JPS5985365A - Automatic soldering device - Google Patents

Abstract

PURPOSE:To provide a soldering device which prevents the thermal warpage of a printed circuit board by providing a bar which supports said board in its moving direction approximately at the center of the blow port of a solder dipping tank. CONSTITUTION:A part 7 which is not to be soldered is beforehand provided approximately at the center of a printed circuit board 6 and copper foil 8 or the like having a prescribed pattern is formed in the other part. A fitting 11 is attached to a preventive plate 9 for outflow of solder jet provided at the front and rear ends of the blow port of a solder dipping tank. A bar 10 is installed to the fitting 11 so as to cross longitudinally the approximate central part of the blow port along the moving direction of the board 6 and to make the top surface of the bar 10 approximately flush with the surface of the jetting solder. The part 7 on the board 6 is imposed on the bar 10 and the board 6 is moved over the blow port, then the centeral part of the board 6 is supported by the bar 10 and therefore the circuit board is surely soldered without warpage.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an automatic soldering device using a solder delag method.

Structure of the conventional example and its problems In the conventional automatic soldering, the apparatus is structured as shown in FIG. is formed on the back surface of the printed circuit board 3 by moving the outlet 1 in parallel in the length direction or width direction (arrow A direction in the figure) on the printed circuit board 3 while the back surface is in contact with the jetted solder 2. The copper foil and the circuit component 4 are automatically soldered together. Generally, in this type of automatic soldering device, the left and right ends 3a and 3b of the printed circuit board 3 in the moving direction are
In automatic soldering, the printed circuit board 3 is moved in parallel while being held by claws provided in the device, but in this case, the jiglint board 3 is softened by the heat of the melted solder 2, and many Since the circuit components 4 are mounted, the weight of the circuit components causes the center of the printed circuit board 3 to sag as shown in FIG. 2, causing problems such as warping of the printed circuit board 3. When the printed circuit board 3 warps in this way, as shown in FIG. 2, the jetted solder 2 rides up onto the surface of the printed circuit board 3, making not only the printed circuit board 3 but also the circuit components 4 unusable. Otherwise, the soldering near the left and right ends 3a and 3b of the printed circuit board 3 was not performed reliably.

Therefore, in order to solve this inconvenience, conventionally,
As shown in FIG. 3, the front and rear ends 3c and 3d of the printed circuit board 3 are fitted with anti-shake metal fittings 5, respectively. The soldering work was carried out after fitting around the entire circumference of the printed circuit board 3 to prevent the printed circuit board 3 from warping.

However, in the conventional example as described above, there are drawbacks such as the production of the metal fitting 5 for preventing anti-seismicity and the gloss, the adjustment and cleaning of the anti-seismicity, etc., which require a large amount of cost, and the work of attaching and removing them is complicated. was there.

Purpose of the Invention The present invention has been made in view of the drawbacks of the above-mentioned conventional examples.
The present invention provides an automatic soldering device that can easily and inexpensively prevent warping of printed circuit boards due to heat.

Structure of the Invention In order to achieve the above-mentioned object, the present invention is provided with a par for supporting a printed circuit board along the direction of movement of the printed circuit board at approximately the center of the spout of soldered cypress.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that in FIGS. 4, 5, and 6, the same reference numerals as in FIGS. 1, 2, and 3 indicate the same components. FIG. 4 is a diagram showing the structure of a printed circuit board used in an embodiment of the present invention. The soldered portion] is provided linearly in the direction of movement of the printed circuit board 6, and the other portions are provided with the copper foil 8 in a predetermined pattern. As shown in the figure, bars 10 are added to the jet solder outflow prevention plates 9 provided at the front and rear ends of the outlet 1 in the direction of movement of the printed circuit board 6.
1 are removably attached to each other by screws 12, and a bar 10 crosses approximately the center of the nozzle L longitudinally along the moving direction of the printed circuit board 6, and the upper surface of the installed par 10 is approximately connected to the surface of the solder 2 that is jetted. They are installed so that they are at the same height.

In the above configuration, when actually soldering, as shown in FIG.
Holding the left and right ends 6a and 6b respectively with respect to arrow A), and placing the unsoldered part 7 on the bar 1o, move the printed circuit board 6 to pass over the nozzle l. For example, since the central portion of the printed circuit board 6 is supported by the par 10, it is possible to reliably perform half-dipping without causing any creases.

In addition, in recent years, perforations have been made on large printed circuit boards, and additional circuit components that make up different circuit blocks are attached to the sections separated by the perforations, and these circuit components can be automatically soldered using equipment. Nowadays, soldering is performed at the same time, and then the blocks are divided into blocks. In the conventional automatic soldering of this type of large printed circuit board, when soldering is carried out using a device, creases occur especially at the perforations.
In this embodiment, when soldering is performed on such a large printed circuit board, the perforation is used as the part 7 not to be soldered, and the soldering is performed by placing it on the bar 1o.
This is particularly effective because it can prevent warping of large printed circuit boards that are particularly hot and weak, and the printed circuit board design can be applied without changing the design of the printed circuit board.

According to the experimental results, unless there are special adverse conditions, a width of 5 m for a printed circuit board with a width of 2001111+ or more
By forming a portion m that is not soldered, it is possible to sufficiently prevent warping.

As described in detail, according to the present invention, automatic soldering can very easily and inexpensively prevent the printed circuit board from warping due to the heat of time, and can reduce the complexity of equipment as in recent years. In the current situation where printed circuit boards are becoming larger, it is highly practical.

[Brief explanation of the drawing]

Figures 1 and 2 are perspective views showing the main parts of a conventional automatic soldering device, and Figure 3 is an exploded perspective view showing a conventional printed circuit board in which a fitting to prevent anti-corrosion is fitted. figure,
FIG. 4 is a plan view showing the configuration of the back side of a printed circuit board applied to an embodiment of the present invention, FIG. FIG. 6 is a perspective view showing essential parts of an embodiment of the present invention. l...Blowing mouth, 2...Solder, 3, 6...Printed circuit board, 4...Circuit components, 7...Part not to be soldered, 8...Copper foil, 10... bar. Figure 1 Figure 2 Figure 3 Δ Figure 4 Figure 5 Bi Figure 6 Δ

Claims (1)

[Claims] When molten solder is jetted from a blowing hole provided in a solder dip tank and a printed circuit board is moved in parallel over the blowing hole with the back side of the printed circuit board in contact with the spouted solder, then the back surface of the printed circuit board is In an apparatus for automatically soldering formed Genji foil and circuit components, a part where no soldering is to be performed is provided in advance so as to traverse approximately the center of the back surface of the printed circuit board, and the solder delag tank p A bar extending vertically through the outlet is installed at approximately the center of the outlet, parallel to the direction of movement of the printed circuit board, and at approximately the same height as the surface of the spouted solder. An apparatus for automatic soldering, characterized in that the printed circuit board is moved over the outlet and the back side of the printed circuit board is soldered while the part that is not to be soldered is placed on the bar.