JPS6039158Y2 - solder nozzle - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a soldering nozzle of a local soldering device used when removing electronic components soldered to a printed circuit board, soldering electronic components to a printed circuit board, etc.

Conventionally, the structure of the solder nozzle of this type of localized soldering equipment was a box-shaped solder nozzle that was placed on a pipe that guided the molten solder pushed up by the force of the pump to the spout, depending on the shape and dimensions of the various electronic components. The nozzles made of sheet metal are fixed by welding or caulking, and the upper ends of the nozzles are at the same height as shown in Figure 1, and the upper ends of the nozzles are at the same height as shown in Figure 2. The height was made lower than in the longitudinal direction over the entire width of the upper end of the two orthogonal surfaces.

In both cases, all surfaces at the upper end were flat.

When removing or soldering electronic components from a high-density mounted printed circuit board using the solder nozzle shown in Fig. 1, the ejection ports are at the same height as shown in Fig. 3, so the molten solder with a large surface tension flows out. It reaches the lead wires of the adjacent mounted electronic components on all sides and applies thermal stress to the elements of the adjacent mounted electronic components, and at the same time, the soldering of the soldered parts causes defects that must be corrected in the post-process. Ta.

In addition, like DIP type ICs, there are power terminals and ground terminals on the outside, and the corners of the spout corresponding to the positions of the lead wires and printed circuit board patterns, which require the most heat capacity, are exposed to molten solder. Due to the stagnation structure, the efficiency of heat supply to lead wires, etc. is very poor, which means that the pump has to be operated for a long time, and excessive heat is supplied to signal terminals, etc., causing heat damage to electronic components, etc. ,
The soldering was of poor quality.

The removal or soldering of electronic components from high-density mounted printed circuit boards using the solder nozzle shown in Figure 2 is the fourth step.
As shown in the figure, compared to the solder nozzle shown in Figure 1, the flow is rectified so that the molten solder flows out only in two longitudinal directions, and the length of the flow is also somewhat shorter, but it is not sufficient and Since the end face is flat, it will flow to the lead wires of electronic components mounted adjacently on both sides.Moreover, the molten solder, which has a large surface tension, will flow out while contracting in the center, so it will not flow to the outer leads, which are the power supply and ground terminals of DIP type ICs, etc. The heat supply efficiency to the wires and the printed circuit board pattern was poor, and it had the same drawback as the soldering nozzle shown in FIG.

The present invention eliminates the drawbacks of the conventional solder nozzle mentioned above, prevents molten solder from flowing out to electronic components mounted adjacently, and
By applying sufficient heat to the outer lead wires of electronic components, high-quality soldering can be achieved in a short period of time.

Efficient local soldering consists in providing a soldering nozzle of the device.

According to the present invention, two parts perpendicular to the longitudinal direction of the electronic component of the ejection port
The height on both sides of the surface is lowered from the center of the surface, grooves are provided, and the upper end surface with a lower height of the spout is sloped on the outside, and the upper end surface with a higher height is sloped on the inside. This yields a solder nozzle of .

Embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 5 shows an embodiment of the solder nozzle of the local soldering device according to the present invention.

In FIG. 5, this embodiment has a hole 14 in the center above the pipe 10 and a bottom plate 13 that is inclined toward the hole 14 side. The guide plate A11 whose end face is inclined inward has a guide frame Al at the center on two faces perpendicular to the longitudinal direction of the electronic component.
A box-shaped guide plate B12 corresponding to the shape and size of the electronic component is fixed together with a guide plate B12 whose upper end surface is inclined inward at the same height as L, and whose upper end surface is inclined outward at a height lower than the center on both sides. The spout 9 is fixed by welding and the guide plate Al
1 and the high part of the guide plate B12,
There is a guide groove 1 on the lower part of the guide plate B12.
5 are configured.

FIG. 6 is an explanatory diagram showing how molten solder contacts a printed circuit board and electronic components to apply heat and perform soldering, etc. according to the embodiment of FIG. 5.

In FIG. 6, when mounting an electronic component on a printed circuit board 16 (only a portion is shown), each lead wire 19 of an electronic component 18 is inserted into a hole 17, set directly above the spout 9 of a solder nozzle, and soldered. Molten solder 2 spouting from the spout 9 of the nozzle
1 is the lead wire 1 of the printed circuit board 16 and electronic component 18
The figure touching 9 is shown.

The molten solder 21 pushed up from the solder bath through the pipe 10 by the force of a pump (not shown) first fills the spout 9 and forms a wave crest that covers all the lead wires 19 of the electronic component 18. While contacting the lead wire 19 of the electronic component 18 and the lower surface of the printed circuit board 16.

Next, the molten solder 21 is continuously pushed up one after another by the power of the pump, and the molten solder 21 that first contacts the printed circuit board 16 etc. and gives heat requires the most amount of heat on the outside of the electronic component 18. The solder flows out one after another from the guide groove 15 of the spout 9 provided right next to the lead wire 19, which is the terminal of the power supply and ground circuit, and flows into the solder bath.

At this time, the molten solder 21 always gives heat to the outer lead wires 19 of the electronic components 18 such as power supply and ground circuits and the pattern of the printed circuit board 16 (including the holes 17 for installation) and flows out, so the heat is supplied. Efficiency is high, the pump operation time is short, and printed circuit boards 16 and electronic components 18
There is little heat damage, and the soldering quality is good.

Further, since the upper end surface of the guide plate B located directly below the guide groove 15 is inclined outward, the length of the molten solder 21 flowing out from the spout 9 in the horizontal direction is shortened.

Therefore, there is less risk that the lead wires 21 of the adjacently mounted electronic components 20 will flow out, and the adjacently mounted electronic components 20 are protected.

Also, the guide plate B located other than directly below the guide groove 15
Since the upper end surface of the guide plate A is inclined inward, the molten solder 21 spreads to the outside of the spout 9, and the area of the wave crest formed on the spout 9 is further expanded.

Therefore, the efficiency of supplying heat to the lead wire 19 of the target electronic component 18 and the pattern of the printed circuit board 16 becomes higher, and the quality of soldering improves.

Since the bottom plate 13 is inclined toward the hole 14 in the center, when the pump is stopped after removing or soldering the parts, the molten solder 21 remaining in the spout 9 smoothly passes through the hole. The molten solder 21 flows into the pipe and does not stay in the spout 9 and solidify.

As explained above, compared to conventional solder nozzles, the present invention prevents molten solder from flowing to adjacent mounted electronic components.
Heat is efficiently supplied to the lead wires of the target electronic components and the patterns on the printed circuit board, reducing processing time and improving the quality of soldering.

[Brief explanation of drawings]

Figure 1 a and b and Figure 2 a and b are front and side views of conventional solder nozzles, Figure 3 a and b and Figure 4 a and b are based on the solder nozzle of Figures 1 and 2. Figures 5a, b and c are explanatory diagrams showing molten solder being brought into contact with the printed circuit board and the lead wires of electronic components; Figures 5a and 5c are perspective views, front views, side views, and Figures 6a and 6c showing one embodiment of the present invention; b is an explanatory diagram in which molten solder is spouted into contact with the printed circuit board and the lead wire of an electronic component according to the embodiment of FIG. 5; 1... spout, 2... pipe, 3...
...Printed circuit board, 4...Mounting hole, 5.
...Electronic parts, 6...Lead wires, 7...
... Adjacent mounted electronic component, 8 ... Molten solder, 9 ... Spout, 10 ... Pipe, 1
1... Guide plate A112... Guide plate B113... Bottom plate, 14...
... Hole, 15 ... Guide groove, 16 ... Printed circuit board, 17 ... Mounting hole, 18 ...
...Electronic parts, 19...Lead wires, 20...
. . . Adjacent mounted electrical and electronic components, 21 . . . Molten solder.

Claims (1)

[Scope of utility model registration request] In the soldering nozzle of a local soldering device for printed circuit boards, etc., the height of the two sides of the nozzle orthogonal to the longitudinal direction of electronic components, except for the center part, are lowered and grooves are provided to reduce the height of the nozzle. A soldering nozzle characterized in that the upper end face is sloped on the outside, and the higher end face is sloped on the inside.