JP2001267729A - Method and device for mounting electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To materialize the removal of the oxide film of metal constituting an electrode before soldering and the dirt by simple preliminary treatment, and at the same time lower the heating temperature at soldering. SOLUTION: In a disclosed method of mounting an electronic part, a printed wiring board 1, where an electronic part 4 is so mounted as to be positioned through solder paste 3A on a land 2 corresponding to a lead 5, is carried to a plasma cleaning treatment unit 17. The lead 5 of the electronic part 4 before soldering and the land 2 of the printed wiring board 1 are cleaned by plasma, and than the electronic part 4 is mounted on the face of the printed wiring board 1 by soldering.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method and an electronic component mounting apparatus, and more particularly, to mounting of an electronic component in which electrodes of the electronic component are connected to corresponding electrodes of a printed wiring board by soldering. About the method.

[0002]

2. Description of the Related Art Various electronic devices are assembled using printed wiring boards on which electronic components such as LSIs (Large Scale Integrated Circuits), transistors, resistors, and capacitors are mounted. Conventionally, such electronic components are mounted on a printed wiring board by using soldering, which is a type of brazing. In this soldering, a solder (for example, an alloy of Sn and Pb) made of a metal or an alloy having a lower melting point than a base material (electrodes of an electronic component and corresponding electrodes of a printed wiring board) connected to each other is used. The two base materials are connected by melting the solder.
Thus, the electronic components are configured so that electrical connection and mechanical holding between the electronic components are performed by the printed wiring board.

Conventionally, two methods have been used to mount electronic components on a printed wiring board by soldering. One is a surface mounting method as shown in FIG. 10, in which a lead (electrode) 52 of an electronic component 51 is connected to a printed wiring board 53.
Is connected to the corresponding lands (electrodes) 54 on the surface of the device via solder 55. The other is an insertion mounting method as shown in FIG. 12, in which the lead 52 of the electronic component 51 is inserted into a corresponding through hole 56 penetrating the inside of the printed wiring board 53, and This is a method of connecting via a solder 55 to a corresponding land 57 formed.

In the surface mounting method described above, as shown in FIG. 11, a solder paste 58 is printed in advance on a land 54 on the surface of a printed wiring board 53, and the solder paste
After mounting the electronic component 51 on the printed wiring board 53 so as to position the lead 52 on the printed wiring board 8,
Is passed through a reflow furnace to melt the solder paste 58, so that the leads 52 are soldered to the lands 54, that is, a so-called reflow soldering method.

[0005] In the above insertion and mounting method, as shown in FIG. 13, after the leads 52 of the electronic component 51 are inserted into the through holes 56 of the printed wiring board 53 in advance, the printed wiring board 53 is placed on the jet of solder. And the solder is adhered from the back surface of the printed wiring board 53 to solder the leads 52 to the lands 57 by a so-called dip soldering method (flow soldering method).

[0006] In the soldering as described above, the solder which is heated and melted wets both the lead of the electronic component as a base material and the land of the printed wiring board, thereby forming the solder, the lead and the land. This is achieved by causing a chemical reaction when the electrode constituent metal approaches at the atomic level to cause a chemical reaction, so that the solder and the electrode constituent metal are metal-bonded. Therefore, the wettability between the molten solder and the metal constituting the electrode is a basic condition for obtaining a good connection by soldering.

[0007] From the moment when the above-mentioned metal constituting the electrode is formed on the electronic component and the printed wiring board, the adsorption and oxidation of the surrounding gas molecules progress microscopically, and the surrounding dust, oil and fats and the like macroscopically. The dirt is developed. Among them, particularly, oxidation and contamination of the metal constituting the electrode greatly affect the above-mentioned wettability. Therefore, conventionally, a flux has been used to remove an oxide film and a stain of a metal constituting an electrode. Here, the action of the flux depends on the chemical activity. Generally, the higher the activity, the higher the degree of removal of the oxide film and the stain. However, the activity of the flux cannot be determined unequivocally,
Taking into account the performance of electronic components, printed wiring boards, heating furnaces, etc., which are actually used, adjust so that the optimum activity is obtained for each production plant, and remove oxide films and dirt to improve wettability. It is devised to secure and perform good soldering.

[0008]

However, in the conventional electronic component mounting method as described above, the activity of the flux used before soldering needs to be adjusted optimally each time mounting is performed. There is a problem that the preliminary processing before attaching becomes complicated. That is, in the conventional method of mounting electronic components, the flux activity must be adjusted in consideration of the capabilities of the electronic components used, the printed wiring board, the heating furnace, and the like as described above. Since it becomes necessary to repeat trial and error in adjusting the flux which is the processing, it is inevitable that the preliminary processing becomes troublesome.

In the conventional mounting method of electronic components, when a plurality of electronic components having different heat capacities are mounted on a common printed wiring board, the heating at the time of soldering is effected by the influence of the oxide film of the metal constituting the electrodes and contamination. There is a problem that setting a high temperature is inevitable. That is, in order to configure a desired electronic circuit, various electronic components necessary for this are mounted on a common printed wiring board, but since the electronic components used are different in type, shape, dimensions, etc. In spite of the different heat capacities of the electronic components (specifically, the heat capacities of the electrodes), they are mounted on printed wiring boards having different heat capacities for different types and soldered by simultaneous heating. In this case, an electronic component having a large heat capacity has a property that the temperature of its electrode does not easily rise, while an electronic component having a small heat capacity has a property that the temperature of its electrode tends to rise.
Therefore, generally, the heating temperature at the time of soldering the electronic component is set to a temperature at which the electrode of the electronic component having the largest heat capacity is melted.

However, if the heating temperature at the time of soldering is set so as to be suitable for an electronic component having a large heat capacity, the electronic component having a small heat capacity will be heated more than necessary. There is a risk that electronic components will be destroyed. On the contrary, if the heating temperature at the time of soldering is set low in order to eliminate these drawbacks, electronic components having a large heat capacity are not sufficiently heated, so that it becomes difficult to perform good soldering. Here, as described above, the setting of the heating temperature at the time of soldering largely depends on the oxide film and dirt of the metal constituting the electrode, and if these degrees are large, the heating temperature must be set high. Setting the heating temperature at the time of soldering high as described above is not preferable because thermal stress is applied to each electronic component and the printed wiring board.

The electronic components used for mounting are generally purchased from a specialized manufacturer for each product type. However, the manufacturing conditions, storage conditions, cleaning control conditions of the electrodes within the specialized manufacturer, and the specialized manufacturers Transport conditions and storage conditions in the logistics process after shipment, as well as storage conditions after delivery to the production factory where they are mounted, are different, so the oxide film and dirt on the electrode constituent metals are managed under certain conditions. It is impossible to do.

As described above, since the oxide film and the dirt of the metal constituting the electrode greatly change depending on the condition of the electronic component before mounting, it is difficult to suppress the degree of the oxide film and the dirt as a result. However, for the reasons described above, the heating temperature must be set high.

The present invention has been made in view of the above-mentioned circumstances, and it is possible to realize the removal of an oxide film and dirt of a metal constituting an electrode before soldering by a simple preliminary treatment. An object of the present invention is to provide an electronic component mounting method and an electronic component mounting apparatus capable of lowering a heating temperature.

[0014]

According to one aspect of the present invention, there is provided a method of mounting an electronic component, wherein an electrode of the electronic component is connected to a corresponding electrode of a printed wiring board by soldering. The electronic component and the printed wiring board are subjected to a plasma cleaning process before soldering.

According to a second aspect of the present invention, there is provided the electronic component mounting method according to the first aspect, wherein electrodes of the electronic component are inserted into corresponding through holes of the printed wiring board, and electrodes are provided around the through holes. The above-mentioned printed wiring board on which is formed is subjected to a plasma cleaning treatment.

According to a third aspect of the present invention, there is provided the electronic component mounting method according to the first aspect, wherein electrodes of the electronic component are inserted into corresponding through holes of the printed wiring board, and electrodes are provided around the through holes. The above-mentioned printed wiring board on which is formed is subjected to a plasma cleaning treatment.

According to a fourth aspect of the present invention, there is provided a method for mounting an electronic component according to the first, second or third aspect, wherein at least an electrode of the electronic component and a corresponding electrode of the printed wiring board are subjected to a plasma cleaning process. Features.

According to a fifth aspect of the present invention, there is provided the electronic component mounting method according to any one of the first to fourth aspects, wherein the plasma cleaning processing is performed by using a plasma gas formed by an arc jet method. It is characterized by spraying onto a printed wiring board.

According to a sixth aspect of the present invention, there is provided an electronic component mounting apparatus used in an electronic component mounting method using a surface mounting method, comprising: a wiring board supply unit for supplying a printed wiring board to which the electronic component is to be soldered; A solder paste printing unit for printing a solder paste on an electrode formed in advance on the printed wiring board, an electronic component supply unit for supplying the electronic component, and mounting the electronic component at a desired position on the printed wiring board An electronic component mounting portion, a solder reflow portion for melting the solder paste and mounting the electronic component on the printed wiring board by soldering, and a plasma cleaning process for performing a plasma cleaning process on the electronic component and the printed wiring board before soldering And a processing unit.

According to a seventh aspect of the present invention, there is provided the electronic component mounting apparatus according to the sixth aspect, wherein the plasma cleaning unit is disposed at a position before the solder reflow portion. .

According to an eighth aspect of the present invention, there is provided an electronic component mounting apparatus used in an electronic component mounting method by an insertion mounting method, wherein an input side conveyor for supplying a printed wiring board in which an electronic component to be soldered is inserted in advance. A plasma spraying section for performing a plasma cleaning process on the electronic component and the printed wiring board before soldering, a solder jetting section for jetting molten solder to the electronic component and the printed wiring board, and the electronic component and the printed wiring board A cooling unit that cools, an output conveyor that discharges the printed wiring board after soldering,
It is characterized by including a wiring board conveying section provided between the input side conveyor and the output side conveyor.

According to a ninth aspect of the present invention, there is provided the electronic component mounting apparatus according to the eighth aspect, wherein the plasma spraying portion is arranged at a position before the solder jetting portion.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. The description will be specifically made using an embodiment. First Embodiment FIGS. 1 and 2 are process diagrams showing a configuration of an electronic component mounting method by a surface mounting method according to a first embodiment of the present invention, and FIGS.
FIG. 4 is a diagram illustrating a configuration of an electronic component mounting apparatus used in the electronic component mounting method, and FIG. 4 is a diagram schematically illustrating a plasma cleaning unit used in the electronic component mounting apparatus. As shown in FIG. 3, the electronic component mounting apparatus used in the electronic component mounting method according to the surface mounting method of this example includes a wiring board supply unit 11 for supplying a printed wiring board to which an electronic component is to be soldered, Solder paste printing unit 1 that prints solder paste on lands formed in advance on a wiring board
2, an electronic component supply unit 13 for supplying a chip-shaped electronic component, an electronic component mounting unit 14 for mounting the electronic component at a desired position on the printed wiring board, and a solder paste for melting the electronic component onto the printed wiring board. A solder reflow unit 15 for mounting by soldering, a wiring board storage unit 16 for storing a printed wiring board on which electronic components have been mounted, and a plasma cleaning processing unit for performing plasma cleaning processing on electronic components and printed wiring boards before soldering 17. Here, the plasma cleaning processing unit 17 is disposed, for example, at a position between the electronic component mounting unit 14 and the solder reflow unit 15. That is, this plasma cleaning unit 1
7 can be arranged at any position as long as it is located before the solder reflow unit 15.

As shown in FIG. 4, the plasma cleaning unit 17 includes a chamber 2 having openings 21 on both sides.
The opening 21 can be opened and closed by a shutter 23 so that the printed wiring board 1 on which the electronic components 4 conveyed by the conveyor 24 are loaded into the chamber 22 can be loaded. . Chamber 22
A wiring board supporting portion 25 for supporting the printed wiring board is provided in the inside, and the wiring board supporting portion 25 is slidable left and right by a slide portion 26, and is inserted into the chamber 22 through the opening 21. 1 is carried in or the printed wiring board is carried out of the chamber 22.

Next, with reference to FIGS. 1 to 4, a method of mounting an electronic component by the surface mounting method of this embodiment using the electronic component mounting apparatus will be described in the order of steps. First, as shown in FIG. 1A, using a printed wiring board 1 having a land (electrode) 2 connected to a wiring pattern made of, for example, Cu at a desired position on the surface, the electronic component shown in FIG. Is carried into the wiring board supply unit 11 of the mounting device for mounting. The printed wiring board 1 is mounted on a conveyor (not shown), and is conveyed to the solder paste printing unit 12 by the conveyor.

Next, as shown in FIG. 1B, in the solder paste printing section 12, the land 2 of the printed wiring board 1 is printed.
The solder paste 3A is printed thereon. This solder paste can be easily printed by using a well-known screen printing method or the like. After the completion of the solder paste printing, the printed wiring board 1 is transported to the electronic component supply unit 13 by a conveyor. The electronic components are supplied to the printed wiring board 1 in the electronic component supply unit 13. In the supply of the electronic components, a plurality of electronic components, which are integrally mounted and conveyed by a reel, a cassette, a tray, or the like, are individually taken out by vacuum tweezers or the like and supplied to the printed wiring board. Thereafter, the printed wiring board 1 is transported to the electronic component mounting section 14 by a conveyor.

Next, as shown in FIG. 2C, in the electronic component mounting portion 14, the electronic component 4 is printed by positioning the lead (electrode) 5 on the corresponding land 2 via the solder paste 3A. It is mounted on the wiring board 1. After the mounting of the electronic components, the printed wiring board 1 is transported to the plasma cleaning unit 17 by a conveyor. The electronic component 4 is conveyed in the plasma cleaning processing unit 17 of FIG. 4 with the one shutter 23, for example, the right shutter 23 opened, and the printed wiring board 1 on which the electronic component 4 is mounted is moved to the right opening. 21 and transferred to the wiring board support 25. Then, after the wiring board support portion 25 is transported into the chamber 22 by the slide portion 26, the shutter 23 is closed.

Next, while maintaining the inside of the chamber 22 in a vacuum plasma atmosphere, the components including the lands 2 of the printed wiring board 1 and the leads 5 of the electronic components 4 are subjected to plasma cleaning processing. In this case, as the plasma gas, for example, O2, H
e, CF4, etc., and plasma modes such as RIE (Reactive Ion Etching), DP (Direct Plasma)
Can be selected. By such a plasma cleaning process, the oxide film and the dirt formed on the lands 2 of the printed wiring board 1 and the leads 5 of the electronic component 4 can be almost completely removed by the plasma energy. Therefore, at the time of soldering, which will be described later, it is possible to ensure the wettability between the solder and the metal constituting the electrode. In addition, the above-described plasma cleaning process can be performed as a simple preliminary process by using ordinary plasma technology.

After the plasma cleaning processing is completed, in the plasma cleaning processing unit 17, the printed wiring board 1 on which the electronic component 4 is mounted is opened through the left opening 21 while the other shutter 23 on the left side is opened. Transfer from the support part 25 to the conveyor 24. Then, the printed wiring board 1 is transported to the solder reflow unit 15 by a conveyor.

Next, as shown in FIG. 2D, in the solder reflow section 15, the printed wiring board 1 is passed through a reflow furnace to melt the solder paste 3, thereby forming the solder 3 and forming the lead 5 Is soldered to the corresponding land 2, and the electronic component 4 is surface-mounted on the printed wiring board 1. After the completion of the electronic component mounting, the printed wiring board 1 is transported to the wiring board storage unit 16 by a conveyor. The printed wiring board 1 on which the electronic components 4 are mounted as necessary is shipped as a product.

As described above, the electronic component 4 before soldering
By subjecting the lead 5 and the land 2 of the printed wiring board 1 to a plasma cleaning treatment, the oxide film and dirt of the lead 5 and the land 2 as the metal constituting the electrode can be almost completely removed. In addition to ensuring the wettability, the setting of the heating temperature at the time of soldering can be kept low. Therefore, thermal stress applied to each electronic component and the printed wiring board during soldering can be reduced.

As described above, according to the configuration of the electronic component mounting method by the surface mounting method of this embodiment, the electronic component 4 is mounted so that the lead 5 is positioned on the corresponding land 2 via the solder paste 3A. The printed wiring board 1 is transported to the plasma cleaning processing unit 17, and the leads 5 of the electronic component 4 and the lands 2 of the printed wiring board 1 before the soldering are subjected to the plasma cleaning processing, and then the electronic component 4 is soldered. Since the surface is mounted on the printed wiring board 1, good soldering can be performed while ensuring wettability. Also, according to the electronic component mounting apparatus of this example, the electronic component 4
In a series of configurations for surface-mounting the printed wiring board 1 on the printed wiring board 1 by soldering,
Is arranged at an arbitrary position before the solder reflow portion 15, so that the lead 5, which is a metal constituting an electrode, is formed before soldering.
In addition, since the configuration can be made such that the oxide film and the dirt on the land 2 can be almost completely removed, it is possible to obtain a mounting device capable of removing the oxide film and the dirt of the metal constituting the electrode with a relatively simple configuration. Therefore, removal of the oxide film and dirt of the metal constituting the electrode before soldering can be realized by a simple pretreatment, and the heating temperature during soldering can be reduced accordingly.

Second Embodiment FIGS. 5 and 6 are process diagrams showing a configuration of a method for mounting an electronic component by an insertion mounting method according to a second embodiment of the present invention, and FIG. FIGS. 8 and 9 are views showing a configuration of an electronic component mounting apparatus to be used, and FIGS. 8 and 9 are views showing main parts of the electronic component mounting apparatus. The electronic component mounting method according to the second embodiment of the present invention is significantly different from the configuration of the first embodiment described above in that the present invention is applied to an electronic component mounting method using an insertion mounting method. An electronic component mounting apparatus used in the electronic component mounting method according to the insertion mounting method of this example is, as shown in FIG. 7, an input-side conveyor for supplying a printed wiring board 1 into which electronic components 4 to be soldered are inserted in advance. 31, a plasma spraying unit 32 for performing a plasma cleaning process on the electronic component 4 and the printed wiring board before soldering
, A flux supply unit 33 and a purifying air blowing unit 34
Radiant heating section 35, solder jet section 36, cooling section 37
, A cutter section 38, a cleaning section 39, an output side conveyor 40, and a wiring board transport section 41 provided between the input side conveyor 31 and the output side conveyor 40.

The plasma spraying section 32 is provided for spraying a plasma gas formed by, for example, a well-known arc jet method onto a printed wiring board from an arc jet nozzle to perform a plasma cleaning process on electronic components and the printed wiring board. I have. The plasma cleaning process removes oxide films and stains on electronic components and printed wiring boards.

As shown in FIG. 8, the solder jetting section 36 is provided with a first jetting machine 44 for melting a solder 43 filled in a container 42 into a first wave 45 and a second jetting machine 4.
6, a second wave 47 is formed, and the solder 3 is jetted on the back surface of the printed wiring board 1. As shown in FIG. 9, the wiring board transport unit 41 includes a top plate 48.
The printed wiring board 1 is sandwiched between the lower holding plate 49 and the upper holding plate 50, which are lowered from above, and the printed wiring board 1 is transported.

Next, with reference to FIGS. 5 to 7, a method of mounting an electronic component by the insertion mounting method of this example using the mounting device for an electronic component will be described in the order of steps. First, FIG.
As shown in FIG.
The printed wiring board 1 inserted into the electronic component mounting apparatus is carried into the input side conveyor 31 of the electronic component mounting apparatus shown in FIG. 7, and the printed wiring board 1 is supplied to the wiring board conveying section 41 by the input side conveyor 31.

Next, as shown in FIG. 5B, in the plasma spraying section 32, a plasma gas is blown from the arc jet nozzle 30 to the back surface of the printed wiring board 1, so that the lands 7 and The components including the leads 5 of the electronic component 4 are subjected to a plasma cleaning process. By such a plasma cleaning process, the oxide film and the dirt formed on the lands 7 of the printed wiring board 1 and the leads 5 of the electronic component 4 can be almost completely removed by the plasma energy. Therefore, at the time of soldering described later,
The wettability between the solder and the metal constituting the electrode can be ensured. In addition, the above-described plasma cleaning process can be performed as a simple preliminary process by using ordinary plasma technology.

Next, after the flux is applied to the printed wiring board 1 in the flux supply unit 33, the printed wiring board 1 is purified by blowing air to the printed wiring board 1 in the cleaning air blowing unit 34. Next, in the radiation heating section 35, the printed wiring board 1 is preheated.

Next, as shown in FIG.
8, the lead 5 is soldered to the corresponding land 7 by spraying the solder 3 on the back surface of the printed wiring board 1 with the configuration as shown in FIG. Next, in the cooling unit 37, the electronic component 4 is inserted and mounted on the printed wiring board 1 by cooling the printed wiring board 1 and cooling the solder 3. Next, the printed wiring board 1 is cut into a desired shape by the cutter unit 38, and after the cleaning process is completed by the cleaning unit 39, the printed wiring board 1 is carried out to the output side conveyor 40. The printed wiring board 1 on which the electronic components 4 are mounted as necessary is shipped as a product.

As described above, the lead 5 of the electronic component 4 and the land 2 of the printed wiring board 1 before soldering in a state where the electronic component 4 is inserted into the printed wiring board 1 are subjected to the plasma cleaning process, whereby the electrode structure is formed. Since the oxide film and dirt on the lead 5 and the land 2 as metal can be almost completely removed, substantially the same effects as in the first embodiment can be obtained.

As described above, according to the configuration of the electronic component mounting method according to the insertion mounting method of this example, the printed wiring board 1 in which the leads 5 of the electronic component 4 are inserted into the through holes 6 can be used.
After being conveyed to the plasma spraying section 32, the leads 5 of the electronic component 4 and the lands 7 of the printed wiring board 1 before soldering are subjected to plasma cleaning processing, and then the electronic component 4 is inserted and mounted on the printed wiring board 1 by soldering. Therefore, good soldering can be performed while ensuring wettability. Also,
According to the electronic component mounting apparatus of this example, in a series of configurations for inserting and mounting the electronic component 4 on the printed wiring board 1 by soldering, the plasma sprayed portion 32 is positioned at an arbitrary position before the solder jet portion 36. , The oxide film and the dirt of the lead 5 and the land 7, which are the metal constituting the electrode, can be almost completely removed before soldering. Can be obtained. Therefore, substantially the same effects as in the first embodiment can be obtained.

Although the embodiment of the present invention has been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and there may be changes in the design without departing from the gist of the present invention. Is also included in the present invention. For example, the method of mounting electronic components by the surface mounting method is not limited to the case where electronic components are mounted on one side of a printed wiring board, but is also applicable to the case where electronic components are mounted on both sides of a printed wiring board. Can be. Also, the method of mounting electronic components by the insertion mounting method is not limited to the example in which electronic components are inserted from one side of a printed wiring board, and can be applied to the case where electronic components are mounted from both sides of a printed wiring board.

Further, the method of performing the plasma cleaning processing is not limited to the example using the plasma cleaning unit in the first embodiment, and a plasma spraying unit may be used. Further, the second embodiment is not limited to the example using the plasma spraying unit, but may use a plasma cleaning unit. Further, the position where the plasma cleaning unit or the plasma spraying portion is provided can be provided at any position as long as it is a position before soldering.

When the electronic components mounted or inserted on the printed wiring board cannot withstand the vacuum atmosphere during the plasma cleaning process, only the printed wiring board alone is subjected to the plasma cleaning process in the vacuum atmosphere to remove the electronic components. The cleaning may be performed using other plasma cleaning means such as an arc jet method.

[0045]

As described above, according to the electronic component mounting method of the present invention, the electronic component and the printed wiring board are subjected to plasma cleaning before soldering, and thereafter the electronic component is soldered. Since it is mounted on the printed wiring board, good soldering can be performed while ensuring wettability. Further, according to the electronic component mounting apparatus of this example, in a series of configurations for mounting the electronic component on the printed wiring board by soldering, the means for performing the plasma cleaning process may be any arbitrary position before the soldering position. , The oxide film and the dirt of the electrode constituent metal can be almost completely removed before soldering. Therefore, the oxide film and the dirt of the electrode constituent metal can be removed with a relatively simple configuration. Can be obtained.
Therefore, removal of the oxide film and dirt of the metal constituting the electrode before soldering can be realized by a simple pretreatment, and the heating temperature during soldering can be reduced accordingly.

[Brief description of the drawings]

FIG. 1 is a process chart showing a configuration of an electronic component mounting method by a surface mounting method according to a first embodiment of the present invention.

FIG. 2 is a process diagram showing a configuration of a mounting method of the electronic component.

FIG. 3 is a view showing a configuration of an electronic component mounting apparatus used in the electronic component mounting method.

FIG. 4 is a view schematically showing a plasma cleaning unit used in the electronic component mounting apparatus.

FIG. 5 is a process diagram showing a configuration of an electronic component mounting method by an insertion mounting method according to a second embodiment of the present invention.

FIG. 6 is a process chart showing a configuration of a mounting method of the electronic component.

FIG. 7 is a view showing a configuration of an electronic component mounting apparatus used in the electronic component mounting method.

FIG. 8 is a view showing a main part of the electronic component mounting apparatus.

FIG. 9 is a diagram showing a main part of the electronic component mounting apparatus.

FIG. 10 is a diagram showing a mounting method of an electronic component by a conventional surface mounting method.

FIG. 11 is a view showing a mounting method of the electronic component.

FIG. 12 is a diagram illustrating a mounting method of an electronic component by a conventional insertion mounting method.

FIG. 13 is a view showing a mounting method of the electronic component.

[Explanation of symbols]

 Reference Signs List 1 printed wiring board 2, 7 land (electrode) 3 solder 3A solder paste 4 electronic component 5 lead (electrode) 6 through hole 11 wiring board supply unit 12 paste printing unit 13 electronic component supply unit 14 electronic component mounting unit 15 solder reflow unit Reference Signs List 16 Wiring board storage unit 17 Plasma cleaning unit 21 Opening 22 Chamber 23 Shutter 24 Conveyor 25 Wiring board support unit 26 Slide unit 30 Arc jet nozzle 31 Input side conveyor 32 Plasma spray unit 33 Flux supply unit 34 Purification air blowing unit 35 Radiant heating part 36 Solder jet part 37 Cooling part 38 Cutter part 39 Cleaning part 40 Output side conveyor 41 Wiring board transport part 42 Container 44, 46 Jet machine 45, 47 Wave 48 Top plate 49 Lower holding plate 50 Upper holding plate

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H05K 3/26 H05K 3/26 A

Claims (9)

[Claims] An electronic component mounting method for connecting electrodes of an electronic component to corresponding electrodes of a printed wiring board by soldering, wherein the electronic component and the printed wiring board are subjected to plasma cleaning before soldering. A method for mounting an electronic component, comprising: 2. The method for mounting an electronic component according to claim 1, wherein the printed wiring board in which the electrodes of the electronic component are positioned on the corresponding electrodes via a solder paste is subjected to a plasma cleaning process. . 3. The printed wiring board, wherein electrodes of the electronic component are inserted into corresponding through holes of the printed wiring board, and electrodes are formed around the through holes.
The method for mounting an electronic component according to claim 1, wherein a plasma cleaning process is performed. 4. The method of mounting an electronic component according to claim 1, wherein at least an electrode of the electronic component and a corresponding electrode of a printed wiring board are subjected to a plasma cleaning process. 5. The electronic device according to claim 1, wherein the plasma cleaning process is performed by spraying a plasma gas formed by an arc jet method onto a printed wiring board from an arc jet nozzle. Component mounting method. 6. An electronic component mounting apparatus used in an electronic component mounting method by a surface mounting method, wherein: a wiring board supply unit for supplying a printed wiring board to which the electronic component is to be soldered; A solder paste printing unit that prints a solder paste on an electrode formed in advance, an electronic component supply unit that supplies the electronic component, and an electronic component mounting unit that mounts the electronic component at a desired position on the printed wiring board. A solder reflow portion for melting the solder paste and mounting the electronic component on the printed wiring board by soldering, and a plasma cleaning unit for performing a plasma cleaning process on the electronic component and the printed wiring board before soldering. An electronic component mounting apparatus, characterized in that: 7. The electronic component mounting apparatus according to claim 6, wherein the plasma cleaning processing unit is disposed at a position before the solder reflow unit. 8. An electronic component mounting apparatus used in an electronic component mounting method by an insertion mounting method, comprising: an input-side conveyor for supplying a printed wiring board into which an electronic component to be soldered is inserted in advance; A plasma spraying section for performing a plasma cleaning process on the electronic component and the printed wiring board; a solder jetting section for jetting molten solder to the electronic component and the printed wiring board; and a cooling section for cooling the electronic component and the printed wiring board. And an output-side conveyor for discharging the printed wiring board after soldering, and a wiring board transport unit provided between the input-side conveyor and the output-side conveyor. apparatus. 9. The electronic component mounting apparatus according to claim 8, wherein the plasma spraying part is arranged at a position before the solder jet part.