导体株式会社 | Wafer supporting and/or conveying apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0532904B2 (en) | 1993-05-18 |
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