JPS5986238A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5986238A
JPS5986238A JP58161616A JP16161683A JPS5986238A JP S5986238 A JPS5986238 A JP S5986238A JP 58161616 A JP58161616 A JP 58161616A JP 16161683 A JP16161683 A JP 16161683A JP S5986238 A JPS5986238 A JP S5986238A
Authority
JP
Japan
Prior art keywords
region
oxide
junction
films
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58161616A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6229891B2 (enrdf_load_stackoverflow
Inventor
Kunio Aomura
青村 国男
Fujiki Tokuyoshi
徳吉 藤樹
Masahiko Nakamae
正彦 中前
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58161616A priority Critical patent/JPS5986238A/ja
Publication of JPS5986238A publication Critical patent/JPS5986238A/ja
Publication of JPS6229891B2 publication Critical patent/JPS6229891B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
JP58161616A 1983-09-02 1983-09-02 半導体装置の製造方法 Granted JPS5986238A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58161616A JPS5986238A (ja) 1983-09-02 1983-09-02 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58161616A JPS5986238A (ja) 1983-09-02 1983-09-02 半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP51114052A Division JPS6035818B2 (ja) 1976-09-22 1976-09-22 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5986238A true JPS5986238A (ja) 1984-05-18
JPS6229891B2 JPS6229891B2 (enrdf_load_stackoverflow) 1987-06-29

Family

ID=15738553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58161616A Granted JPS5986238A (ja) 1983-09-02 1983-09-02 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5986238A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6229891B2 (enrdf_load_stackoverflow) 1987-06-29

Similar Documents

Publication Publication Date Title
US4074304A (en) Semiconductor device having a miniature junction area and process for fabricating same
US4408387A (en) Method for producing a bipolar transistor utilizing an oxidized semiconductor masking layer in conjunction with an anti-oxidation mask
US4191595A (en) Method of manufacturing PN junctions in a semiconductor region to reach an isolation layer without exposing the semiconductor region surface
JPH0828424B2 (ja) 半導体装置およびその製造方法
JPS5986238A (ja) 半導体装置の製造方法
JPS6244862B2 (enrdf_load_stackoverflow)
JP2526556B2 (ja) ショットキバリヤダイオ−ドの製造方法
JPS628939B2 (enrdf_load_stackoverflow)
JPS61135136A (ja) 半導体装置の製造方法
JPS61172346A (ja) 半導体集積回路装置
JPS6229889B2 (enrdf_load_stackoverflow)
JP2571449B2 (ja) バイポーラicの製造方法
JPS59107572A (ja) 半導体装置の製造方法
JPS6229890B2 (enrdf_load_stackoverflow)
JPS59134868A (ja) 半導体装置の製造方法
JPH0855999A (ja) 半導体装置
JPS639150A (ja) 半導体装置の製造方法
JPS63122161A (ja) 半導体集積回路装置の製造方法
JPS6214948B2 (enrdf_load_stackoverflow)
JPS60170258A (ja) 半導体装置の製造方法
JPS59231833A (ja) 半導体装置及びその製造法
JPS60103640A (ja) 半導体装置
JPH0371770B2 (enrdf_load_stackoverflow)
JPH0650740B2 (ja) 半導体装置
JPS61172369A (ja) 半導体装置の製造方法