CN111774688A - Wave soldering method and device for selectively spraying soldering flux - Google Patents
Wave soldering method and device for selectively spraying soldering flux Download PDFInfo
- Publication number
- CN111774688A CN111774688A CN202010684022.XA CN202010684022A CN111774688A CN 111774688 A CN111774688 A CN 111774688A CN 202010684022 A CN202010684022 A CN 202010684022A CN 111774688 A CN111774688 A CN 111774688A
- Authority
- CN
- China
- Prior art keywords
- product
- control mechanism
- spraying
- soldering
- wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a wave soldering method and a device for selectively spraying soldering flux, wherein the method inputs parameter information of a product model into a spraying instruction editing device to generate a spraying operation instruction of a soldering flux spray head, and transmits the spraying operation instruction to a soldering flux control mechanism; the product detection mechanism detects actual products on the fixing clamp and compares the actual products with the soldering flux control mechanism, the soldering flux control mechanism controls the soldering flux spray head to perform soldering flux spraying operation according to a comparison result, the spraying operation process of the soldering flux spray head can be controlled through the spraying instruction editing device, the spraying operation process is monitored in real time through the product detection mechanism, accurate control over the soldering flux spraying process is achieved, real-time monitoring and correction over the soldering flux spraying process are achieved, soldering flux spraying accuracy is improved, welding quality is improved, welding speed is improved, and welding efficiency is guaranteed.
Description
Technical Field
The invention relates to the technical field of welding spraying, in particular to a wave soldering method and a wave soldering device for selectively spraying soldering flux.
Background
Wave soldering refers to the soldering of mechanically and electrically connecting the soldering terminal or pin of a component and the pad of a printed board by injecting nitrogen into a solder bath, wherein molten soft solder (lead-tin alloy) is sprayed into the solder wave required by design by an electric pump or an electromagnetic pump, and the solder wave is also formed by injecting nitrogen into the solder bath, so that the printed board with the component mounted in advance passes through the solder wave.
In the existing wave soldering process, when a product (with a clamp) enters a transmission track, a scaling powder spray head sensor senses the clamp, the scaling powder spray head starts to spray scaling powder on the whole clamp, the spraying amount of the scaling powder is large, the cleanliness of the product is influenced, the scaling powder is wasted, and the subsequent soldering quality is also influenced.
Chinese patent document CN110961742A discloses a wave soldering selective spraying process, which comprises step S1: shooting the produced product or the smelting tool by a camera; step S2: importing the pictures shot by the camera into a computer of a control machine for processing; step S3: opening the processed photos in software and selecting a spraying path; step S4: controlling a machine to spray soldering flux according to a spraying path; step S5: and controlling the machine platform to perform wave soldering on the position sprayed with the soldering flux. The wave-soldering selective spraying process disclosed by the invention can achieve the dynamic positioning function to carry out regional spraying, but the method is used for large data processing task amount and low spraying efficiency in the actual production process, and can only carry out spraying according to a preset path, and can not monitor and identify missing installation, wrong installation and the like in the spraying process, so that the welding quality is low.
Chinese patent document CN207914006U discloses a wave-soldering region selective spraying mechanism, which comprises an X-axis moving mechanism, a Y-axis moving mechanism, a soldering flux nozzle and a base, wherein the X-axis moving mechanism and the Y-axis moving mechanism are respectively driven by different stepping motors, so that the soldering flux nozzle can move in 2 directions, thereby realizing region selective spraying, only spraying the region to be welded on the board surface, but the mechanism can not monitor the product structure, once the product is dislocated, the welding quality will be reduced, therefore, the spraying precision of the mechanism is poor, and the requirement on the positioning precision of the device is high.
Disclosure of Invention
Aiming at the problems in the prior art, the invention discloses a wave soldering method and a wave soldering device for selectively spraying soldering flux, which not only realize the accurate control of the soldering flux spraying process, but also realize the real-time monitoring of the soldering flux spraying process, improve the soldering flux spraying precision, improve the soldering quality, simultaneously improve the soldering speed and ensure the soldering efficiency.
The Y direction refers to a direction which is consistent with the moving direction of the conveying device on the conveying plane of the conveying device; the X direction is a direction perpendicular to the moving direction of the transfer device on the conveying plane of the transfer device. Therefore, in the invention, the motor controlled in the X direction means that a device controlled by the motor moves in the X direction, and the motor controlled in the Y direction means that the device controlled by the motor moves in the Y direction.
The specific technical scheme disclosed by the invention is as follows: a wave soldering method for selectively spraying a flux, the method comprising:
s01, fixing the product on a fixing clamp of a conveying device;
s02, inputting parameter information of the product model into a spraying instruction editing device, automatically generating a spraying operation instruction of a soldering flux spray head by the spraying instruction editing device, and transmitting the spraying operation instruction to a soldering flux control mechanism;
s03, detecting an actual product on the fixing clamp by the product detection mechanism, transmitting parameter information of the detected actual product to the soldering flux control mechanism for comparison, and controlling the operation of the Y-direction control motor and the flow control mechanism by the soldering flux control mechanism according to a comparison result to enable the soldering flux spray head to perform soldering flux spraying operation;
s04, after the soldering flux is sprayed, heating the product by a preheating device and then transmitting the product to a wave-soldering device;
s05, welding pins on the product by the product through the wave crest of liquid tin in a tin furnace;
and S06, after welding, sending the product into a cooling device for cooling, and unloading the product.
Further, the parameter information includes size information, fixed position information, and component pin distribution information.
Further, the spraying operation instruction comprises the rotation direction, the rotation speed and the rotation time of the Y-direction displacement motor, the flux flow in the flow control mechanism and the spraying pressure information of the flux sprayer.
Further, the step S03 of comparing the size information of the actual product in the flux control mechanism with the size information of the product model includes the specific steps of:
s0311, the product detection mechanism detects the actual product size on the fixed clamp;
s0312, the soldering flux control mechanism compares the detected product size information with the size information in the model parameter information;
s0313, if the product size information comparison results are consistent, the scaling powder control mechanism continues to compare the fixed position information of the product; if not, the flux control mechanism judges that the product types are not matched, the current spraying operation instruction is stopped, and the welding process is stopped.
Further, the step S03 of comparing the fixing position information of the actual product in the flux control mechanism with the fixing position information of the product model includes the specific steps of:
s0314, the product detection mechanism detects the fixed position of the product on the fixed clamp;
s0315, the soldering flux control mechanism compares the detected product fixed position information with fixed position information in the model parameter information;
s0316, if the fixed position information of the product is consistent, the soldering flux control mechanism continues to compare the pin distribution information of the components on the product; if the comparison result is not consistent, entering the next step;
s0317, the scaling powder control mechanism judges whether the fixed position of the product on the fixed clamp is reversed, if so, the product on the fixed clamp is judged to be reversely installed, the scaling powder control mechanism stops the current spraying operation instruction, and the welding process stops; if not, entering the next step;
s0318, scaling powder control mechanism judges whether the product misplaces at the mounting fixture, if yes, calculate the dislocation interval between fixed position of the detected product and fixed position of the product model, scaling powder control mechanism revises the scaling powder spraying instruction according to the dislocation interval, if not, suspend the current spraying operation instruction, the welding process stops.
Further, the step S03 of comparing the pin distribution information of the components of the actual product with the pin distribution information of the components of the product model in the flux control mechanism includes the specific steps of:
s0319, the product detection mechanism detects the pin distribution of the components of the product on the fixed clamp;
s0320, comparing detected pin distribution information of components on the product with pin distribution information of the components in the model parameter information by a soldering flux control mechanism;
s0321, if the pin distribution information of the components on the product is consistent in comparison result, controlling the soldering flux spraying operation by a soldering flux control mechanism; if the comparison result is inconsistent, stopping welding, and entering the next step;
s0322, the soldering flux control mechanism judges whether the number of pins of the components on the product is reduced or increased, if the number of the pins is reduced, the components on the product are wrongly installed or neglected to install; if the number of the pins is increased, the components on the product are wrongly mounted or mounted more.
Meanwhile, the invention also provides a wave soldering device for selectively spraying the soldering flux, which comprises a transmission device and a master control processor, wherein the soldering flux spraying device, the preheating device, the wave soldering device and the cooling device are sequentially arranged above the transmission device along the transmission direction, and the transmission device, the soldering flux spraying device, the preheating device, the wave soldering device and the cooling device are all electrically connected with the master control processor.
The scaling powder spraying device comprises a product detection mechanism, a spraying instruction editing device, a Y-direction displacement motor, a flow control mechanism, a scaling powder spray head and a scaling powder control mechanism, wherein the scaling powder control mechanism is electrically connected with the product detection mechanism, the spraying instruction editing device, the Y-direction displacement motor and the flow control mechanism respectively, and the scaling powder spray head is electrically connected with the Y-direction displacement motor and the flow control mechanism respectively.
The spraying instruction editing device is used for importing product model parameters and generating spraying instruction information of the soldering flux spray head; the product detection mechanism comprises a first detection area, a second detection area and a third detection area, the first detection area comprises a first sensor used for identifying the size of a product in the fixing clamp, the second detection area comprises a second sensor used for detecting the position of a product fixed on the fixing clamp, and the third detection area comprises a third sensor used for detecting the distribution of pins of components on the product.
Further, a fixing clamp, an X-direction control motor and a transmission control mechanism are arranged on the transmission device, and the fixing clamp is used for fixing a product provided with a plurality of welding pins; the X-direction control motor is used for providing power for the transmission device; the transmission control mechanism is used for controlling the motion state of the transmission device.
Furthermore, the wave soldering device comprises a tin furnace, a wave crest generating mechanism, a wave crest detecting mechanism, a tin adding mechanism and a wave crest soldering control mechanism, wherein a temperature control device used for controlling the temperature of liquid tin is arranged on the tin furnace and connected with the wave crest soldering control mechanism, and the wave crest generating mechanism, the wave crest detecting mechanism and the tin adding mechanism are respectively connected with the wave crest soldering control mechanism.
Compared with the prior art, the invention has the following advantages:
1) according to the invention, the spraying instruction editing device controls the soldering flux spray head to move, and the spraying instruction editing device can automatically generate the spraying path of the soldering flux spray head according to the product structure, so that the selective spraying and the spraying automation of the soldering flux are realized, manual editing and setting are not needed, the operation difficulty is reduced, and the spraying efficiency is improved.
2) The product detection mechanism is arranged in the soldering flux spraying device, products to be welded on the transmission device are distinguished and compared by detecting the product structure, products which are wrongly installed, neglected installed and wrongly installed can be identified, and for the products which are clamped and dislocated, the soldering flux swelling device can automatically adjust the spraying path of the spray head so as to realize accurate spraying, improve the welding quality, save the soldering flux and improve the spraying accuracy.
3) According to the invention, the spraying instruction editing device and the product detection mechanism are adopted to jointly control the soldering flux sprayer, spraying instruction information is generated in advance in the soldering flux control mechanism, and data returned by the product detection mechanism are corrected in real time, so that the data processing amount is reduced, the accuracy of the spraying process is ensured, the data processing efficiency is improved, and the spraying efficiency is improved.
4) The soldering flux spraying device can selectively spray the soldering flux, so that the spraying amount and the spraying area of the soldering flux are reduced, the risk of pollution of products is reduced, and the factory cost is also reduced.
Drawings
FIG. 1 is a block diagram of a wave soldering apparatus for selectively spraying flux in an embodiment of the present invention;
FIG. 2 is a flow chart of a method of wave soldering with selective flux spraying in accordance with an embodiment of the present invention;
FIG. 3 is a flow chart of a method for comparing dimensional information of products in a flux control mechanism according to an embodiment of the present invention;
FIG. 4 is a flow chart of a method of comparing product placement locations in a flux control mechanism according to an embodiment of the invention;
fig. 5 is a flowchart of a pin distribution comparison method for components of a product in a flux control mechanism according to an embodiment of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, and it should be understood that the embodiments described herein are merely for the purpose of illustrating and explaining the present invention and are not intended to limit the present invention.
It should be noted that the X-direction control motor and the Y-direction control motor are only used for distinguishing the motors with different control directions, and do not limit the structure.
Example (b):
referring to fig. 1, the wave soldering device for selectively spraying the soldering flux disclosed in this embodiment includes a transmission device 2 and a master control processor 1, a soldering flux spraying device 3, a preheating device 4, a wave soldering device 5 and a cooling device 6 are sequentially arranged above the transmission device 2 along a transmission direction, and the transmission device 2, the soldering flux spraying device 3, the preheating device 4, the wave soldering device 5 and the cooling device 6 are all connected to the master control processor 1. The master control processor 1 is used for coordinating the movement of other mechanisms to complete the whole process flow of wave-soldering welding.
The soldering flux spraying device 3 comprises a product detection mechanism 33, a spraying instruction editing device 32, a Y-direction displacement motor 34, a flow control mechanism 35, a soldering flux spray head 39 and a soldering flux control mechanism 31, wherein the soldering flux control mechanism 31 is respectively connected with the product detection mechanism 33, the spraying instruction editing device 32, the Y-direction displacement motor 34 and the flow control mechanism 35, and the soldering flux spray head 38 is respectively connected with the Y-direction displacement motor 34 and the flow control mechanism 35.
The spraying instruction editing device 32 is used for importing product model parameters and generating spraying instruction information of the scaling powder spray head 39; the product detection mechanism 33 comprises a first detection area 36, a second detection area 37 and a third detection area 38, wherein the first detection area 36 comprises a first sensor for identifying the size of a product in the fixing clamp, the second detection area 37 comprises a second sensor for detecting the fixing position of the product on the fixing clamp, and the third detection area 38 comprises a third sensor for detecting the pin distribution of a component on the product.
The conveying device 2 is provided with a fixing clamp 23, an X-direction control motor 22 and a conveying control mechanism 21, and the fixing clamp 23 is used for fixing a product provided with a plurality of welding pins; the X-direction control motor 22 is used for providing power for the transmission device 2; the transport control means 21 is used to control the movement state of the transport device 2.
The wave soldering device 51 comprises a tin furnace 56, a wave generating mechanism 53, a wave detecting mechanism 54, a tin adding mechanism 55 and a wave soldering control mechanism 51, wherein the tin furnace 56 is provided with a temperature control device 52 for controlling the temperature of liquid tin, the temperature control device 52 is connected with the wave soldering control mechanism 51, and the wave generating mechanism 53, the wave detecting mechanism 54 and the tin adding mechanism 55 are respectively connected with the wave soldering control mechanism 51.
With reference to fig. 2, the present embodiment also discloses a wave soldering method for selectively spraying flux by using the above apparatus, the method includes the following steps:
s01, fixing the product on a fixing clamp of a conveying device;
s02, inputting parameter information (size information, fixed position information and component pin distribution information) of a product model into a spraying instruction editing device, automatically generating a spraying operation instruction of a soldering flux sprayer by the spraying instruction editing device, wherein the spraying operation instruction comprises the rotating direction, the rotating speed and the rotating time of a Y-direction displacement motor, the soldering flux flow in a flow control mechanism and the spraying pressure information of the soldering flux sprayer, and the spraying instruction editing device transmits the spraying operation instruction to the soldering flux control mechanism;
s03, the product detection mechanism detects actual products on the fixing clamp, and transmits parameter information (size information, fixed position information and component pin distribution information) of the detected actual products to the soldering flux control mechanism for comparison:
referring to fig. 3, firstly, the dimension information of the actual product in the flux control mechanism is compared with the dimension information of the product model:
s0311, the product detection mechanism detects the actual product size on the fixed clamp;
s0312, the soldering flux control mechanism compares the detected product size information with the size information in the model parameter information;
s0313, if the product size information comparison results are consistent, the scaling powder control mechanism continues to compare the fixed position information of the product; if not, the flux control mechanism judges that the product types are not matched, the current spraying operation instruction is stopped, and the welding process is stopped.
Referring to fig. 4, next, the fixing position information of the actual product in the flux control mechanism is compared with the fixing position information of the product model:
s0314, the product detection mechanism detects the fixed position of the product on the fixed clamp;
s0315, the soldering flux control mechanism compares the detected product fixed position information with fixed position information in the model parameter information;
s0316, if the fixed position information of the product is consistent, the soldering flux control mechanism continues to compare the pin distribution information of the components on the product; if the comparison result is not consistent, entering the next step;
s0317, the scaling powder control mechanism judges whether the fixed position of the product on the fixed clamp is reversed, if so, the product on the fixed clamp is judged to be reversely installed, the scaling powder control mechanism stops the current spraying operation instruction, and the welding process stops; if not, entering the next step;
s0318, scaling powder control mechanism judges whether the product misplaces at the mounting fixture, if yes, calculate the dislocation interval between fixed position of the detected product and fixed position of the product model, scaling powder control mechanism revises the scaling powder spraying instruction according to the dislocation interval, if not, suspend the current spraying operation instruction, the welding process stops.
Referring to fig. 5, the pin distribution information of the actual product in the second flux control mechanism is compared with the pin distribution information of the actual product in the product model:
s0319, the product detection mechanism detects the pin distribution of the components of the product on the fixed clamp;
s0320, comparing detected pin distribution information of components on the product with pin distribution information of the components in the model parameter information by a soldering flux control mechanism;
s0321, if the pin distribution information of the components on the product is consistent in comparison result, controlling the soldering flux spraying operation by a soldering flux control mechanism; if the comparison result is inconsistent, stopping welding, and entering the next step;
s0322, the soldering flux control mechanism judges whether the number of pins of the components on the product is reduced or increased, if the number of the pins is reduced, the components on the product are wrongly installed or neglected to install; if the number of the pins is increased, the components on the product are wrongly mounted or mounted more.
After the comparison process is sequentially finished, the scaling powder control mechanism controls the Y-direction control motor and the flow control mechanism to work according to the corrected scaling powder spraying instruction, so that the scaling powder spray head performs scaling powder spraying operation;
s04, after the soldering flux is sprayed, heating the product by a preheating device and then transmitting the product to a wave-soldering device;
s05, welding pins on the product by the product through the wave crest of liquid tin in a tin furnace;
and S06, after welding, sending the product into a cooling device for cooling, and unloading the product.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (9)
1. A wave soldering method for selectively spraying a flux, the method comprising:
s01, fixing the product on a fixing clamp of a conveying device;
s02, inputting parameter information of the product model into a spraying instruction editing device, automatically generating a spraying operation instruction of a soldering flux spray head by the spraying instruction editing device, and transmitting the spraying operation instruction to a soldering flux control mechanism;
s03, detecting an actual product on the fixing clamp by the product detection mechanism, transmitting parameter information of the detected actual product to the soldering flux control mechanism for comparison, and controlling the operation of the Y-direction control motor and the flow control mechanism by the soldering flux control mechanism according to a comparison result to enable the soldering flux spray head to perform soldering flux spraying operation;
s04, after the soldering flux is sprayed, heating the product by a preheating device and then transmitting the product to a wave-soldering device;
s05, welding pins on the product by the product through the wave crest of liquid tin in a tin furnace;
and S06, after welding, sending the product into a cooling device for cooling, and unloading the product.
2. The wave soldering method according to claim 1, wherein the parameter information includes size information, fixing position information, component pin distribution information.
3. The wave soldering method according to claim 2, wherein the spraying operation command comprises rotation direction, rotation speed, rotation time of the Y-direction displacement motor, flux flow rate in the flow rate control mechanism and spraying pressure information of the flux sprayer.
4. The wave soldering method according to claim 3, wherein the step S03 of comparing the size information of the actual product with the size information of the product model in the flux control mechanism comprises the specific steps of:
s0311, the product detection mechanism detects the actual product size on the fixed clamp;
s0312, the soldering flux control mechanism compares the detected product size information with the size information in the model parameter information;
s0313, if the product size information comparison results are consistent, the scaling powder control mechanism continues to compare the fixed position information of the product; if not, the flux control mechanism judges that the product types are not matched, the current spraying operation instruction is stopped, and the welding process is stopped.
5. The wave soldering method according to claim 4, wherein the step S03 of comparing the fixed position information of the actual product with the fixed position information of the product model in the flux control mechanism comprises the specific steps of:
s0314, the product detection mechanism detects the fixed position of the product on the fixed clamp;
s0315, the soldering flux control mechanism compares the detected product fixed position information with fixed position information in the model parameter information;
s0316, if the fixed position information of the product is consistent, the soldering flux control mechanism continues to compare the pin distribution information of the components on the product; if the comparison result is not consistent, entering the next step;
s0317, the scaling powder control mechanism judges whether the fixed position of the product on the fixed clamp is reversed, if so, the product on the fixed clamp is judged to be reversely installed, the scaling powder control mechanism stops the current spraying operation instruction, and the welding process stops; if not, entering the next step;
s0318, scaling powder control mechanism judges whether the product misplaces at the mounting fixture, if yes, calculate the dislocation interval between fixed position of the detected product and fixed position of the product model, scaling powder control mechanism revises the scaling powder spraying instruction according to the dislocation interval, if not, suspend the current spraying operation instruction, the welding process stops.
6. The wave soldering method according to claim 5, wherein the step S03 of comparing the pin distribution information of the components of the actual product with the pin distribution information of the components of the product model in the flux control mechanism comprises the specific steps of:
s0319, the product detection mechanism detects the pin distribution of the components of the product on the fixed clamp;
s0320, comparing detected pin distribution information of components on the product with pin distribution information of the components in the model parameter information by a soldering flux control mechanism;
s0321, if the pin distribution information of the components on the product is consistent in comparison result, controlling the soldering flux spraying operation by a soldering flux control mechanism; if the comparison result is inconsistent, stopping welding, and entering the next step;
s0322, the soldering flux control mechanism judges whether the number of pins of the components on the product is reduced or increased, if the number of the pins is reduced, the components on the product are wrongly installed or neglected to install; if the number of the pins is increased, the components on the product are wrongly mounted or mounted more.
7. The utility model provides a wave-soldering device of selective spraying scaling powder, its includes transmission device and total control processor, transmission device top is equipped with scaling powder spraying device, preheating device, wave-soldering welding set and cooling device along direction of transfer in proper order, transmission device, scaling powder spraying device, preheating device, wave-soldering welding set and cooling device all are connected its characterized in that with total control processor electricity:
the scaling powder spraying device comprises a product detection mechanism, a spraying instruction editing device, a Y-direction displacement motor, a flow control mechanism, a scaling powder spray head and a scaling powder control mechanism, wherein the scaling powder control mechanism is respectively and electrically connected with the product detection mechanism, the spraying instruction editing device, the Y-direction displacement motor and the flow control mechanism, the scaling powder spray head is respectively and electrically connected with the Y-direction displacement motor and the flow control mechanism,
the spraying instruction editing device is used for importing product model parameters and generating spraying instruction information of the soldering flux spray head; the product detection mechanism comprises a first detection area, a second detection area and a third detection area, the first detection area comprises a first sensor used for identifying the size of a product in the fixing clamp, the second detection area comprises a second sensor used for detecting the position of a product fixed on the fixing clamp, and the third detection area comprises a third sensor used for detecting the distribution of pins of components on the product.
8. The wave soldering device according to claim 7, wherein a fixing clamp, an X-direction control motor and a transmission control mechanism are arranged on the transmission device, and the fixing clamp is used for fixing a product provided with a plurality of soldering pins; the X-direction control motor is used for providing power for the transmission device; the transmission control mechanism is used for controlling the motion state of the transmission device.
9. The wave soldering device according to claim 8, wherein the wave soldering device comprises a tin furnace, a wave generating mechanism, a wave detecting mechanism, a tin adding mechanism and a wave soldering control mechanism, a temperature control device for controlling the temperature of the liquid tin is arranged on the tin furnace, the temperature control device is connected with the wave soldering control mechanism, and the wave generating mechanism, the wave detecting mechanism and the tin adding mechanism are respectively connected with the wave soldering control mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010684022.XA CN111774688B (en) | 2020-07-16 | 2020-07-16 | Wave soldering method and device for selectively spraying soldering flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010684022.XA CN111774688B (en) | 2020-07-16 | 2020-07-16 | Wave soldering method and device for selectively spraying soldering flux |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111774688A true CN111774688A (en) | 2020-10-16 |
| CN111774688B CN111774688B (en) | 2021-03-30 |
Family
ID=72767859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010684022.XA Active CN111774688B (en) | 2020-07-16 | 2020-07-16 | Wave soldering method and device for selectively spraying soldering flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111774688B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114063668A (en) * | 2021-11-01 | 2022-02-18 | 深圳市卡博尔科技有限公司 | Method and system for intelligently controlling production temperature of miniLED circuit board |
| CN118385692A (en) * | 2024-06-26 | 2024-07-26 | 深圳市丹宇电子有限公司 | Wave soldering flux spray control method and medium based on artificial intelligence |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5226962A (en) * | 1991-11-08 | 1993-07-13 | Electrovert U.S.A. Corp. | Flux applicator system |
| JP2002043734A (en) * | 2000-07-24 | 2002-02-08 | Senju Metal Ind Co Ltd | Method and apparatus for soldering printed circuit board |
| US20070172597A1 (en) * | 2006-01-23 | 2007-07-26 | Delta Electronics, Inc. | Automatic spraying method for flux of wave solder oven |
| CN203197426U (en) * | 2013-05-03 | 2013-09-18 | 叶安江 | Energy-saving type crest welder with intelligent control system |
| CN105934108A (en) * | 2016-06-28 | 2016-09-07 | 华高科技（苏州）有限公司 | Efficient high-precision wave crest welding process |
| CN108176907A (en) * | 2018-02-06 | 2018-06-19 | 东莞市创威自动化科技有限公司 | A kind of wave-soldering furnace |
| CN108551727A (en) * | 2018-04-02 | 2018-09-18 | 郑州云海信息技术有限公司 | A kind of scaling powder atomizing device and spraying implementation method based on PCBA |
| CN109396584A (en) * | 2018-11-20 | 2019-03-01 | 武汉欣远拓尔科技有限公司 | A kind of Intelligent welding method, system, device and storage medium |
| CN109561651A (en) * | 2018-12-30 | 2019-04-02 | 深圳捷创电子科技有限公司 | A kind of SMT surface mount elements position control method and its system |
-
2020
- 2020-07-16 CN CN202010684022.XA patent/CN111774688B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5226962A (en) * | 1991-11-08 | 1993-07-13 | Electrovert U.S.A. Corp. | Flux applicator system |
| JP2002043734A (en) * | 2000-07-24 | 2002-02-08 | Senju Metal Ind Co Ltd | Method and apparatus for soldering printed circuit board |
| US20070172597A1 (en) * | 2006-01-23 | 2007-07-26 | Delta Electronics, Inc. | Automatic spraying method for flux of wave solder oven |
| CN203197426U (en) * | 2013-05-03 | 2013-09-18 | 叶安江 | Energy-saving type crest welder with intelligent control system |
| CN105934108A (en) * | 2016-06-28 | 2016-09-07 | 华高科技（苏州）有限公司 | Efficient high-precision wave crest welding process |
| CN108176907A (en) * | 2018-02-06 | 2018-06-19 | 东莞市创威自动化科技有限公司 | A kind of wave-soldering furnace |
| CN108551727A (en) * | 2018-04-02 | 2018-09-18 | 郑州云海信息技术有限公司 | A kind of scaling powder atomizing device and spraying implementation method based on PCBA |
| CN109396584A (en) * | 2018-11-20 | 2019-03-01 | 武汉欣远拓尔科技有限公司 | A kind of Intelligent welding method, system, device and storage medium |
| CN109561651A (en) * | 2018-12-30 | 2019-04-02 | 深圳捷创电子科技有限公司 | A kind of SMT surface mount elements position control method and its system |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114063668A (en) * | 2021-11-01 | 2022-02-18 | 深圳市卡博尔科技有限公司 | Method and system for intelligently controlling production temperature of miniLED circuit board |
| CN114063668B (en) * | 2021-11-01 | 2022-07-26 | 深圳市卡博尔科技有限公司 | Method and system for intelligently controlling production temperature of miniLED circuit board |
| CN118385692A (en) * | 2024-06-26 | 2024-07-26 | 深圳市丹宇电子有限公司 | Wave soldering flux spray control method and medium based on artificial intelligence |
| CN118385692B (en) * | 2024-06-26 | 2024-09-06 | 深圳市丹宇电子有限公司 | Wave soldering flux spray control method and medium based on artificial intelligence |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111774688B (en) | 2021-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111774688B (en) | Wave soldering method and device for selectively spraying soldering flux | |
| US5743005A (en) | Component mounting apparatus and method | |
| CN1198498C (en) | Element mounting system and mounting method | |
| US5525777A (en) | Apparatus and method for flexible point-to-point soldering | |
| EP1123769A2 (en) | Robot welding | |
| CN111805037A (en) | Automatic laser welding machine and automatic feeding and discharging system for tin ball welding | |
| CN105904079A (en) | Wire-feeding type electron beam material-increasing manufacturing equipment and operating method thereof | |
| JPH07263856A (en) | Soldering device | |
| US20040129756A1 (en) | Device for positioning a tool in relation to a workpiece | |
| WO2001067835A1 (en) | Apparatus for inspecting solder paste printed on a pcb and supplementary dispensing solder paste | |
| CN114682898A (en) | Electromagnetic pulse welding equipment for electronic packaging and welding method thereof | |
| CN212577735U (en) | Full-automatic selective wave soldering device | |
| CN206966909U (en) | Robot welding tooling | |
| CN211966234U (en) | Online induction brazing system | |
| CN209919051U (en) | Circuit board inspection and welding machine | |
| CN112139620B (en) | Device and method for full-automatic control of selective wave soldering | |
| US10813259B2 (en) | Board work machine and insertion method | |
| CN114147310A (en) | Automatic tin-coating and gold-removing mechanism and automatic tin-coating and gold-removing method thereof | |
| CN101648306A (en) | Selective bridging removing device for wave soldering | |
| CN212419992U (en) | Novel full-automatic weldability test device | |
| CN110202234A (en) | A kind of Piezoelectric Driving automatic spray printing system | |
| JP3173338B2 (en) | How to repair defective bumps | |
| CN221667631U (en) | Maintenance all-in-one machine | |
| CN221312813U (en) | Full-automatic selective welding system for PCB | |
| CN113346333B (en) | Automatic lead adjusting device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |