CN106332468A - Welding machine and welding method - Google Patents
Welding machine and welding method Download PDFInfo
- Publication number
- CN106332468A CN106332468A CN201610737553.4A CN201610737553A CN106332468A CN 106332468 A CN106332468 A CN 106332468A CN 201610737553 A CN201610737553 A CN 201610737553A CN 106332468 A CN106332468 A CN 106332468A
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- pcb board
- wave
- soldering
- bonding machine
- welding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a welding machine, which comprises a dip soldering device, a pin cutting device and a wave soldering device, wherein the dip soldering device is used for carrying out dip soldering operation on a PCB through the dip soldering device; the pin cutting device is used for carrying out pin cutting operation on the PCB through the pin cutting device; and the wave soldering device is used for carrying out wave soldering operation on the PCB through the wave soldering device. The dip soldering device and the wave soldering device are integrated into the welding machine for soldering the PCB, and the pin cutting device is introduced for cutting the pins which are fixed through dip soldering in the PCB, so that electronic components in the to-be-welded PCB are suitable for carrying out soldering operation on the wave soldering device in the welding machine no matter that the pins are long pins or short pins while the pin cutting quality is ensured; and supplementary soldering is carried out on welding spots on which virtual welding and welding leakage can exist after being soldered once through the dip soldering device while the application range of the welding machine is ensured, thereby improving the welding quality of the PCB.
Description
Technical field
The present invention relates to welding technology field, be specifically related to a kind of bonding machine and welding method.
Background technology
At present, in the assembling production process of electronic product, it usually needs electronic devices and components are arranged on pcb board, then
By bonding machine, electronic devices and components are welded and fixed.
In prior art, conventional bonding machine has dip-soldering machine, mainly by being existed by the pcb board of good for plug-in mounting electronic devices and components
Wicking in the stannum stove of dip-soldering machine, thus once complete the welding of numerous electronic devices and components solder joint.But, this bonding machine is to welding
Cross range request higher, such as, there is certain requirement the pcb board immersion angle of stannum stove, the time etc..Thus cause electronics unit device
The welding quality of part is the most unstable, for patch capacitor, and chip inductor, the electronics that the various precision such as paster integrated circuit are higher
Components and parts, the most easily produce the situation such as rosin joint, solder skip, affect the quality of electronic product.
And in prior art, the bonding machine that a kind of welding quality is higher is wave-soldering unit, it is by wave-soldering unit
Wave soldering furnace in spray crest shape scolding tin, the pcb board of the good electronic devices and components of plug-in mounting is through crest shape scolding tin, the weldering of required welding
Point contacts with crest shape scolding tin, and the welding of numerous solder joint is done step-by-step during pcb board moves.The welding of this bonding machine
Quality is higher, but due at Wave soldering furnace nozzle the degree of depth of crest shape scolding tin relatively low, easily the pins with long foot components and parts occur
Interfere, for being fitted with the pcb board of long foot components and parts inapplicable, have impact on the scope of application of bonding machine.
Summary of the invention
It is desirable to provide a kind of applied widely, and the high bonding machine of welding quality and welding method.
For achieving the above object, the invention provides a kind of bonding machine, including: immersed solder device, for pcb board is soaked
Weldering operation；Foot cut device, for carrying out cutting operation to pcb board；And Wave-soldering device, for pcb board is carried out wave-soldering
Operation；Immersed solder device, foot cut device, Wave-soldering device are applied in combination and enter the pcb board with long pin electronic components and parts successively
Row processes, and wherein, immersed solder device can be used for that the pcb board with long pin electronic components and parts carries out immersed solder and operates with fixing PCB
The pin of long pin electronic components and parts in plate, foot cut device can carry out cutting operation to the pcb board fixing pin through immersed solder,
Wave-soldering device can carry out wave-soldering operation to the pcb board of the electronic devices and components having short foot after cutting operates.
Further, mounting bracket, there is installing space, Wave-soldering device, foot cut device and immersed solder device are contained in
In installing space and be fixed in mounting bracket.
Further, also include Handling device, for realize to pcb board between each processing stations automatic transporting behaviour
Make.
Further, Handling device includes: slipway mechanism, is arranged in mounting bracket, and extends in a first direction；Clamping
Mechanism, is movably disposed on slipway mechanism, for pcb board is clamped, wherein, immersed solder device, foot cut device and
Wave-soldering device is arranged in bonding machine in the first direction.
Further, clamping device includes claw and drives the actuator of claw clamping pcb board.
Further, Handling device includes: connecting gear, is separately positioned on immersed solder device and foot cut device, and cutting
Between device and Wave-soldering device；Drive mechanism, for coordinating with connecting gear, to drive connecting gear motion to transmit pcb board.
Further, connecting gear includes that flexible transmission band, corresponding drive mechanism include motor.
Further, connecting gear includes: the first connecting gear, and its first end is connected with the discharge end of immersed solder device, the
Two ends are connected with the feed end of foot cut device；Second connecting gear, its first end is connected with the discharge end of foot cut device, the second end
It is connected with the feed end of Wave-soldering device.
Further, having Wave soldering furnace in Wave-soldering device, Wave-soldering device also includes for carrying out Wave soldering furnace position
The governor motion of regulation, governor motion is for being adjusted height and position and/or the horizontal level of Wave soldering furnace.
Further, the feed end of bonding machine and discharge end are additionally provided with and enter panel assembly and ejecting plate for pcb board of plugging into
Device.
The present invention also provides for a kind of welding method, comprises the following steps: step S10: soak the pcb board of required welding
Weldering operation；Step S20: the pcb board operated through immersed solder is carried out cutting operation；Step S30: to the PCB operated through cutting
Plate carries out Wave crest Welding operation.
Technical solution of the present invention, has the advantage that
1. in the bonding machine that the present invention provides, by immersed solder device integrated in bonding machine, Wave-soldering device for right
Pcb board welds, and introduces foot cut device, such that it is able to need fixing through immersed solder in pcb board according to welding
Pin carries out cutting, while ensureing cutting quality, makes again the longest foot of electronic devices and components in the pcb board of required welding also
It is that short foot is all applicable to bonding machine medium wave peak welder and is subjected to, is so ensureing the scope of application same of bonding machine
Time, owing to bonding machine can carry out secondary welding by Wave-soldering device, to that may be present after immersed solder device once welds
The solder joint of rosin joint and solder skip carries out supplementing welding, thus the bonding machine that improve the welding quality of pcb board, the such as present invention is permissible
Meet patch capacitor, chip inductor, the welding of the electronic devices and components that the various precision requirement such as paster integrated circuit are higher.
2. in the bonding machine that the present invention provides, by arranging mounting bracket to immersed solder device, foot cut device and crest
Welder is installed and accommodates, it is simple in bonding machine, immersed solder device, foot cut device and Wave-soldering device are integrated, convenient welding
Switching between the different operatings such as immersed solder operation in machine, cutting operation and wave-soldering operation.
3. in the bonding machine of the present invention, by arranging Handling device in bonding machine, by Handling device to in leaching
The pcb board carrying out operating between the devices such as welder, foot cut device and Wave-soldering device carries out carrying operation, is so easy to reality
The automatization of existing bonding machine, still has been able to the welding operation of pcb board in the case of left unguarded, is ensureing higher welding
While quality, further increase the scope of application of bonding machine of the present invention, be particularly suited for the operator such as colleges and universities, laboratory
Not there is the situation of the welding knowledge of specialty, the burden of the personnel of operation can also be alleviated simultaneously to a certain extent.
4. in the bonding machine that the present invention provides, by the height and position that arrange welding medium wave peak stove are adjusted
Adjustment structure, and then in bonding machine, can preferably make wave crest welding device fit mutually with the situation of the required pcb board welded
Join, and then reduce the difficulty of operation, simultaneously after scolding tin quickly consumes the decline of scolding tin position, can be by regulation Wave soldering furnace
Height, so that scolding tin position adapts with the position of the required pcb board welded, so without carrying out frequently adding stannum, improves just
Profit degree, beneficially bonding machine require low place in the operation such as colleges and universities, laboratory, improve applicable scope, the most further
Improve the scope of application of bonding machine.
5. in the bonding machine of the present invention, by arranging into panel assembly and board discharging device at the two ends of bonding machine, thus
When pcb board is subjected to, it is only necessary to pcb board is placed on panel assembly, or connect with other transmission equipment
Refute, the pcb board of required welding can be sent in bonding machine, by the Handling device pcb board to required welding by entering panel assembly
Carry out carrying and carry out ensuing operation, after welding completes, by board discharging device, the pcb board processed is sent, this
The whole bonding machine of sample uses personnel convenient to operate and operates, and improves the scope of application of bonding machine.
6. use the welding method of the present invention, first by the immersed solder device in bonding machine, the pcb board of required welding is entered
Row immersed solder operates, thus while realizing welding pcb board, achieves fastening for the pin of electronic devices and components in pcb board,
Secondly use foot cut device that pcb board is carried out cutting operation, make the longest foot of electronic devices and components in the pcb board of required welding also
It is that short foot is all applicable to bonding machine medium wave peak welder and is subjected to, finally uses Wave-soldering device that pcb board is carried out ripple
Peak weldering operation, thus carry out secondary welding by Wave-soldering device, to rosin joint that may be present after immersed solder device once welds
Carry out supplementing welding with the solder joint of solder skip, thus improve the welding quality of pcb board.
Accompanying drawing explanation
In order to be illustrated more clearly that the specific embodiment of the invention or technical scheme of the prior art, below will be to specifically
In embodiment or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not paying creative work
Put, it is also possible to obtain other accompanying drawing according to these accompanying drawings.In the accompanying drawings:
Fig. 1 is the structural representation of the tin soldering machine of the embodiment of the present invention；
Fig. 2 is the structural representation of tin soldering machine medium wave peak furnace apparatus shown in Fig. 1.
Wherein, the reference in above-mentioned accompanying drawing is:
10-mounting bracket；20-immersed solder device；30-foot cut device；40-Wave-soldering device；41-Wave soldering furnace；42-regulates machine
Structure；51-slipway mechanism；52-clamping device；521-claw；71-enters panel assembly；72-board discharging device；91-preheating device；92-sprays
Mist device.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical scheme is clearly and completely described, it is clear that described enforcement
Example is a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under not making creative work premise, broadly falls into the scope of protection of the invention.
As it is shown in figure 1, the bonding machine according to embodiments of the present invention, including: immersed solder device 20, for filling through immersed solder
The pcb board putting 20 carries out immersed solder operation；Foot cut device 30, for carrying out cutting operation to the pcb board through foot cut device 30；With
And Wave-soldering device 40, for the pcb board through Wave-soldering device 40 carries out wave-soldering operation, immersed solder device 20, cutting fill
Put 30, Wave-soldering device 40 is applied in combination and processes the pcb board with long pin electronic components and parts successively, wherein, and immersed solder
Device 20 can be used for that the pcb board with long pin electronic components and parts carries out immersed solder and operates with pin electronic long in fixing pcb board
The pin of components and parts, foot cut device 30 can carry out cutting operation, Wave-soldering device 40 to the pcb board fixing pin through immersed solder
The pcb board of the electronic devices and components having short foot after cutting operates can be carried out wave-soldering operation.
Thus in the bonding machine that the present invention provides, by immersed solder device 20 integrated in bonding machine, Wave-soldering device 40
For pcb board is welded, and introduce foot cut device 30, such that it is able to according to welding need in pcb board through immersed solder
The pin fixed carries out cutting, is ensureing while cutting quality, make again electronic devices and components in the pcb board of required welding without
Discuss long foot or short foot is all applicable to bonding machine medium wave peak welder 40 and is subjected to, so ensure being suitable for of bonding machine
While scope, owing to bonding machine can carry out secondary welding by Wave-soldering device 40, once weld through immersed solder device 20
The solder joint of rear rosin joint that may be present and solder skip carries out supplementing welding, thus improves the welding quality of pcb board.The such as present invention
Bonding machine can meet patch capacitor, chip inductor, the electronics unit that the various precision requirement such as paster integrated circuit are higher
The welding of device.
Certainly, in bonding machine of the present invention, except being operated required welding by immersed solder operation, cutting operation and wave-soldering
Pcb board weld outside, it is also possible to according to actual job demand, individually carry out immersed solder operation, cutting operation and ripple
Peak weldering operation；Or carry out cutting operation after first carrying out immersed solder operation；Or carry out wave-soldering operation after first carrying out immersed solder operation.
I.e. the bonding machine of the present invention is in addition to the good scope of application and welding quality, it is also possible to use multiple difference according to job demand
Mode of operation, there is the wider scope of application.
Specifically, the bonding machine in the embodiment of the present invention also includes: mounting bracket 10, has installing space, and the present invention is real
Execute in example and hold for the Wave-soldering device 40 that the pcb board of required welding is processed, foot cut device 30 and immersed solder device 20
It is contained in installing space and is fixed in mounting bracket 10.So by arranging mounting bracket 10 to immersed solder device 20, cutting dress
Put 30 and Wave-soldering device 40 install and accommodate, it is simple to immersed solder device 20, foot cut device 30 and crest in bonding machine
Welder 40 is integrated, facilitates the switching between the different operatings such as immersed solder operation in bonding machine, cutting operation and wave-soldering operation.
As it is shown in figure 1, the bonding machine according to embodiments of the present invention also includes Handling device, for realization, pcb board is existed
Automatic transporting operation between each processing stations.So relative to manually the pcb board of required processing being carried, it is simple to realize
The automatization of bonding machine, still has been able to the welding operation of pcb board in the case of left unguarded, is ensureing higher welding matter
While amount, further increase the scope of application of bonding machine of the present invention, be particularly suited for the operator such as colleges and universities, laboratory also
Not there is the situation of the welding knowledge of specialty, the burden of the personnel of operation can also be alleviated simultaneously to a certain extent.
Specifically, Handling device in embodiments of the present invention includes: slipway mechanism 51, is arranged in mounting bracket 10,
And extend in a first direction；Clamping device 52, is movably disposed on slipway mechanism 51, for clamping pcb board, right
Answering, immersed solder device 20, foot cut device 30 and Wave-soldering device 40 are arranged in bonding machine in the first direction, so in clamping
Mechanism 52 along when moving on the slipway mechanism 51 extended in a first direction, immersed solder device 20, foot cut device 30 and ripple
Peak welder 40 is the most in the direction, it is simple to operate pcb board.More specifically, for the clamping that pcb board is clamped
Mechanism 52 includes claw 521 and drives claw 521 to clamp the hydraulic part as actuator of pcb board, drives card by hydraulic part
The opening and closing of pawl 521, thus realize the clamping of pcb board.
In another not shown embodiment of the present invention, Handling device includes connecting gear, the most flexible transmission band, point
It is not arranged between immersed solder device 20 and foot cut device 30, and foot cut device 30 and Wave-soldering device 40, for adding required
The pcb board of work is carried between different devices；Drive mechanism, is specifically as follows motor, by coordinating with connecting gear,
To drive connecting gear motion to transmit pcb board, it is achieved that the carrying operation of pcb board.
More specifically, the connecting gear in this embodiment includes: the first connecting gear, its first end and immersed solder device 20
Discharge end connects, and the second end is connected with the feed end of foot cut device 30；Second connecting gear, its first end and foot cut device 30
Discharge end connects, and the second end is connected with the feed end of Wave-soldering device 40.
Further, having Wave soldering furnace 41 in the Wave-soldering device 40 in the various embodiments described above of the present invention, crest is welded
Putting 40 governor motions 42 also including for being adjusted Wave soldering furnace 41 position, this governor motion 42 is for Wave soldering furnace 41
Height and position and horizontal level are adjusted or are individually adjusted the height of Wave soldering furnace 41 or individually to Wave soldering furnace
The horizontal level of 41 is adjusted.And then in bonding machine, can preferably make wave crest welding device and the required pcb board welded
Situation is suitable, and then reduces the difficulty of operation, simultaneously after scolding tin quickly consumes the decline of scolding tin position, and can be by regulation
The height of Wave soldering furnace 41 is so that scolding tin position adapts, so without adding frequently with the position of the required pcb board welded
Stannum, improves convenience degree, and beneficially bonding machine requires low place in the operation such as colleges and universities, laboratory, improves applicable model
Enclose, i.e. further increase the scope of application of bonding machine.
As in figure 2 it is shown, governor motion 42 includes being connected the screw structure supporting Wave soldering furnace 41 with wave-soldering furnace, and with silk
The female knob of band that bumper structure coordinates, knob is spindle rotationally arranged in the support for supporting Wave soldering furnace 41, leading screw
Through this knob, by screwing knob, drive guide screw movement can realize the regulation of Wave soldering furnace 41.
A kind of in a not shown embodiment of the present invention, adjustment structure includes the hydraulic stem being connected with Wave soldering furnace 41, also wraps
Include the hydraulic cylinder that one end is fixed on Wave soldering furnace 41 support, realized the regulation of Wave soldering furnace 41 position by hydraulic coupling.
With further reference to Fig. 1, middle bonding machine is additionally provided with for connecing at feed end and discharge end according to embodiments of the present invention
That refutes pcb board enters panel assembly 71 and board discharging device 72, and then in bonding machine, can preferably make wave crest welding device and required weldering
The situation of the pcb board connect is suitable, and then reduces the difficulty of operation, simultaneously after scolding tin quickly consumes the decline of scolding tin position,
Can by regulation Wave soldering furnace 41 height so that scolding tin position adapts with the position of the required pcb board welded, so without
Carrying out frequently adding stannum, improve convenience degree, beneficially bonding machine requires low place in the operation such as colleges and universities, laboratory, improves
Applicable scope, i.e. further increases the scope of application of bonding machine.
Preferably, the bonding machine in the embodiment of the present invention also includes that preheating device 91, preheating device 91 close on into panel assembly
71 are arranged, thus just can realize the preheating to pcb board when being placed on panel assembly 71 by the pcb board of required welding, just
In follow-up immersed solder operation.
Specifically, preheating device 91 is provided with heater strip and blower fan, forms hot blast by flowing through heater strip, pass through hot blast
Realizing the heating to pcb board, such warm-up curve is steady, it is ensured that PCB thermally equivalent, indeformable.Wherein, preheating device 91 uses
Pull straight out formula modular construction, maintain easily and clean.
Preferably, the bonding machine in the embodiment of the present invention also includes the sprayer unit 92 being integrated in bonding machine, for right
The pcb board spraying scaling powder of required welding, it is simple to follow-up welding operation.
The present invention also provides for a kind of welding method, comprises the following steps, step S10: soak the pcb board of required welding
Weldering operation；Step S20: carry out cutting operation to through immersed solder device 20 immersed solder operation pcb board；Step S30: fill through cutting
The pcb board putting 30 carries out Wave crest Welding operation.First the pcb board to required welding passed through carries out immersed solder operation, thus
While realizing pcb board is welded, fastening is achieved for the pin of electronic devices and components in pcb board, secondly pcb board is cut
Foot operates, and makes the longest foot of electronic devices and components in the pcb board of required welding or short foot all be applicable to the weldering of bonding machine medium wave peak
Device 40 is subjected to, and finally uses Wave-soldering device 40 that pcb board is carried out wave-soldering operation, thus is welded by crest
Put 40 and carry out secondary welding, carry out the solder joint of rosin joint that may be present and solder skip after immersed solder device 20 once welds supplementing weldering
Connect, thus improve the welding quality of pcb board.
Obviously, above-described embodiment is only for clearly demonstrating example, and not restriction to embodiment.Right
For those of ordinary skill in the field, can also make on the basis of the above description other multi-form change or
Variation.Here without also cannot all of embodiment be given exhaustive.And the obvious change thus extended out or
Change among still in the protection domain of the invention.
Claims (11)
1. a bonding machine, it is characterised in that including:
Immersed solder device (20), for carrying out immersed solder operation to pcb board；
Foot cut device (30), for carrying out cutting operation to pcb board；And
Wave-soldering device (40), for carrying out wave-soldering operation to pcb board；
Described immersed solder device (20), described foot cut device (30), described Wave-soldering device (40) are applied in combination successively to length
The described pcb board of pin electronic components and parts processes, and wherein, described immersed solder device (20) can be used for long pin electronic
The described pcb board of components and parts carries out immersed solder operation with the pin of long pin electronic components and parts, described cutting in fixing described pcb board
Device (30) can carry out cutting operation to the described pcb board fixing pin through immersed solder, and described Wave-soldering device (40) can be right
The described pcb board of the electronic devices and components having short foot after cutting operates carries out wave-soldering operation.
Bonding machine the most according to claim 1, it is characterised in that described bonding machine also includes:
Mounting bracket (10), has installing space, described Wave-soldering device (40), described foot cut device (30) and described immersed solder
Device (20) is contained in described installing space and is fixed in described mounting bracket (10).
Bonding machine the most according to claim 2, it is characterised in that also include Handling device, for realizing described pcb board
Automatic transporting operation between each processing stations.
Bonding machine the most according to claim 3, it is characterised in that described Handling device includes:
Slipway mechanism (51), is arranged in described mounting bracket (10), and extends in a first direction；
Clamping device (52), is movably disposed on described slipway mechanism (51), for described pcb board is clamped, its
In, described immersed solder device (20), described foot cut device (30) and described Wave-soldering device (40) in described bonding machine along institute
State first direction arrangement.
Bonding machine the most according to claim 4, it is characterised in that described clamping device (52) includes claw (521) and drives
Dynamic described claw (521) clamps the actuator of described pcb board.
Bonding machine the most according to claim 3, it is characterised in that described Handling device includes:
Connecting gear, is separately positioned on immersed solder device (20) and foot cut device (30), and foot cut device (30) is welded with crest
Put between (40)；
Drive mechanism, for coordinating with described connecting gear, to drive the motion of described connecting gear to transmit described pcb board.
Bonding machine the most according to claim 6, it is characterised in that described connecting gear includes flexible transmission band, correspondence
Described drive mechanism includes motor.
Bonding machine the most according to claim 6, it is characterised in that described connecting gear includes:
First connecting gear, its first end is connected with the discharge end of described immersed solder device (20), the second end and described foot cut device
(30) feed end connects；
Second connecting gear, its first end is connected with the discharge end of described foot cut device (30), and the second end is welded with described crest
The feed end putting (40) connects.
Bonding machine the most according to any one of claim 1 to 8, it is characterised in that
Having Wave soldering furnace (41) in described Wave-soldering device (40), described Wave-soldering device (40) also includes for described crest
The governor motion (42) that stove (41) position is adjusted, described governor motion (42) is for the height position to described Wave soldering furnace (41)
Put and/or horizontal level is adjusted.
Bonding machine the most according to any one of claim 1 to 8, it is characterised in that the feed end of described bonding machine and going out
Material end is additionally provided with and enters panel assembly (71) and board discharging device (72) for pcb board of plugging into.
11. 1 kinds of welding methods, it is characterised in that comprise the following steps:
Step S10: the pcb board of required welding is carried out immersed solder operation；
Step S20: the pcb board operated through immersed solder is carried out cutting operation；
Step S30: the pcb board operated through cutting is carried out Wave crest Welding operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610737553.4A CN106332468A (en) | 2016-08-26 | 2016-08-26 | Welding machine and welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610737553.4A CN106332468A (en) | 2016-08-26 | 2016-08-26 | Welding machine and welding method |
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| CN106332468A true CN106332468A (en) | 2017-01-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610737553.4A Pending CN106332468A (en) | 2016-08-26 | 2016-08-26 | Welding machine and welding method |
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| CN106852018A (en) * | 2017-01-13 | 2017-06-13 | 昆山福烨电子有限公司 | A kind of immersed solder method of printed circuit board |
| US20230247772A1 (en) * | 2020-07-17 | 2023-08-03 | Fuji Corporation | Coating device and component mounting machine |
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Application publication date: 20170111 |