CN206005032U - Bonding machine - Google Patents
Bonding machine Download PDFInfo
- Publication number
- CN206005032U CN206005032U CN201620959543.0U CN201620959543U CN206005032U CN 206005032 U CN206005032 U CN 206005032U CN 201620959543 U CN201620959543 U CN 201620959543U CN 206005032 U CN206005032 U CN 206005032U
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- pcb board
- bonding machine
- wave
- soldering
- immersed solder
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Abstract
This utility model provides a kind of bonding machine, including immersed solder device, for carrying out immersed solder operation to the pcb board through immersed solder device；Foot cut device, for carrying out cutting operation to the pcb board through foot cut device；And Wave-soldering device, for wave-soldering operation is carried out to the pcb board through Wave-soldering device.It is used for pcb board is welded by immersed solder device integrated in bonding machine, Wave-soldering device, and be introduced into foot cut device cutting is carried out to the pin fixing through immersed solder in pcb board, while ensureing cutting quality, make the no matter long foot of electronic devices and components in the pcb board of required welding again or short foot is all applied to bonding machine medium wave peak welder is subjected to, so while ensureing the scope of application of bonding machine, the solder joint of rosin joint that may be present and solder skip after once welding through immersed solder device is carried out supplementing welding, thus improve the welding quality of pcb board.
Description
Technical field
This utility model is related to welding technology field and in particular to a kind of bonding machine.
Background technology
At present, in the assembling production process of electronic product, it usually needs electronic devices and components are arranged on pcb board, then
By bonding machine, electronic devices and components are welded and fixed.
In prior art, conventional bonding machine has dip-soldering machine, mainly passes through the pcb board of good for plug-in mounting electronic devices and components exists
Wicking in the stannum stove of dip-soldering machine, thus once complete the welding of numerous electronic devices and components solder joints.But, this bonding machine is to welding
Cross that range request is higher, for example pcb board is immersed with angle, time of stannum stove etc. certain requirement.So result in electronics unit device
The welding quality of part is simultaneously unstable, for patch capacitor, chip inductor, the higher electronics of the various precision such as paster integrated circuit
Components and parts, often easily produce situations such as rosin joint, solder skip, the quality of impact electronic product.
And in prior art, a kind of higher bonding machine of welding quality is wave-soldering unit, it passes through in wave-soldering unit
Wave soldering furnace in spray crest shape scolding tin, the pcb board of the good electronic devices and components of plug-in mounting is through crest shape scolding tin, the weldering of required welding
Point is contacted with crest shape scolding tin, and the welding of numerous solder joints is done step-by-step during pcb board is mobile.The welding of this bonding machine
Quality is higher, but because the depth of crest shape scolding tin at Wave soldering furnace nozzle is relatively low, easily occurs with the pin of long foot components and parts
Interfere, for the pcb board being fitted with long foot components and parts and inapplicable, have impact on the scope of application of bonding machine.
Utility model content
This utility model aims to provide a kind of applied widely, and the high bonding machine of welding quality.
For achieving the above object, this utility model provides a kind of bonding machine, including：Immersed solder device, for entering to pcb board
Row immersed solder operates；Foot cut device, for carrying out cutting operation to pcb board；And Wave-soldering device, for traveling wave is entered to pcb board
Peak weldering operation；Immersed solder device, foot cut device, Wave-soldering device are applied in combination successively to the PCB with long pin electronic components and parts
Plate is processed, and wherein, immersed solder device can be used for the pcb board with long pin electronic components and parts being carried out with immersed solder operation with fixation
The pin of long pin electronic components and parts in pcb board, foot cut device can carry out cutting behaviour to the pcb board fixing pin through immersed solder
Make, Wave-soldering device can carry out wave-soldering operation to the pcb board of the electronic devices and components after cutting operates with short foot.
Further, mounting bracket, has installing space, and Wave-soldering device, foot cut device and immersed solder device are contained in
In installing space and be fixed in mounting bracket.
Further, also include Handling device, for realizing the automatic transporting behaviour between each processing stations to pcb board
Make.
Further, Handling device includes：Slipway mechanism, is arranged in mounting bracket, and extends in a first direction；Clamping
Mechanism, is movably disposed on slipway mechanism, for clamping to pcb board, wherein, immersed solder device, foot cut device and
Wave-soldering device is arranged in bonding machine in the first direction.
Further, clamping device includes claw and drives claw to clamp the actuator of pcb board.
Further, Handling device includes：Connecting gear, is separately positioned on immersed solder device and foot cut device, and cutting
Between device and Wave-soldering device；Drive mechanism, for coordinating with connecting gear, to drive connecting gear motion transmission pcb board.
Further, connecting gear includes flexible transmission belt, and corresponding drive mechanism includes motor.
Further, connecting gear includes：First connecting gear, its first end is connected with the discharge end of immersed solder device, the
Two ends are connected with the feed end of foot cut device；Second connecting gear, its first end is connected with the discharge end of foot cut device, the second end
It is connected with the feed end of Wave-soldering device.
Further, there is in Wave-soldering device Wave soldering furnace, Wave-soldering device is also included for carrying out to Wave soldering furnace position
The governor motion adjusting, governor motion is used for the height and position of Wave soldering furnace and/or horizontal level are adjusted.
Further, the feed end of bonding machine and discharge end are additionally provided with and enter panel assembly and ejecting plate for pcb board of plugging into
Device.
Technical solutions of the utility model, have the advantage that：
1., in the bonding machine that this utility model provides, used by immersed solder device integrated in bonding machine, Wave-soldering device
In welding to pcb board, and introduce foot cut device, such that it is able to need to fix through immersed solder in pcb board according to welding
Good pin carries out cutting, while ensureing cutting quality, makes the electronic devices and components in the pcb board of required welding no matter long again
Foot or short foot are all applied to bonding machine, and medium wave peak welder is subjected to, so in the scope of application ensureing bonding machine
Simultaneously as bonding machine can carry out secondary welding by Wave-soldering device, there may be to after once welding through immersed solder device
Rosin joint and the solder joint of solder skip carry out supplementing welding, thus improve the welding quality of pcb board, welding for example of the present utility model
Machine can meet patch capacitor, chip inductor, the higher electronic devices and components of the various precision requirement such as paster integrated circuit
Welding.
2. this utility model provide bonding machine in, by arrange mounting bracket to immersed solder device, foot cut device and
Wave-soldering device is installed and is accommodated, and is easy to immersed solder device, foot cut device and Wave-soldering device in bonding machine integrated, conveniently
Switching between the different operating such as immersed solder operation, cutting operation and wave-soldering operation in bonding machine.
3. in bonding machine of the present utility model, by arranging Handling device in bonding machine, by Handling device to being used for
The pcb board being operated between the devices such as immersed solder device, foot cut device and Wave-soldering device carries out carrying operation, so just
In the automatization realizing bonding machine, it still is able to complete the welding operation of pcb board in the case of left unguarded, higher in guarantee
While welding quality, further increase the scope of application of this utility model bonding machine, be particularly suited for colleges and universities, laboratory etc.
Operator do not have a case that specialty welding knowledge, can also mitigate to a certain extent simultaneously operation personnel bear
Load.
4. in the bonding machine that this utility model provides, by carrying out to the height of welding medium wave peak stove and position to setting
The adjustment structure adjusting, and then in bonding machine, can preferably make the situation phase of wave crest welding device and the pcb board of required welding
Adaptation, and then reduce the difficulty of operation, simultaneously after scolding tin quickly consumes the decline of scolding tin position, can be by adjusting Wave soldering furnace
Height so that the position of the pcb board of scolding tin position and required welding is adapted, so need not frequently carry out plus stannum, improve
Convenience degree, requires low place beneficial to bonding machine in the operation such as colleges and universities, laboratory, improves applicable scope, that is, enter one
Step improves the scope of application of bonding machine.
5., in bonding machine of the present utility model, arranged into panel assembly and board discharging device by the two ends in bonding machine, from
And when being subjected to pcb board it is only necessary to be placed on pcb board on panel assembly, or enter with other transmission equipments
Row is plugged into, you can send in bonding machine by entering panel assembly by the pcb board of required welding, by Handling device to required welding
Pcb board carry out carrying carry out ensuing operate, welding after the completion of, by board discharging device, the pcb board processing is sent
Go out, so whole bonding machine uses to be easy to operator and operated, and improves the scope of application of bonding machine.
6. adopt welding method of the present utility model, first by the PCB to required welding for the immersed solder device in bonding machine
Plate carries out immersed solder operation, thus while realizing pcb board is welded, the pin for electronic devices and components in pcb board achieves
Fastening, secondly carries out cutting operation using foot cut device to pcb board, and the electronic devices and components in the pcb board of welding needed for making no matter
Long foot or short foot are all applied to bonding machine medium wave peak welder are subjected to, and finally adopt Wave-soldering device to pcb board
Carry out wave-soldering operation, thus secondary welding is carried out by Wave-soldering device, there may be to after once welding through immersed solder device
Rosin joint and the solder joint of solder skip carry out supplementing welding, thus improve the welding quality of pcb board.
Brief description
In order to be illustrated more clearly that this utility model specific embodiment or technical scheme of the prior art, below will be right
In specific embodiment or description of the prior art the accompanying drawing of required use be briefly described it should be apparent that, below describe
In accompanying drawing be some embodiments of the present utility model, for those of ordinary skill in the art, do not paying creativeness
On the premise of work, other accompanying drawings can also be obtained according to these accompanying drawings.In the accompanying drawings：
Fig. 1 is the structural representation of the tin soldering machine of this utility model embodiment；
Fig. 2 is the structural representation of tin soldering machine medium wave peak furnace apparatus shown in Fig. 1.
Wherein, the reference in above-mentioned accompanying drawing is：
10- mounting bracket；20- immersed solder device；30- foot cut device；40- Wave-soldering device；41- Wave soldering furnace；42- adjusts machine
Structure；51- slipway mechanism；52- clamping device；521- claw；71- enters panel assembly；72- board discharging device；91- preheating device；92- sprays
Mist device.
Specific embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is clearly and completely described it is clear that described
Embodiment is a part of embodiment of this utility model, rather than whole embodiments.Based on the embodiment in this utility model, this
The every other embodiment that field those of ordinary skill is obtained under the premise of not making creative work, broadly falls into this practicality
Novel protected scope.
As shown in figure 1, according to the bonding machine in this utility model embodiment, including：Immersed solder device 20, for through leaching
The pcb board of welder 20 carries out immersed solder operation；Foot cut device 30, for carrying out cutting behaviour to the pcb board through foot cut device 30
Make；And Wave-soldering device 40, for the pcb board through Wave-soldering device 40 is carried out with wave-soldering operation, immersed solder device 20, cut
Foot device 30, Wave-soldering device 40 are applied in combination and successively the pcb board with long pin electronic components and parts are processed, wherein,
Immersed solder device 20 can be used for the pcb board with long pin electronic components and parts being carried out with immersed solder operation to fix long pin in pcb board
The pin of electronic devices and components, foot cut device 30 can carry out cutting operation to the pcb board fixing pin through immersed solder, and crest is welded
Put 40 and can carry out wave-soldering operation to the pcb board of the electronic devices and components after cutting operates with short foot.
Thus in the bonding machine that this utility model provides, being welded by immersed solder device 20 integrated in bonding machine, crest
Put 40 to be used for pcb board is welded, and introduce foot cut device 30, such that it is able to need to pass through in pcb board according to welding
The pin that immersed solder fixes carries out cutting, while ensureing cutting quality, makes the electronics unit device in the pcb board of required welding again
The no matter long foot of part or short foot is all applied to bonding machine medium wave peak welder 40 and is subjected to, is so ensureing bonding machine
While the scope of application, because bonding machine can carry out secondary welding by Wave-soldering device 40, to through immersed solder device 20 once
After welding, the solder joint of rosin joint that may be present and solder skip carries out supplementing welding, thus improve the welding quality of pcb board.For example originally
The bonding machine of utility model can meet patch capacitor, chip inductor, and the various precision requirement such as paster integrated circuit is higher
Electronic devices and components welding.
Certainly, in this utility model bonding machine, except being operated to required by immersed solder operation, cutting operation and wave-soldering
The pcb board of welding is welded outer, immersed solder operation can also individually be carried out according to actual job demand, cutting operate with
And wave-soldering operation；Or carry out cutting operation after first carrying out immersed solder operation；Or carry out wave-soldering after first carrying out immersed solder operation
Operation.I.e. bonding machine of the present utility model, in addition to the good scope of application and welding quality, can also be adopted according to job demand
With multiple different mode of operations, there is the wider scope of application.
Specifically, the bonding machine in this utility model embodiment also includes：Mounting bracket 10, has installing space, this reality
With being used for Wave-soldering device 40, foot cut device 30 and immersed solder that the pcb board of required welding is processed in new embodiment
Device 20 is contained in installing space and is fixed in mounting bracket 10.So pass through to arrange mounting bracket 10 to immersed solder device
20th, foot cut device 30 and Wave-soldering device 40 are installed and are accommodated, and are easy to immersed solder device 20 in bonding machine, foot cut device 30
And Wave-soldering device 40 is integrated, facilitate immersed solder operation in bonding machine, cutting operation and wave-soldering operation etc. different operating it
Between switching.
As shown in figure 1, Handling device is also included according to the bonding machine in this utility model embodiment, for realizing to PCB
Automatic transporting operation between each processing stations for the plate.So carry with respect to the artificial pcb board to required processing, be easy to
Realize the automatization of bonding machine, still be able to complete the welding operation of pcb board in the case of left unguarded, ensure higher weldering
While connecing quality, further increase the scope of application of this utility model bonding machine, be particularly suited for the behaviour such as colleges and universities, laboratory
Make personnel do not have a case that specialty welding knowledge, can also mitigate to a certain extent simultaneously operation personnel bear
Load.
Specifically, the Handling device in this utility model embodiment includes：Slipway mechanism 51, is arranged on mounting bracket 10
On, and extend in a first direction；Clamping device 52, is movably disposed on slipway mechanism 51, for pressing from both sides to pcb board
Hold, corresponding, immersed solder device 20, foot cut device 30 and Wave-soldering device 40 are arranged, so in bonding machine in the first direction
When moving on clamping device 52 is along the slipway mechanism 51 extending in a first direction, immersed solder device 20, foot cut device 30
And Wave-soldering device 40 is all in this direction, is easy to pcb board is operated.More specifically, for clamping to pcb board
Clamping device 52 include claw 521 and drive claw 521 to clamp the hydraulic part as actuator of pcb board, by hydraulic part
Drive the opening and closing of claw 521, thus realizing the clamping of pcb board.
In another embodiment not shown of the present utility model, Handling device includes connecting gear, specially flexible transmission
Band, is separately positioned between immersed solder device 20 and foot cut device 30, and foot cut device 30 and Wave-soldering device 40, for by institute
The pcb board that need to process is carried between different devices；Drive mechanism, is specifically as follows motor, by with connecting gear
Cooperation, to drive connecting gear motion transmission pcb board it is achieved that the carrying of pcb board operates.
More specifically, the connecting gear in this embodiment includes：First connecting gear, its first end and immersed solder device 20
Discharge end connects, and the second end is connected with the feed end of foot cut device 30；Second connecting gear, its first end and foot cut device 30
Discharge end connects, and the second end is connected with the feed end of Wave-soldering device 40.
Further, in the Wave-soldering device 40 in this utility model the various embodiments described above, there is Wave soldering furnace 41, crest
Welder 40 also includes the governor motion 42 for being adjusted to Wave soldering furnace 41 position, and this governor motion 42 is used for Wave soldering furnace
41 height and position and horizontal level are adjusted or individually the height of Wave soldering furnace 41 are adjusted or individually to ripple
The horizontal level of peak stove 41 is adjusted.And then in bonding machine, can preferably make the PCB of wave crest welding device and required welding
The situation of plate is adapted, and then reduces the difficulty of operation, simultaneously after scolding tin quickly consumes the decline of scolding tin position, can pass through
Adjust the height of Wave soldering furnace 41 so that scolding tin position is adapted with the position of the pcb board of required welding, so need not frequently enter
Row plus stannum, improve convenience degree, require low place beneficial to bonding machine in the operation such as colleges and universities, laboratory, improve and can apply
Scope, that is, further increase the scope of application of bonding machine.
As shown in Fig. 2 governor motion 42 includes being connected the screw structure supporting Wave soldering furnace 41 with wave-soldering furnace, and with silk
The female knob of band of bumper structure cooperation, knob is spindle rotationally arranged in the support for supporting Wave soldering furnace 41, leading screw
Through this knob, by screwing knob, guide screw movement is driven to can achieve the regulation of Wave soldering furnace 41.
A kind of in of the present utility model one embodiment not shown, adjustment structure includes the hydraulic stem being connected with Wave soldering furnace 41,
Also include the hydraulic cylinder that one end is fixed on Wave soldering furnace 41 support, realize the regulation of Wave soldering furnace 41 position by hydraulic coupling.
With further reference to Fig. 1, use is additionally provided with feed end and discharge end according to bonding machine in this utility model embodiment
Enter panel assembly 71 and board discharging device 72 in pcb board of plugging into, and then in bonding machine, can preferably make wave crest welding device and institute
The situation of the pcb board that need to weld is adapted, and then reduces the difficulty of operation, quickly consumes scolding tin position in scolding tin simultaneously and declines
Afterwards, can be by adjusting the height of Wave soldering furnace 41 so that scolding tin position is adapted with the position of the pcb board of required welding, so no
Need to frequently carry out plus stannum, improve convenience degree, require low place beneficial to bonding machine in the operation such as colleges and universities, laboratory, carry
High applicable scope, that is, further increase the scope of application of bonding machine.
Preferably, the bonding machine in this utility model embodiment also includes preheating device 91, and preheating device 91 closes on into plate
Device 71 is arranged, thus just can realize pre- to pcb board when being placed on the pcb board of required welding on into panel assembly 71
Heat, is easy to follow-up immersed solder operation.
Specifically, it is provided with heater strip and blower fan in preheating device 91, form hot blast by flowing through heater strip, by hot blast
Realize the heating to pcb board, such warm-up curve is steadily it is ensured that PCB thermally equivalent, indeformable.Wherein, preheating device 91 adopts
Pull straight out formula modular construction, maintain easily and clean.
Preferably, the bonding machine in this utility model embodiment also includes the sprayer unit 92 being integrated in bonding machine, uses
In the pcb board spraying scaling powder to required welding, it is easy to follow-up welding operation.
This utility model also provides a kind of welding method, comprises the following steps, step S10:The pcb board of required welding is entered
Row immersed solder operates；Step S20：Carry out cutting operation to through immersed solder device 20 immersed solder operation pcb board；Step S30：To through cutting
The pcb board of foot device 30 carries out Wave crest Welding operation.The pcb board to required welding passing through carries out immersed solder operation first, from
And while realizing pcb board is welded, the pin for electronic devices and components in pcb board achieves fastening, secondly pcb board is entered
Row cutting operates, and makes the no matter long foot of electronic devices and components in the pcb board of required welding or short foot is all applied to bonding machine medium wave
Peak welder 40 is subjected to, and finally carries out wave-soldering operation using Wave-soldering device 40 to pcb board, thus passing through crest
Welder 40 carries out secondary welding, and the solder joint of rosin joint that may be present and solder skip after once welding through immersed solder device 20 is mended
Fill welding, thus improve the welding quality of pcb board.
Obviously, above-described embodiment is only intended to clearly illustrate example, and the not restriction to embodiment.Right
For those of ordinary skill in the art, can also make on the basis of the above description other multi-forms change or
Change.There is no need to be exhaustive to all of embodiment.And the obvious change thus extended out or
Change among the protection domain created still in this utility model.
Claims (10)
1. a kind of bonding machine is it is characterised in that include：
Immersed solder device (20), for carrying out immersed solder operation to pcb board；
Foot cut device (30), for carrying out cutting operation to pcb board；And
Wave-soldering device (40), for carrying out wave-soldering operation to pcb board；
Described immersed solder device (20), described foot cut device (30), described Wave-soldering device (40) are applied in combination successively to length
The described pcb board of pin electronic components and parts is processed, and wherein, described immersed solder device (20) can be used for long pin electronic
The described pcb board of components and parts carries out immersed solder operation with the pin of long pin electronic components and parts in fixing described pcb board, described cutting
Device (30) can carry out cutting operation to the described pcb board fixing pin through immersed solder, and described Wave-soldering device (40) can be right
The described pcb board of the electronic devices and components having short foot after cutting operation carries out wave-soldering operation.
2. bonding machine according to claim 1 is it is characterised in that described bonding machine also includes：
Mounting bracket (10), has installing space, described Wave-soldering device (40), described foot cut device (30) and described immersed solder
Device (20) is contained in described installing space and is fixed in described mounting bracket (10).
3. bonding machine according to claim 2 is it is characterised in that also include Handling device, for realizing to described pcb board
Automatic transporting operation between each processing stations.
4. bonding machine according to claim 3 is it is characterised in that described Handling device includes：
Slipway mechanism (51), is arranged in described mounting bracket (10), and extends in a first direction；
Clamping device (52), is movably disposed on described slipway mechanism (51), for clamping to described pcb board, its
In, described immersed solder device (20), described foot cut device (30) and described Wave-soldering device (40) are in described bonding machine along institute
State first direction arrangement.
5. bonding machine according to claim 4 is it is characterised in that described clamping device (52) includes claw (521) and drives
Dynamic described claw (521) clamps the actuator of described pcb board.
6. bonding machine according to claim 3 is it is characterised in that described Handling device includes：
Connecting gear, is separately positioned on immersed solder device (20) and foot cut device (30), and foot cut device (30) is welded with crest
Put between (40)；
Drive mechanism, for coordinating with described connecting gear, to drive described connecting gear motion to transmit described pcb board.
7. bonding machine according to claim 6 is it is characterised in that described connecting gear includes flexible transmission belt, corresponding
Described drive mechanism includes motor.
8. bonding machine according to claim 6 is it is characterised in that described connecting gear includes：
First connecting gear, its first end is connected with the discharge end of described immersed solder device (20), the second end and described foot cut device
(30) feed end connects；
Second connecting gear, its first end is connected with the discharge end of described foot cut device (30), and the second end is welded with described crest
The feed end putting (40) connects.
9. bonding machine according to any one of claim 1 to 8 it is characterised in that
There is in described Wave-soldering device (40) Wave soldering furnace (41), described Wave-soldering device (40) is also included for described crest
The governor motion (42) that stove (41) position is adjusted, described governor motion (42) is used for the height position to described Wave soldering furnace (41)
Put and/or horizontal level is adjusted.
10. bonding machine according to any one of claim 1 to 8 is it is characterised in that the feed end of described bonding machine and going out
Material end is additionally provided with enters panel assembly (71) and board discharging device (72) for pcb board of plugging into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620959543.0U CN206005032U (en) | 2016-08-26 | 2016-08-26 | Bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620959543.0U CN206005032U (en) | 2016-08-26 | 2016-08-26 | Bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206005032U true CN206005032U (en) | 2017-03-08 |
Family
ID=58197627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620959543.0U Expired - Fee Related CN206005032U (en) | 2016-08-26 | 2016-08-26 | Bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206005032U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106332468A (en) * | 2016-08-26 | 2017-01-11 | 乐清市浙佳电子科技有限公司 | Welding machine and welding method |
-
2016
- 2016-08-26 CN CN201620959543.0U patent/CN206005032U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106332468A (en) * | 2016-08-26 | 2017-01-11 | 乐清市浙佳电子科技有限公司 | Welding machine and welding method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170308 Termination date: 20190826 |
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| CF01 | Termination of patent right due to non-payment of annual fee |