KR20210109747A - Printed Circuit Board Soldering Apparatus - Google Patents

Abstract

A printed circuit board soldering device in accordance with the present invention comprises: a flux spray unit for supplying flux onto a printed circuit board requiring soldering; a board fixing pallet mounted with a printed circuit board to which the flux has been applied; a transport unit to which the board fixing pallet is combined to be separable; a lead tub arranged below the transport unit; and a control unit for adjusting the operation of the flux spray unit and the transport unit. In a state that the board fixing pallet mounted with a printed circuit board to which the flux has been applied is combined with the transport unit, the control unit performs the process of soldering automatically through the control of the transport unit by adjusting the time of the board fixing pallet moving onto the lead tub in a vertical direction, the temperature of the lead tub, and the time of the printed circuit board being immersed in the lead tub.

Description

Printed Circuit Board Soldering Apparatus

The present invention relates to a soldering apparatus that automatically performs a soldering process including the transfer of a board fixed pallet on which a printed circuit board is required for soldering, a temperature of a soldering tank, and a time for a printed circuit board to be immersed in a soldering tank.

Soldering is commonly used when assembling electronic components onto printed circuit boards (PCBs). It is also used to interconnect copper pipes in a plumbing system. The seams of sheet metal objects such as food cans, roof waterproofing, drains, and automobile radiators have historically been soldered, and some still use it. Also, jewelry is assembled or repaired by soldering. Soldering is used to join lead cam and copper foil in tinted glass processing. Soldering is also used to semi-permanently seal holes in bowls or containers.

Soldering includes wave soldering in which a small amount is passed through a container for storing molten solder, soldering using an infrared lamp, soldering by heating such as an electric soldering iron, brazing using a torch, and methods using hot air. Recently, countercurrent soldering is mostly used for surface mount printed circuit board assembly, and in some cases assembling with wave soldering or manual soldering of connectors with many pins or oddly sized pointed parts.

Deep soldering refers to a method in which a circuit board into which a component is inserted is soldered while contacting the stationary surface of a molten solder, and a small-scale soldering process in which an electronic component is soldered to a printed circuit board (PCB) to form an electronic assembly am. Solder is the part not protected by the solder mask that wets the exposed metal parts of the board to make a reliable mechanical and electrical connection.

Deep soldering is used for both through-hole printed circuit assembly and surface mount, it is one of the cheapest methods of soldering and is widely used in small industries in developing countries.

In general, deep soldering requires manual work equivalent to manual wave soldering, and the equipment required is a small tank of molten solder. When the molten solder sticks to the exposed metal parts of the board, the PCB with the mounted components is manually tanked.

Conventionally, in order to solder a printed circuit board using a lead-in dipping machine, a person directly holds the printed circuit board and puts it in a solder bath in which lead is melted to perform soldering. There is a problem in that the quality of soldering is deteriorated due to non-uniformity of time and pressure to put in the soldering tank.

On the other hand, as a dipping machine equipped with a sprayer, a sprayer that sprays flux on the lead pins of small electronic components mounted on the printed circuit board and the land portion of the printed circuit board is provided integrally with the dipping machine to improve the convenience of soldering operation As a conventional document that presents a technology related to a dipping machine equipped with a sprayer, Korean Utility Document No. 20-0419552 may be referred to.

(Patent Document 1) KR20-0419552 B

The present invention is to solve the above problems of the prior art, and automatically performs the soldering process including the transfer of the board fixed pallet with the printed circuit board required for soldering, the temperature of the soldering bath, and the time the printed circuit board is immersed in the soldering bath. As a proposal for a soldering device in progress, printing on lead contained in a solder tank through a process of moving a board fixed pallet equipped with a printed circuit board in a state in which flux is applied through a flux spraying unit in an up-down direction using a transfer unit Through the process of allowing the circuit board to be immersed, the transfer of the board fixed pallet equipped with the printed circuit board that requires soldering without manually putting the printed circuit board in the solder bath, the temperature of the solder bath and the printed circuit board on the solder bath It is to provide and do a soldering device that automatically performs the soldering process including the immersion time.

According to one aspect of the present invention, there is provided a printed circuit board soldering apparatus comprising: a flux spraying unit for supplying a flux onto a printed circuit board requiring soldering; a substrate fixing pallet on which a printed circuit board in a flux-coated state is mounted; a transfer unit to which the substrate fixing pallet is detachably coupled; a lead tank disposed on the lower portion of the transfer unit; and a control unit for regulating the operations of the flux spraying unit and the transfer unit, wherein in a state in which a substrate fixing pallet mounted with a printed circuit board in a flux-coated state is coupled to the transfer unit, the control unit comprises: Through the control of the transfer unit, the soldering process is automatically performed by adjusting the vertical movement of the substrate fixing pallet to the solder tank, the temperature of the solder tank, and the time the printed circuit board is immersed in the solder tank.

The transfer unit includes an elevating post on which elevating guide rails are formed along the elevating guide rail in a state disposed on one side of the lead tank, and an elevating unit operably coupled up and down along the elevating guide rail, wherein the elevating unit includes the elevating guide rail It has an elevating body coupled directly to the elevating body, a lifting plate fixed on the lifting body, and a pallet mounting portion that is coupled to the lifting plate in a width-adjustable manner.

According to another aspect of the present invention, there is provided a printed circuit board soldering method comprising: supplying a flux onto a printed circuit board requiring soldering by using a flux spraying unit; Mounting the printed circuit board in a flux-coated state on the substrate fixing pallet; Controlling the transfer unit according to a program preset in the control unit to lower the lifting unit, immersing a part of the printed circuit board coupled to the substrate fixing pallet on the solder tank to perform soldering; and controlling the transfer unit to raise the lifting unit after confirming that the temperature of the solder tank and the time the printed circuit board is immersed in the solder tank meet the reference values preset in the control unit.

The printed circuit board soldering apparatus according to the present invention as described above automatically performs the soldering process including the transfer of the board fixed pallet with the printed circuit board required for soldering, the temperature of the soldering tank, and the time the printed circuit board is immersed in the soldering tank. To propose a soldering device that proceeds as a soldering device, through a process of moving a board fixed pallet equipped with a printed circuit board in a state in which flux is applied through a flux spraying unit in a vertical direction using a transfer unit, Through the process of allowing the printed circuit board to be immersed, the transfer of the board fixed pallet equipped with the printed circuit board that requires soldering without manually putting the printed circuit board in the solder tank, the temperature of the solder tank and the printed circuit board on the solder tank The soldering process including the immersion time is automatically performed.

The present invention solves the problem that the quality of soldering is deteriorated due to non-uniformity of time and pressure for putting a printed circuit board in a soldering tank in the process of doing it manually.

1 shows the overall configuration of a printed circuit board soldering apparatus according to an embodiment of the present invention.
2 shows an operation process of the printed circuit board soldering apparatus according to the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be embodied in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and the scope of the invention to those of ordinary skill in the art It is provided for complete disclosure. In the drawings, like reference numerals refer to like elements.

In adding reference numerals to the components of each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

Hereinafter, a printed circuit board soldering apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2 .

A printed circuit board soldering apparatus according to the present invention includes a flux spraying unit 10 for supplying flux onto a printed circuit board requiring soldering, a board fixing pallet 20 on which a printed circuit board in a state in which the flux is applied is mounted, a board It includes a transfer unit 30 to which the fixed pallet is detachably coupled, a soldering tank 40 disposed on the lower portion of the transfer unit, and a control unit 50 for controlling the operation of the flux spraying unit and the transfer unit.

The flux spraying unit 10 has a rectangular parallelepiped shape with an open top, and a structure is formed so that the substrate fixing pallet 20 can be mounted on the upper open part. For example, a stepped portion is formed on the upper end of the flux spraying unit 10 to enable stable mounting of the substrate fixing pallet 20 . A plurality of flux injection holes 110 and a flux recovery hole 120 disposed between the plurality of flux injection holes are provided on the inner lower surface of the flux injection unit 10 . A flux nozzle is disposed on the flux nozzle. The number and arrangement of the flux injection port and the flux recovery port can be appropriately adjusted.

The flux spraying unit 10 needs to transfer the paste-like flux onto the bumps of the electronic components before the process of mounting the electronic components on the printed circuit board in order to securely bond the electronic components on the printed circuit board. The flux functions to prevent oxidation of the surface of the bump or to remove the surface oxide film formed on the surface of the bump. In addition, when heat is applied to the bumps for bonding the bumps, the flux lowers the melting point of the bumps so that adjacent bumps do not come into contact with each other, thereby preventing the bumps from being energized.

The transfer unit 30 is a lifting post 310 arranged along the vertical direction in a state disposed on one side of the lead tank 40, and a lifting guide rail 320 formed on one surface of the lifting post 310 in the vertical direction. ) and a lifting unit 330 coupled to be operable up and down along the elevating guide rail. The transfer unit 30 may be operated by a linear motor driving method as an example.

The lifting unit 330 is a lifting body 331 directly coupled to the lifting guide rail 320 , a lifting plate 332 fixed on the lifting body 331 , and a width adjustable on the lifting plate 332 . It has a plurality of pallet mounting portions 333 coupled to each other.

The lifting plate 332 may have a square plate shape in which a plurality of mounting portion adjustment grooves are formed. The plurality of mounting portion adjustment grooves may have a structure formed radially with respect to the center of the lifting plate 332 . Specifically, each of the plurality of mounting portion adjustment grooves may be formed to extend from the center of the lifting plate 332 toward the outer corner of the lifting plate 332 . Through this, the plurality of pallet mounting units 333 may be four arranged on the outer corner of the lifting plate 332 . Under the above structure, a plurality of pallet mounting units 333 are arranged to be slidable along the mounting unit adjustment groove.

Each of the plurality of pallet mounting units 333 is in a state capable of sliding along the mounting unit control groove in a state where the upper end thereof is penetrated through the mounting unit control groove. A plurality of pallet mounts 333 is formed to extend in the lower direction of the elevating plate 332, the pallet support legs 334, the pallet support legs 334, which are bent inward from the lower end of the coupling protrusions 335 and the pallets. and a fixed dial 336 detachably coupled to the upper end of the mounting leg 334 . The coupling protrusion 335 has a 'C'-shaped groove formed therein to enable sliding insertion along the horizontal direction of the substrate fixing pallet 20 .

The fixed dial 336 is fixed on the upper end of the pallet holder leg 334 by a screw method, and when the position is fixed in a state in which the pallet holder 333 is moved through the holder adjustment groove, the fixed dial ( 336) is used to stably fix the pallet holder 333 on the lifting plate 136.

The lead bath 40 has a chamber shape in which lead, which is a material for soldering, is accommodated in a molten state. A heating pipe 410 is disposed on one side of the lead tank 40 . The heating pipe 410 maintains lead in a state suitable for soldering through the process of supplying heat from a heating source supplied from the outside to the inside of the solder tank 40 .

Hereinafter, an operation process of the printed circuit board soldering apparatus will be described with reference to FIG. 2 .

First, a model of the printed circuit board is selected on the control unit 50 ( S10 ), and the printed circuit board is mounted on the substrate fixing pallet 20 ( S12 ).

The flux is supplied on the printed circuit board requiring soldering by using the flux spraying unit 10 (S14).

The flux injection unit 10 is controlled through the control unit 50 . In order to apply the flux to the soldering surface of the printed circuit board, when the user presses the operation switch attached to the flux spray unit 10, the control unit 50 sets and executes the opening and closing time of the spray nozzle to spray the flux to the printed circuit board. do. The injection nozzle may have a structure disposed radially on the flux injection port.

Thereafter, a process of checking whether the flux is applied on the printed circuit board is performed (S16).

Next, the substrate fixing pallet 20 to which the printed circuit board to which the flux is applied is fixed on the transfer unit 30 is combined (S18).

In the step S18, the plurality of pallet mounting units 333 are adjusted to be slidable along the mounting unit adjustment groove formed on the lifting plate 332 to fit the size of the substrate fixing pallet 20 to be coupled. Thereafter, it enables horizontal sliding insertion of the substrate fixing pallet 20 along the 'C'-shaped groove formed in the coupling protrusion 335 .

Next, it is checked whether the temperature of the solder tank 30 matches the temperature set for each model of the printed circuit board according to a condition preset in the control unit (S20).

In the step S20, when the temperature of the solder tank 30 meets the temperature range set for each model of the printed circuit board, the transfer unit is controlled according to the conditions set in the control unit to lower the elevating unit and coupled to the board fixing pallet. Soldering is performed by partially immersing the printed circuit board on the solder bath (S22).

On the other hand, when the temperature of the lead bath 30 does not match the temperature range set for each model of the printed circuit board in step S20 , the temperature of the lead bath 30 is set through the additional heat source supply through the heating pipe 410 . Wait until it matches (S21).

In the state S22, the control unit determines whether the dipping time satisfies a time preset in the control unit (S24).

In the step S24, after checking whether the time that the printed circuit board is immersed on the solder tank meets the reference value preset in the control unit, the transfer unit is controlled to raise the elevator (S26).

On the other hand, if the dipping time does not satisfy the time preset in the control unit in step S24, sufficient dipping is performed through additional time administration (S25).

After step S26, the operation of separating the substrate fixed pallet from the transfer unit 30 (S28), and waits for a standby command (S30).

As described above, in a state in which the fixed substrate pallet on which the printed circuit board is mounted in a flux-coated state is coupled to the transfer unit, the control unit moves the substrate fixed pallet up and down on the soldering iron through the control of the transfer unit. It is characterized in that the soldering process is automatically performed by controlling the temperature of the temperature and the time the printed circuit board is immersed in the soldering bath.

The printed circuit board soldering apparatus according to the present invention automatically performs the soldering process including the transfer of the board fixed pallet with the printed circuit board required for soldering, the temperature of the soldering bath, and the time the printed circuit board is immersed in the soldering bath. As a proposal of an apparatus, a printed circuit board is placed on lead contained in a solder tank through a process of moving a board fixed pallet equipped with a printed circuit board in a state of flux applied through a flux spraying unit in the vertical direction using a transfer unit. Through the process of allowing the immersion, the transfer of the board fixed pallet equipped with the printed circuit board that requires soldering without manually putting the printed circuit board in the solder bath, the temperature of the solder bath, and the time the printed circuit board is immersed in the solder bath The soldering process including

The present invention solves the problem that the quality of soldering is deteriorated due to non-uniformity of time and pressure for putting a printed circuit board in a soldering tank in the process of doing it manually.

The above description is merely illustrative of the technical spirit of the present invention, and various modifications and variations will be possible without departing from the essential characteristics of the present invention by those skilled in the art to which the present invention pertains. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

10: flux injection unit
20: board fixing pallet
30: transfer unit
310: elevating post
320: elevating guide rail
330: elevator
331: elevating body
332: lifting plate
333: pallet holder
334: pallet mounting legs
335: bonding protrusion
336: fixed dial
40: lead
50: control unit

Claims (3)

a flux spraying unit for supplying flux onto a printed circuit board requiring soldering;
a substrate fixing pallet on which a printed circuit board in a flux-coated state is mounted;
a transfer unit to which the substrate fixing pallet is detachably coupled;
a lead tank disposed on the lower portion of the transfer unit; and
Including; a control unit for controlling the operation of the flux injection unit and the transfer unit;
In a state in which the substrate fixing pallet mounted with the printed circuit board in the flux-coated state is coupled to the transfer unit,
The control unit automatically proceeds the soldering process by controlling the vertical movement of the substrate fixing pallet to the solder tank, the temperature of the solder tank, and the time the printed circuit board is immersed in the solder tank through the control of the transfer unit. Characterized in the printed circuit board soldering apparatus.
The method of claim 1,
The transfer unit is
In a state disposed on one side of the lead tank, it includes an elevating post having elevating guide rails formed along the up-down direction, and an elevating unit coupled to be operable up and down along the elevating guide rail,
The lifting unit is characterized in that it has an elevating body directly coupled to the elevating guide rail, an elevating plate fixed on the elevating body, and a pallet mounting unit coupled to the elevating plate so as to be adjustable in width, a printed circuit board soldering device .
In the printed circuit board soldering method using the printed circuit board soldering apparatus according to claim 1,
supplying a flux onto a printed circuit board requiring soldering by using a flux spraying unit;
Mounting the printed circuit board in a flux-coated state on the substrate fixing pallet;
Controlling the transfer unit according to a program preset in the control unit to lower the lifting unit, immersing a part of the printed circuit board coupled to the substrate fixing pallet on the solder tank to perform soldering; and
After confirming that the temperature of the lead tank and the time the printed circuit board is immersed in the lead tank meet the reference values preset in the control unit, controlling the transfer unit to raise the lifting unit; printing, comprising: Circuit board soldering method.

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