JP2001036226A - Soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce cost accompanying newly installing a soldering device, by shielding a nozzle which sprays liquid bath solder and an upper part of the nozzle which corresponds to a solder bath inhibiting area of a substrate. SOLUTION: A nozzle cap SH is provided at a nozzle plate NP at the upper part of a nozzle N, the nozzle cap SH is constituted of a shield plate TP which shields spray solder from an upper terminal of the nozzle N and of a shield part side plate SP1, which is provided by standing from an edge terminal of the shield plate TP and regulates the flow of the side of the spray solder. The shielding plate TP is so formed as to have a width L1 in the direction of rectangularly crossing the transfer direction of the substrate CB, to have equipping holes H at both left and right terminals and to have a size which covers a part of the upper surface of the nozzle N. Thus, a contact with the solder bath is inhibited so that the solder bonding at solder a bonding region SM1 after the soldering not remelts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for soldering a board on which electronic components and the like are mounted.

[0002]

2. Description of the Related Art In a circuit board in which electronic components mounted on a printed wiring board are mainly surface-mounted components and through-hole components such as discretes and connectors are arranged in several places, surface-mounted components and through-hole components are often used. A soldering method corresponding to each of the hole components is performed. For example, on the substrate CB shown in FIG. 5, the areas SM1 and SM2 where the surface-mounted components SM are mounted are subjected to a suitable reflow soldering process as a surface-mounting soldering process. Into the connector C1
TH where the discrete component C2 is mounted
1, and separately soldered to TH2. In the soldering process of the through hole TH, the surface mount component S which has been subjected to the reflow soldering process in advance is used.
It is important that the solder in the M mounting areas SM1 and SM2 is not melted again. Also, the substrate CB shown in FIG.
Is a typical example of a mass-produced product that requires two or more different soldering processes. The connector C1 which is an input / output terminal of the board CB is provided on one side of the board CB, and another large component (insertion lead) is provided. (An electronic component having the above) is arranged on a part of the substrate CB.

Conventionally, in a mass production process of soldering a board CB having such a component configuration, first, a reflow soldering process of a surface mount component SM is performed, and then a through-hole component C1,
Fixed board type (spot type) as soldering process for C2
A soldering method using a jet soldering device has been applied. The case where the soldering process of the through-hole component is performed by, for example, a board fixed type jet soldering apparatus will be described with reference to FIG. The board fixed type jet soldering apparatus 1 shown in FIG. 6 is an apparatus for performing jet soldering by circulating molten solder in a molten solder tank by a pump P, and a chimney-shaped nozzle F1 is provided in a circulation path of the molten solder. , F2, and the solder is jetted, and the upper ends S01 and S02 of the jetted molten solder are brought into contact with required soldering positions (through-hole soldering areas TH1 and TH2) of the substrate to perform soldering. At the time of soldering, the board is fixed at a predetermined position, and then the board fixed type jet soldering apparatus 1 is raised from below, and the upper ends S01 and S02 of the molten solder are soldered to the required positions TH1 and TH2 of the board CB. After the required time for soldering has elapsed, the fixed board type jet soldering apparatus 1 is lowered to perform soldering.

[0004]

As described above, the substrate CB
The electronic components mounted on the substrate CB are mainly surface-mounted components SM, and the surface-mounted components SM are previously subjected to reflow soldering with respect to a substrate CB on which through-hole components C1 and C2 such as discretes and connectors are arranged in several places. After that, when the soldering process of the through-hole components C1 and C2 on the board CB is performed using the board fixed type jet soldering apparatus 1, the soldering areas TH1 and TH2 of the through-hole components C1 and C2 are formed. A nozzle F1 for jetting solder at a position,
It is necessary to set F2 accurately. In the mass production process, each time the type of the substrate CB to be manufactured changes, the size of the substrate CB and the positions of the soldering areas TH1 and TH2 change, and each time the nozzles F1 and F2 are set. . The substrate fixed type jet soldering apparatus 1 handles solder in a molten state (for example, 245 ° C.), and setting work of the heavy-weight nozzles F1 and F2 becomes very troublesome for a manufacturing site. In particular, in a process of producing many kinds, there is a problem in workability at the time of setup change. Also, if the nozzles F1 and F2 are frequently set, the solder bath is likely to be oxidized in the atmosphere, and metal oxide dross is generated, which increases cleaning work in a high-temperature environment. is there.

[0005] Further, a general board mass production factory is provided with a reflow soldering apparatus and a flow soldering apparatus having workability suitable for mass production, but is not provided with a board fixed type jet soldering apparatus 1. Since a factory is generally used and the fixed board type jet soldering apparatus 1 is used, it is necessary to additionally prepare this equipment. For this reason, a new burden is imposed on the process management and the cost.

[0006]

According to the present invention, there is provided a soldering apparatus for immersing a substrate on which an electronic component is mounted in a flowing solder bath and soldering the electronic component on the substrate. A nozzle for ejecting the flowing solder bath and nozzle shielding means for shielding an upper surface portion of the nozzle corresponding to the solder bath immersion prohibited area of the substrate are provided.

The nozzle shielding means includes a shielding plate for covering an upper surface portion of the nozzle corresponding to the solder bath immersion prohibited area of the substrate, and an upright edge provided from an edge of the shielding plate. It is characterized by comprising a side plate for regulating the road.

The nozzle shielding means covers an upper surface portion of the nozzle corresponding to a part of the solder bath immersion prohibited area of the substrate, and includes a first shielding plate fixed to the nozzle, The first shielding plate is pressed into a slide groove formed in the first shielding plate, and is slidably fixed to the first shielding plate.
A second shielding plate that covers an upper surface portion of the nozzle corresponding to another portion different from the portion, and a side plate that stands upright from an edge of the second shielding plate and regulates an ejection flow path of the flowing solder bath. And characterized by the following.

Further, the nozzle is provided with a plurality of nozzle shielding means corresponding to the passage positions of the plurality of solder bath immersion prohibited areas of the substrate.

[0010]

Next, the configuration of a flow soldering apparatus according to a first embodiment of the present invention will be described.

FIG. 1 is an explanatory view for explaining a flow soldering apparatus according to a first embodiment of the present invention. In addition,
The (A) front view shows the flow soldering apparatus 1 with a substrate CB.
Is seen from a side surface orthogonal to the conveyance direction D of FIG. Further, FIG. 4B is a perspective view of the upper portion of the nozzle N for explaining the relationship between the shape of the upper portion of the nozzle of the flow soldering apparatus 1 and the solder jet.

The solder bath T shown in FIG. 1A is a bath in which molten solder S is accommodated, and for example, a stainless steel plate or the like is used to solder the inside of the bath such as a nozzle N to a soldering process. It is configured to accommodate a sufficient amount of molten solder S.

The molten solder S is heated at a predetermined temperature (for example, 24 ° C.) by a heating device (not shown).
5 ° C). The nozzle N for jetting the molten solder S to form the jet solder SA stands upright in the solder bath T,
One end is connected to a pump P that sends out the molten solder S, and the molten solder S is ejected from the upper end to immerse the substrate CB in the solder bath.
The molten solder S flows in the direction of the arrow shown in the figure.

A nozzle plate NP for holding the jet solder SA on the back surface of the substrate CB is provided horizontally at a predetermined distance from the back surface of the substrate CB on the ejection port side above the nozzle N. Then, the jet solder SA flows as a flow path between the back surface of the substrate CB and the nozzle plate NP, and the back surface of the board CB being conveyed comes into contact with the flow of the jet solder SA to undergo a soldering action.

As described above, the board CB being transported by the transport device (not shown) (chain conveyor or the like) is subjected to the soldering process by pressing the jet solder SA from below the substrate CB.

Further, as shown in FIG.
Side plates SP, SP0 for restricting the flow of the jet solder SA to the side surface and for causing the flow of the jet solder SA to flow in the substrate CB transport direction are provided on both sides of the upper portion of the nozzle N above the nozzle N provided inside the nozzle N. It is provided in. Then, the jet solder SA is ejected between the side plates SP and SP0 on both sides, so that the entire width of the board CB being conveyed is the jet solder SA.
And is subjected to a soldering process.

Next, a flow soldering apparatus according to a first embodiment of the present invention will be described with reference to FIG.

FIG. 2 is an explanatory diagram for explaining a flow soldering apparatus according to the first embodiment of the present invention. The through-hole region TH1 of the substrate CB shown in FIG. 5 (the substrate CB having both the through-hole region TH1 which is in contact with the solder bath and is subjected to the soldering process and the surface mounting region SM1 where the contact with the solder bath is prohibited). In the soldering process, means for inhibiting contact with the solder bath so as not to re-melt the solder joint of the surface mounting area SM1 which has been soldered before that is described. The same parts as those of the flow soldering apparatus described with reference to FIG.

First, the configuration of the nozzle cover SH will be described with reference to FIG.

The nozzle plate NP above the nozzle N is provided with a mounting hole H for mounting the nozzle cover SH.

The nozzle cover SH is provided with a shield plate TP for shielding the jet solder SA from the upper end of the nozzle N shown in FIG. 1, and is provided upright from the edge of the shield plate TP. It is made up of a shielding part side plate SP1 and is made of, for example, a stainless steel plate or the like (hereinafter, a flat member is made of a stainless steel plate or the like, and the description is omitted). The shielding plate TP has a width L1 in a direction orthogonal to the transport direction of the substrate CB, has mounting holes H at both left and right ends thereof, and is formed to have a size to cover a part of the upper surface of the nozzle N.

The position of the shielding portion side plate SP1 in the board CB transport direction is set so as to coincide with an intermediate position between the surface mounting area SM1 and the through-hole area TH1 when the board CB is transported. Further, the other edge of the shielding plate TP is provided so as to contact the inner edge of the side plate SP0. That is, the width L1 of the shielding plate TP is, as shown in FIG. 4B, from the intermediate position between the surface mounting area SM1 and the through-hole area TH1 when the substrate CB is transported, to the side plate SP0 (nozzle N To the shielded side plate). The side edge of the side plate SP0 of the substrate CB passes through the inside of the side plate SP0 at the time of transport. With such a configuration, the surface mounting area SM1 of the board CB to be transported passes above the shielding plate TP, and the through-hole area TH1 is the shielding part side plate SP1.
It passes above the outer side, that is, above the jet solder S2. Then, such a nozzle cover SH is placed so as to cover the nozzle plate NP, and its mounting hole H is aligned with the mounting hole H on the nozzle plate NP side.
It is attached to the nozzle plate NP using fasteners FN such as bolts and nuts.

Next, the situation at the time of soldering will be described with reference to FIG.

When the molten solder S is sent from the lower part of the nozzle N by the pump P, a part of the jet solder SA is blocked by the nozzle lid SH provided on the upper part of the nozzle N. The other parts are ejected upward from the space between the side plate SP and the shield side plate SP1 as the jet solder S2. When the substrate CB is transported in the direction of the arrow by a transport device (not shown) over the nozzle N, the substrate CB at a position facing the jet solder S2, that is, the through-hole area TH1, comes into contact with the jet solder S2 and a soldering process is performed. Receive.

As described above, since the opening of the nozzle N is partially shielded by the nozzle cover SH, the ejection of the jet solder SA at a position corresponding to the surface mounting area SM1 where contact with the solder bath is prohibited is prevented. , Already soldered surface mounting area SM
No re-melting of the solder joints.

Next, a flow soldering apparatus according to a second embodiment of the present invention will be described with reference to FIG.

FIG. 3 is an explanatory view illustrating a flow soldering apparatus according to a second embodiment of the present invention. Note that this drawing describes a method of adjusting the width of the nozzle cover SH described with reference to FIG. 2 by adjusting the width of the nozzle cover SH1 in FIG. In order to make the width adjustable, the shielding plate T shown in FIG.
In FIG. 3, P is divided into two plates, a shielding plate TP1 and a shielding plate TP2, and the shielding plate TP2 is slidably fixed so that the total width L2 of the shielding plates TP1 and TP2 can be adjusted. It is. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted.

First, the nozzle cover SH1 will be described with reference to FIG.
Will be described.

The nozzle plate NP above the nozzle N is provided with a mounting hole H2 for mounting the nozzle cover SH.

The nozzle cover SH1 is connected to the nozzle N shown in FIG.
Shielding plates TP1, TP for shielding jet solder SA from the upper end
2, a shield side plate SP2 for regulating the flow of the side surface of the jet of the jet solder SA, and a total width L2 of the shield plates TP1 and TP2.
(The sum of the width of the shielding plate TP1 itself and the width of the portion of the TP2 extended from the shielding plate TP1).

The shield plate TP1 is provided with mounting holes H2 for mounting the nozzle lid SH1 to the nozzle plate NP at both left and right ends thereof, and is formed in a size to cover a part of the upper surface of the nozzle. Further, the shielding plate TP1 is provided with slide grooves SL at both ends in the substrate CB transport direction for allowing the inserted shielding plate TP2 to be slidably inserted. Further, on the shielding plate TP1, the shielding plates TP1, TP1 of the nozzle cover SH1 are provided.
A moving mechanism G (for example, a worm gear mechanism) for adjusting the total width L2 of TP2 is fixed at a position between the two slide grooves SL. The shield plate TP1 is attached such that one end in a direction orthogonal to the substrate CB transport direction is in contact with the inner edge of the side plate SP0. Further, a shielding plate TP2 is inserted into the other end of the shielding plate TP1.

The shield plate TP2 is provided with a shield side plate SP2 for regulating the flow of the side surface of the jet of the jet solder SA.
It is erected from the edge of P2. The shielding plate TP2 is configured such that both ends in the substrate CB transport direction are slidably inserted into the slide grooves SL of the shielding plate TP1, and are drawn out and stored from the other end of the shielding plate TP1. By adjusting the width of the shielding plate TP2 extended from the other end of the shielding plate TP1, the total width L2 of the shielding plates TP1 and TP2 can be set.

The push rod RD is a rod-shaped member made of stainless steel or the like.
The other end is fixed to P2, and the other end is connected to the moving mechanism G fixed on the shielding plate TP1. At the connection between the push rod RD and the moving mechanism G, for example, a worm gear mechanism is provided for the moving mechanism G, and a screw is provided for the push rod RD, and the worm gear mechanism is operated to change the joint position on the push rod RD. By moving in the M direction, the length between the shield side surface plate SP2 of the push rod RD and the moving mechanism G is adjusted. Or push rod RD
And the moving mechanism G has a structure using a ball screw mechanism,
The push rod RD is rotated by a motor control unit or the like,
The length between the shield side surface plate SP2 and the moving mechanism G may be expanded and contracted in the front-rear direction M.

As described above, each member (shielding plates TP1 and TP2, shielding portion side plate SP2, push rod RD, moving mechanism G) of the nozzle cover SH1 is configured, so that the moving mechanism G is operated to operate the push rod RD. By adjusting the length between the shielding part side plate SP2 and the moving mechanism G, the width of the shielding plate TP2 extended from the other end of the shielding plate TP1 is changed, and the shielding part side plate SP2 of the nozzle lid SH1 is changed from the shielding part TP1 to the shielding plate TP1. The length up to the end on the side in contact with the inner edge of the side plate SP0 is changed. In addition, although the drawer / storing of the shielding plate TP2 is performed by the moving mechanism G, the present invention is not limited thereto, and may be performed manually.

The nozzle cover SH1 is provided on the substrate C of the shielding plate TP1.
One end in the direction perpendicular to the B transport direction is in contact with the inner edge of the side plate SP0, and is attached to the nozzle plate NP by a fastener FN through an attachment hole H2 provided in the shielding plate TP1. Next, the position of the shielding portion side plate SP2 in the board CB transport direction is the surface mounting area S when the board CB is transported.
By operating the above-mentioned moving mechanism G so as to coincide with an intermediate position between M1 and the through hole area TH1, the shielding plate TP2
Adjust the width of

That is, the total width L2 of the shielding plates TP1 and TP2
As shown in FIG. 3B, from the intermediate position between the surface mounting area SM1 and the through-hole area TH1 when the substrate CB is transported, the side plate SP0 side (the side plate on the side where the nozzle N is shielded) Length. Also, the side plate SP of the substrate CB
The edge on the zero side passes through the inside of the side plate SP0 during transport.

With such a configuration, the surface mounting area SM1 of the board CB to be transported is made up of the shielding plates TP1, T
Thus, the through hole area TH1 passes above the shield side wall plate SP2, that is, passes above the jet solder S2.

Incidentally, the shielding plate TP operated by the moving mechanism G is operated.
Adjustment of the total width L2 of the nozzle plate NP
This may be performed after the nozzle cover SH1 is mounted on the nozzle cover SH1, or before mounting. Therefore, in a mass production process for processing a large variety of substrates CB, production lots often change.
The nozzle cover SH1 that allows the adjustment of the total width L2 of the nozzle cover SH1 without removing the nozzle cover SH1 on the nozzle plate NP without removing the nozzle cover SH1 is shown in FIG.
This is very convenient as compared with the nozzle lid SH described above.

Next, the situation at the time of soldering will be described with reference to FIG.

When the molten solder S is sent out from the lower part of the nozzle N by the pump P, a part of the jet solder SA is blocked by the nozzle lid SH1 provided on the upper part of the nozzle N. , The other part is jet solder S2 from between the side plate SP and the shield side plate SP2.
And squirts upwards.

When the substrate CB is conveyed over the nozzle N by a conveying device (not shown) in the direction of the arrow, the substrate CB facing the jet solder S2, that is, the through-hole area TH1, comes into contact with the jet solder S2. Receives soldering process.

As described above, since the opening of the nozzle N is partially shielded by the nozzle cover SH1, the jet solder SA at a position corresponding to the surface mounting area SM1 where contact with the solder bath is prohibited.
Is prevented and the soldered surface mounting area S
There is no re-melting of the solder joint of M1.

Next, a flow soldering apparatus according to a third embodiment of the present invention will be described with reference to FIG.

FIG. 4 is an explanatory view for explaining a flow soldering apparatus according to a third embodiment of the present invention. The drawing shows two separate through-hole regions TH1 and TH2.
And a soldering process for a substrate CB having two surface mounting regions SM1 and SM2 divided in advance by reflow soldering. 1 and 2
The same reference numerals are given to the same parts as those described in the above, and the description will be omitted.

First, the nozzle cover SH will be described with reference to FIG.
2 and SH3 will be described.

The nozzle cover SH2 is connected to the nozzle N shown in FIG.
A shielding plate TP3 that shields the jet solder SA from the upper end; and a shielding portion side plate SP3 that is erected from the edge of the shielding plate TP3 and regulates the flow of the jet of the jet solder SA.
The shielding plate TP3 has a width L3 in a direction orthogonal to the direction of transport of the substrate CB, has mounting holes H3 on both left and right ends thereof, and is formed to have a size that partially covers the upper surface of the nozzle N.

The position of the shielding portion side plate SP3 in the board CB transport direction is set so as to coincide with the intermediate position between the surface mounting area SM2 and the through-hole area TH2 when the board CB is transported. Further, the other edge of the shielding plate TP3 is provided so as to contact the inner edge of the side plate SP0. That is, the width L3 of the shielding plate TP3 is, as shown in FIG. 4B, from the intermediate position between the surface mounting area SM2 and the through-hole area TH2 when the substrate CB is transported, from the side plate SP.
The length is up to the 0 side.

The nozzle cover SH3 is connected to the nozzle N shown in FIG.
A shielding plate TP4 that shields the jet solder SA from the upper end; and a shielding portion side plate SP4 and a shielding portion side plate SP5 that stand upright from the edge of the shielding plate TP4 and that restrict the flow of the jet of the jet solder SA. The shielding plate TP4 has a width L4 in a direction orthogonal to the direction of transport of the substrate CB, has mounting holes H4 at both left and right ends thereof, and is formed to have a size that partially covers the upper surface of the nozzle N.

The position of the shield side plate SP4 in the board CB transfer direction is set so as to coincide with the intermediate position between the surface mounting area SM1 and the through-hole area TH2 when the board CB is transferred. Furthermore, the shielding part side plate SP5
The position in the board CB transfer direction is determined by the surface mounting area SM1 and the through-hole area TH1 when the board CB is transferred.
Are set to coincide with the intermediate position between That is, the width L4 of the shielding plate TP4 is, as shown in FIG.
Surface mounting area SM1 and through-hole area T when transporting B
The length from the intermediate position with H1 to the intermediate position between the surface mounting area SM1 and the through-hole area TH2.

During transport, the side plate SP0 of the substrate CB is
The edge on the side plate SP0 passes through the inside of the side plate SP, and the edge on the side plate SP side of the substrate CB passes through the inside of the side plate SP.

Next, the situation at the time of soldering will be described with reference to FIG.

The nozzle covers SH2 and SH3 are provided above the nozzle N.
Is attached, and when the molten solder S is sent out from the lower part of the nozzle N by the pump P, a part of the jet solder SA is blocked by the nozzle lids SH2 and SH3 provided on the upper part of the nozzle N,
Other parts are jetted upward as jet solder S4 between the side plate SP and the shield side plate SP5 and jet solder S3 from between the shield side plate SP4 and the shield side plate SP3.

When the substrate CB is conveyed in the direction of the arrow by the conveying device (not shown) over the nozzle N, the substrate CB at the position facing the jet solders S3 and S4, ie, the through-hole area TH2 and the through-hole area TH1 comes into contact with the jet solders S3 and S4 and undergoes soldering processing.

As described above, since the opening of the nozzle N is partially covered by the nozzle lids SH2 and SH3, the flow of the jet solder SA at a position corresponding to the surface mounting areas SM1 and SM2 where contact with the solder bath is prohibited. Spouting is prevented, and the solder joints of the already soldered surface mounting areas SM1 and SM2 do not re-melt.

In order to apply the embodiment of the present invention described with reference to FIGS. 2, 3 and 4, the substrate CB must be
In the component layout design stage, as shown in FIG. 5, the substrate CB is divided in the width direction, and the surface mount component regions SM1, S
M2 (solder bath contact prohibited area) and through hole area TH
1 and TH2 (solder bath contact area).

As described above, after the components of the surface mount component regions SM1 and SM2 in the substrate CB are soldered in advance by, for example, reflow soldering, the through hole regions TH1 and
When the component lead R of the TH2 is soldered using the flow soldering apparatus 1, the surface mount component areas SM1, S2
Since the nozzle N at a position corresponding to the passage position of M2 is locally shielded by the nozzle covers SH2 and SH3 to avoid contact with the solder jet SA (solder bath), a solder joint has already been generated. The soldering of the through-hole TH can be performed by bringing the through-hole areas TH1 and TH2 into contact with the solder bath without affecting the area.

Although the nozzle lid used in this process is a nozzle lid having a fixed shielding length in the width direction, a variable-length nozzle lid having an adjustable shielding length is used to improve workability in the soldering process. May be used.

[0058]

As described above in detail, according to the present invention, even if the type of the substrate is changed, it is not necessary to introduce a new soldering device, and the existing flow soldering device can be used. It became possible to deal with it. As a result, it is possible to reduce costs associated with the introduction of a new soldering apparatus, and to avoid new problems relating to work management and solder quality.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating a flow soldering device.

FIG. 2 is an explanatory diagram illustrating a flow soldering apparatus according to a first embodiment of the present invention.

FIG. 3 is an explanatory diagram illustrating a flow soldering apparatus according to a second embodiment of the present invention.

FIG. 4 is an explanatory diagram illustrating a flow soldering apparatus according to a third embodiment of the present invention.

FIG. 5 is an explanatory diagram illustrating an example of arrangement of mounted components on a substrate.

FIG. 6 is an explanatory diagram for explaining a conventional board-fixed type jet soldering apparatus.

[Explanation of symbols]

 CB: substrate FN: fastener G: moving mechanism N: nozzle NP: nozzle plate P: pump RD: push rod SA, S1: jet solder SH: Nozzle lid SM1: Surface mounting component area SP: Side plate TH1: Through hole area TP: Shielding plate

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B23K 3/00 310 B23K 3/00 310R // B23K 101: 42

Claims (4)

[Claims] 1. A soldering apparatus for immersing a substrate on which an electronic component is mounted in a flowing solder bath and soldering the substrate to the electronic component, comprising: a nozzle for ejecting the flowing solder bath; A nozzle shielding means for shielding an upper surface portion of the nozzle corresponding to the immersion prohibited area. 2. The nozzle shielding means comprises: a shielding plate that covers an upper surface portion of a nozzle corresponding to a solder bath immersion prohibited area of the substrate; and a standing plate that is erected from an edge of the shielding plate. 2. The soldering apparatus according to claim 1, comprising a side plate for regulating a road. 3. The nozzle shielding means covers an upper surface portion of a nozzle corresponding to a part of a solder bath immersion prohibited area of the substrate, and comprises a first shielding plate fixed to the nozzle, Another part which is pushed into a slide groove formed in the first shielding plate and is slidably fixed to the first shielding plate, and which is different from the one portion of the solder bath immersion prohibited area of the substrate. A second shielding plate that covers an upper surface portion of the nozzle corresponding to the portion, and a side plate that stands upright from an edge of the second shielding plate and regulates a flow path of the flowing solder bath. The soldering device according to claim 1, wherein 4. The nozzle according to claim 2, wherein the nozzle is provided with a plurality of nozzle shielding means corresponding to the passage positions of the plurality of solder bath immersion prohibited areas of the substrate. Soldering equipment.