CN212419992U - Novel full-automatic weldability test device - Google Patents

Novel full-automatic weldability test device Download PDF

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Publication number
CN212419992U
CN212419992U CN202022779049.5U CN202022779049U CN212419992U CN 212419992 U CN212419992 U CN 212419992U CN 202022779049 U CN202022779049 U CN 202022779049U CN 212419992 U CN212419992 U CN 212419992U
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China
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soldering tin
clamp
plc
automatic
test device
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CN202022779049.5U
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Chinese (zh)
Inventor
袁子波
吴健
陶平
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SICHUAN YONGXING ELECTRONICS CO LTD
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SICHUAN YONGXING ELECTRONICS CO LTD
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Abstract

The utility model discloses a novel full-automatic weldability test device, which comprises a welding groove box and a PLC controller which are arranged side by side, wherein the welding groove box is provided with a soldering tin groove, and a soldering flux groove is arranged above the PLC controller; a motion assembly supporting back plate is arranged behind the welding tank box and the PLC, a horizontal motion mechanism is arranged on the motion assembly supporting back plate, a lifting mechanism is arranged on the horizontal motion mechanism, and a clamp is arranged on the lifting mechanism and used for clamping electronic components; a soldering tin temperature controller is arranged behind the moving component supporting back plate and used for controlling the temperature of soldering tin in the soldering tin groove; and the PLC is connected with the soldering tin temperature controller, the horizontal movement mechanism and the lifting mechanism. The utility model discloses realize soaking two station solderability of scaling powder and dip solder, resistant welding heat test and can many products carry out the clamping simultaneously and carry out characteristics such as experiment, satisfy the experimental standard requirement of GJB 360B.

Description

Novel full-automatic weldability test device
Technical Field
The utility model relates to an electronic components test equipment technical field, concretely relates to novel full-automatic solderability test device.
Background
The solderability test refers to the qualitative and quantitative evaluation of the solderability of components, PCB boards, PADs, solders, soldering fluxes and the like. The high quality interconnection technology is required for the level 1 (IC package) and level 2 (electronic component assembly to printed circuit board) processes of the modern electronic industry, and the high quality and zero defect soldering process is greatly facilitated.
In recent years, with the technological level of national defense and key engineering in China being improved continuously, the performance requirements of required electronic components are higher and higher. The reliability analysis test products of the national military standard products, the Yugao project products and the newly developed products are various in types and large in test quantity. At present, most of solderability testing machines on the market adopt a single solder dipping station, a stepping motor is controlled in an open loop mode, the precision is not high, foreign products adopting a wetting weighing method for solderability testing are high in selling price, and full-automatic operation of two solder dipping stations and soldering flux can not be completed on the same machine.
SUMMERY OF THE UTILITY MODEL
To the problem, the utility model provides a novel full-automatic solderability test device, aim at satisfy simultaneously and soak scaling powder and dip solder two station work, satisfy the weld groove method and the resistant welding heat test requirement in the experimental standard solderability of GJB360B experiment.
The utility model adopts the following technical proposal:
a novel full-automatic weldability test device comprises a welding groove box and a PLC (programmable logic controller) which are arranged side by side, wherein a soldering tin groove is arranged on the welding groove box, and a soldering flux groove is arranged above the PLC;
a motion assembly supporting back plate is arranged behind the welding tank box and the PLC, a horizontal motion mechanism is arranged on the motion assembly supporting back plate, a lifting mechanism is arranged on the horizontal motion mechanism, a clamp is arranged on the lifting mechanism and used for clamping electronic components, and the horizontal motion and the vertical motion are realized under the combined action of the horizontal motion mechanism and the lifting mechanism;
a soldering tin temperature controller is arranged behind the moving component supporting back plate and used for controlling the temperature of soldering tin in the soldering tin groove;
and the PLC is connected with the soldering tin temperature controller, the horizontal movement mechanism and the lifting mechanism.
Preferably, the fixture comprises 2 fixture bases, a guide rod and a polyurethane strip arranged on the fixture bases, wherein the polyurethane strip is used for clamping the electronic components; the 2 clamp bases are connected through a guide rod.
Preferably, the horizontal movement mechanism comprises an X-axis servo motor and an X-axis lead screw, and the lifting mechanism comprises a Z-axis servo motor and a Z-axis lead screw; the X-axis servo motor and the Z-axis servo motor are respectively connected with the X-axis lead screw and the Z-axis lead screw through a coupler, and the lead screw is driven to rotate by the rotation of the servo motor.
Preferably, a magnet is arranged on the clamp base, and the clamp is fixed on the lifting mechanism through the magnet.
Preferably, the clamp is provided with a conductive electrode for detecting the solder level.
Preferably, a thermocouple temperature sensor is arranged in the soldering tin tank and connected with a soldering tin temperature controller for detecting the temperature in the soldering tin tank.
The utility model has the advantages that:
the utility model discloses realize soaking two station solderability of scaling powder and dip solder, resistant welding heat test and can many products carry out the clamping simultaneously and carry out characteristics such as experiment, satisfy the experimental standard requirement of GJB 360B. The horizontal movement mechanism and the lifting mechanism are controlled through the PLC, so that the movement speed, the positioning position and the time control are accurately controlled, and the functions required by the test are completed.
Drawings
In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the drawings of the embodiments will be briefly described below, and it is obvious that the drawings in the following description only relate to some embodiments of the present invention, and are not intended to limit the present invention.
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the clamp of the present invention;
FIG. 3 is a schematic side view of the structure of the present invention;
FIG. 4 is a schematic view of the fixture at the upper end of the flux groove;
FIG. 5 is a schematic view of the fixture at the lower end of the flux groove;
FIG. 6 is a schematic view of the fixture at the upper end of the solder bath according to the present invention;
FIG. 7 is a schematic view of the fixture at the lower end of the solder bath according to the present invention;
shown in the drawings
1-a soldering bath box, 2-a soldering bath, 3-a moving component supporting back plate, 4-a soldering temperature controller, 5-an X-axis servo motor, 6-an X-axis screw rod, 7-a Z-axis servo motor, 8-a Z-axis screw rod, 9-a clamp, 10-a soldering flux bath, 11-a PLC controller and 12-a thermocouple temperature sensor;
91-magnet, 92-polyurethane strip, 93-conductive electrode, 94-clamp base, 95-guide rod, 96-fastening bolt.
Detailed Description
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined below to clearly and completely describe the technical solution of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be obtained by a person skilled in the art without any inventive work based on the described embodiments of the present invention, belong to the protection scope of the present invention.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of the word "comprising" or "comprises", and the like, in this disclosure is intended to mean that the elements or items listed before that word, include the elements or items listed after that word, and their equivalents, without excluding other elements or items. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
The present invention will be further explained with reference to the drawings and examples.
As shown in fig. 1 to 7, a novel full-automatic weldability test device comprises a soldering tank box 1 and a PLC controller 11 which are arranged side by side, wherein a soldering tank 2 is arranged on the soldering tank box 1, and a soldering flux tank 10 is arranged above the PLC controller 11;
the soldering tin tank 2 is internally provided with a thermocouple temperature sensor 12, the thermocouple temperature sensor 12 is connected with a soldering tin temperature controller 4, the soldering tin temperature controller 4 is a PID temperature controller, the soldering tin temperature controller 4 detects the temperature in the soldering tin tank 2 through the thermocouple temperature sensor 12, and controls the output power of a heating wire in the soldering tin tank 2, so that the temperature in the soldering tin tank 2 is accurately controlled.
A motion component supporting back plate 3 is arranged behind the welding groove box 1 and the PLC 11, a horizontal motion mechanism is fixedly arranged on the motion component supporting back plate 3, and a lifting mechanism is arranged on the horizontal motion mechanism;
the horizontal movement mechanism comprises an X-axis servo motor 5 and an X-axis screw 6, and the lifting mechanism comprises a Z-axis servo motor 7 and a Z-axis screw 8;
the X-axis screw 6 and the Z-axis screw 8 are both ball screws;
x axle servo motor 5, Z axle servo motor 7 are respectively through shaft coupling connection X axle lead screw 6 and Z axle lead screw 8, and servo motor is rotatory to drive ball screw rotatory to drive the screw-nut linear motion on the ball screw, be equipped with the fixing base on the screw-nut of X axle lead screw 6, fixed elevating system on the fixing base, be equipped with the fixing base on the screw-nut of Z axle lead screw 8, mounting fixture 9 on the fixing base.
The clamp 9 is used for clamping an electronic component and realizes the movement in the horizontal direction and the vertical direction under the combined action of the horizontal movement mechanism and the lifting mechanism;
the fixture 9 comprises 2 fixture bases 94, a guide rod 95 and a polyurethane strip 92 arranged on the fixture bases 94, wherein the polyurethane strip 92 is used for clamping the electronic component;
the guide rod 95 is provided with a pressure spring, the 2 clamp bases 94 are connected through the guide rod 95 and used for positioning the clamp bases 94, and the 2 clamp bases 94 are close to each other through the fastening bolt 96 arranged on the clamp base 94 to realize clamping.
The fixture base 94 is provided with a magnet 91, the fixture 9 is fixed on the lifting mechanism through the magnet 91, and the fixture 9 can be conveniently replaced by arranging the magnet 91.
And the clamp 9 is provided with a conductive electrode 93 for detecting the liquid level of the soldering tin.
The PLC 11 is connected with the soldering tin temperature controller 4, the horizontal movement mechanism and the lifting mechanism; the PLC controller 11 is of a Taida DVP-EH3 model, and the human-computer interface is of a Taida DOP-B07SS411 model.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention has been disclosed with the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make some modifications or equivalent embodiments without departing from the scope of the present invention, but all the technical matters of the present invention are within the scope of the present invention.

Claims (6)

1. A novel full-automatic weldability test device is characterized by comprising a welding groove box (1) and a PLC (programmable logic controller) (11) which are arranged side by side, wherein a soldering tin groove (2) is arranged on the welding groove box (1), and a scaling powder groove (10) is arranged above the PLC (11);
a motion assembly supporting back plate (3) is arranged behind the welding groove box (1) and the PLC (11), a horizontal motion mechanism is arranged on the motion assembly supporting back plate (3), a lifting mechanism is arranged on the horizontal motion mechanism, and a clamp (9) is arranged on the lifting mechanism;
a soldering tin temperature controller (4) is arranged behind the moving component supporting back plate (3) and used for controlling the temperature of soldering tin in the soldering tin groove (2);
and the PLC (11) is connected with the soldering tin temperature controller (4), the horizontal movement mechanism and the lifting mechanism.
2. The novel full-automatic weldability test device according to claim 1 characterized in that, said clamp (9) includes 2 clamp bases (94), guide rods (95), polyurethane welts (92) arranged on the clamp bases (94); the 2 clamp bases (94) are connected through a guide rod (95).
3. The novel full-automatic weldability test device according to claim 1 characterized in that, said horizontal movement mechanism includes X-axis servo motor (5) and X-axis lead screw (6), said lifting mechanism includes Z-axis servo motor (7) and Z-axis lead screw (8); the X-axis servo motor (5) and the Z-axis servo motor (7) are respectively connected with an X-axis screw rod (6) and a Z-axis screw rod (8) through a coupler, and the servo motors rotate to drive the screw rods to rotate.
4. The novel full-automatic weldability test device according to claim 2 characterized in that, the clamp base (94) is provided with a magnet (91), and the clamp (9) is fixed on the lifting mechanism through the magnet (91).
5. A new type of fully automatic solderability test device according to any one of claims 3 or 4, characterized in that the clamp (9) is provided with a conductive electrode (93).
6. A novel full-automatic solderability test device according to claim 1, characterized in that a thermocouple temperature sensor (12) is arranged in the solder bath (2), and the thermocouple temperature sensor (12) is connected with a solder temperature controller (4).
CN202022779049.5U 2020-11-26 2020-11-26 Novel full-automatic weldability test device Active CN212419992U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022779049.5U CN212419992U (en) 2020-11-26 2020-11-26 Novel full-automatic weldability test device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022779049.5U CN212419992U (en) 2020-11-26 2020-11-26 Novel full-automatic weldability test device

Publications (1)

Publication Number Publication Date
CN212419992U true CN212419992U (en) 2021-01-29

Family

ID=74279685

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022779049.5U Active CN212419992U (en) 2020-11-26 2020-11-26 Novel full-automatic weldability test device

Country Status (1)

Country Link
CN (1) CN212419992U (en)

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Effective date of registration: 20221017

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