JPS5986253A - 半導体集積回路 - Google Patents

半導体集積回路

Info

Publication number
JPS5986253A
JPS5986253A JP19295182A JP19295182A JPS5986253A JP S5986253 A JPS5986253 A JP S5986253A JP 19295182 A JP19295182 A JP 19295182A JP 19295182 A JP19295182 A JP 19295182A JP S5986253 A JPS5986253 A JP S5986253A
Authority
JP
Japan
Prior art keywords
wiring
substrate
circuit
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19295182A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0377665B2 (enrdf_load_stackoverflow
Inventor
Tamotsu Ishikawa
保 石川
Hirokazu Tanaka
田中　裕計
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP19295182A priority Critical patent/JPS5986253A/ja
Publication of JPS5986253A publication Critical patent/JPS5986253A/ja
Publication of JPH0377665B2 publication Critical patent/JPH0377665B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP19295182A 1982-11-02 1982-11-02 半導体集積回路 Granted JPS5986253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19295182A JPS5986253A (ja) 1982-11-02 1982-11-02 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19295182A JPS5986253A (ja) 1982-11-02 1982-11-02 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS5986253A true JPS5986253A (ja) 1984-05-18
JPH0377665B2 JPH0377665B2 (enrdf_load_stackoverflow) 1991-12-11

Family

ID=16299726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19295182A Granted JPS5986253A (ja) 1982-11-02 1982-11-02 半導体集積回路

Country Status (1)

Country Link
JP (1) JPS5986253A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111661A (ja) * 1986-10-29 1988-05-16 Mitsubishi Electric Corp 半導体集積回路装置
JPH01257348A (ja) * 1988-04-07 1989-10-13 Fujitsu Ltd スタンダード・セル集積回路装置
JPH02251169A (ja) * 1989-03-24 1990-10-08 Nec Corp 半導体集積回路装置
US6038188A (en) * 1993-06-17 2000-03-14 Matsushita Electric Industrial Co., Ltd. Data transmission circuit, data line driving circuit, amplifying circuit, semiconductor intergrated circuit, and semiconductor memory

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110297753A1 (en) 2010-12-06 2011-12-08 Mcalister Roy E Integrated fuel injector igniters configured to inject multiple fuels and/or coolants and associated methods of use and manufacture

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111661A (ja) * 1986-10-29 1988-05-16 Mitsubishi Electric Corp 半導体集積回路装置
JPH01257348A (ja) * 1988-04-07 1989-10-13 Fujitsu Ltd スタンダード・セル集積回路装置
JPH02251169A (ja) * 1989-03-24 1990-10-08 Nec Corp 半導体集積回路装置
US6038188A (en) * 1993-06-17 2000-03-14 Matsushita Electric Industrial Co., Ltd. Data transmission circuit, data line driving circuit, amplifying circuit, semiconductor intergrated circuit, and semiconductor memory

Also Published As

Publication number Publication date
JPH0377665B2 (enrdf_load_stackoverflow) 1991-12-11

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