JPH065761U - Soldering device - Google Patents

Abstract

(57) [Abstract] [Purpose] It is possible to prevent the printed circuit board from warping without complicating the device and increasing the cost, and to apply the printed circuit board of any wiring pattern. [Structure] The solder melting tank 2 has a jet outlet side wall 4a and a current plate 4b.
The jet port 4 is formed. The abutting member 7 having the abutting portion 7a is attached and fixed to the outer wall portion of the rectifying plate 4b via the attaching plate 8. The printed circuit board 6 is translated in the direction of arrow A by a printed circuit board carrying member (not shown). Printed circuit board 6
Is contacted and supported from below by the contact portion 7a of the contact member 7 after contacting the solder 3.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a jet type soldering device for automatically soldering a printed circuit board and a circuit component.

[0002]

[Prior art]

 Generally, a jet-type soldering device jets molten solder, and the printed substrate on which various circuit components are mounted is brought into contact with the jetted solder while moving in parallel, thereby performing soldering.

By the way, in this type of soldering device, due to the contact between the molten solder and the printed circuit board, the printed circuit board is softened by the heat of the solder and warpage occurs, which results in good soldering. Therefore, as shown in, for example, Japanese Patent Laid-Open No. 59-853365, a dead space portion not to be soldered is provided in the center of the printed circuit board in advance, and a solder spout is provided with this dead space. A warp-preventing bar that cuts the part vertically is provided, and the part that does not undergo soldering of the printed circuit board comes into contact with and moves along the warp-preventing bar to prevent warpage of the printed circuit board. Attachment devices are known.

[0004]

[Problems to be solved by the device]

 However, in the case of such a soldering device, it is necessary to form a dead space portion in the center of the printed circuit board which is not in contact with the warp prevention bar and is not soldered. Therefore, this device can be applied to this type of device. Due to the limitations of the printed circuit board, it was impossible to apply a printed circuit board that cannot form a dead space.

Further, as disclosed in, for example, Japanese Patent Application Laid-Open No. 61-27167, a pair of rail-shaped support plates are installed so as to straddle the spouting port of the molten solder, and between the support plates. It is known to provide a warp prevention means composed of a warp prevention roller group provided, and send out while supporting the central portion of the printed circuit board by the warp prevention means, but this increases the size and cost of the device. In this case as well, in this case as well, it is necessary to provide a part where the warpage prevention roller may come into contact, that is, a dead space part, and a part where soldering is not performed at an appropriate position due to the wiring pattern of the printed board. There was a problem that it could not be applied to things that could not be provided.

The present invention has been made in view of the above-described problems, and has a simple structure that does not increase the complexity and cost of the device, and does not require the provision of a dead space portion on the printed circuit board. An object of the present invention is to provide a soldering device capable of preventing the printed circuit board from warping.

[0007]

[Means for Solving the Problems]

 The present invention jets molten solder from a jet port formed in a solder melting tank, and translates the soldering surface of the printed board in contact with the jetted solder to form it on the soldering surface of the printed board. A soldering device for automatically soldering the formed conductive foil portion and a circuit component, wherein the printed circuit board is formed after the soldering surface of the printed circuit board and the jetted solder come into contact with the solder melting tank. The contact member is provided to prevent the warp of the printed circuit board by contacting the soldering surface.

[0008]

[Action]

 According to the present invention, after the printed circuit board comes into contact with the jetted solder, the substantially central portion of the printed circuit board is contacted and supported from below by the contact member along the moving direction.

[0009]

【Example】

 1 to 3 show a first embodiment of the present invention. In the drawings, reference numeral 1 denotes a soldering device, which is a solder melting tank 2 for containing molten solder, An ejection port 4 which will be described later and is formed so as to slightly project from the melting tank 2 and can eject the molten solder 3, a side plate 5 that covers the side surface of the ejection port 4 and prevents the outflow of solder, and various wiring patterns are formed. The printed circuit board 6 is provided with a printed circuit board carrying member (not shown) that holds the printed circuit board 6 so that the printed circuit board 6 on which the circuit parts are placed can move in parallel in the direction of arrow A.

Further, the ejection port 4 has an inner surface that guides the solder 3 upward, and a jet surface of the solder 3 is adjusted above the ejection port side wall 4 a to adjust the jet flow of the solder 3 to the soldering surface 6 a of the printed circuit board 6. In order to maintain a good contact state with the jet outlet side wall 4a, a straightening plate 4b is formed integrally with the jet outlet side wall 4a. In this embodiment, the rod-shaped contact member 7 is connected to the printed board 6 and the solder 3. Is provided on the side surface of the outer wall of the straightening plate 4b of the jet port 4 located on the front side with respect to the moving direction of the printed circuit board indicated by the arrow A so that it can contact the printed circuit board 6 after the contact.

The contact member 7 is formed of, for example, a metal material having excellent heat resistance, and a contact portion 7a, which is formed by bending a part of the contact member 7 into a U-shape, is formed at the tip of the contact member 7. The contacting portion 7a causes the soldering surface 6a of the printed circuit board 6 to contact the soldering surface 6a substantially at the center thereof from below along the moving direction of the arrow A at a rear position away from the contact portion between the soldering surface 6a and the solder 3. The printed circuit board 6a is mounted and fixed by a fixing member such as a screw via a mounting plate 8 so that the warp of the printed circuit board 6a can be corrected.

Next, soldering by the soldering apparatus according to this embodiment will be described. First, the printed circuit board 6 moves in parallel in the direction of the arrow A while being held by a printed circuit board carrying member (not shown), and reaches the position of the ejection port 4.

Subsequently, the soldering surface 6 a of the printed circuit board 6 moves and comes into contact with the solder 3 jetted from the jet port 4, whereby soldering is performed. At this time, the heat of the solder 3 is transferred to the printed circuit board 6 due to the contact between the printed circuit board 6 and the solder 3, and the printed circuit board 6 is softened so that a warp having a U-shaped cross section is generated particularly in the direction of the double arrow B. It is in a state where it is easy to grow.

Even if the printed circuit board 6 passes over the ejection port 4 while the printed circuit board 6 is warped by the heat of the solder 3, the printed circuit board 6 has a contact member for preventing warpage at the center of the soldering surface 6a. While moving in the direction of arrow A while being contacted and supported from below by the contact portion 7a of 7, the warp is sequentially corrected in the process before cooling the printed circuit board 6. In this case, even if the soldering surface 6a is the contact surface with the contact portion 7a, and that portion is also the portion to be soldered, this soldering portion is the solder 3 when contacting the contact portion 7a. Since it is hardened, there is no risk of damaging the soldering location or hindering the soldering condition.

As described above in detail, according to this embodiment, the printed board 6 is contacted and supported by the contact member 7 after contacting the solder 3, so that the soldering surface 6 a of the printed board 6 is contacted. It is not necessary to form a dead space for contacting the member 7, and a printed circuit board in which a dead space portion cannot be provided in the case of a wiring pattern or the like can be applied. It can be applied to all kinds of printed circuit boards without being received.

In this embodiment, the contact member 7 is mounted and fixed via the mounting plate 8, but the mounting and fixing of the contact member 7 is not limited to this, and various fixing means can be applied. Is.

Further, the setting of the position for forming the contact portion 7a of the contact member 7 and the adjustment of the length of the contact member 7 accompanying this, etc. are performed by soldering after the printed circuit board 6 and the solder 3 are in contact with each other. It is sufficient to set or adjust the length so that the contact portion 7a contacts and supports the printed circuit board 6 before the solder 3 is hardened and the printed circuit board 6 is cured.

FIG. 4 shows a second embodiment of the present invention, in which the same reference numerals are used for the same parts as those in the first embodiment, and detailed description thereof will be omitted.

In the figure, reference numeral 9 denotes a second contact member fixedly attached to the inner wall portion of the flow straightening plate 4b facing the flow straightening plate 4b to which the contact member 7 is fixedly attached. The member 9 has substantially the same shape as the contact member 7, and a contact portion 9a is formed at the tip of the second contact member. The contact portion 9a contacts the printed circuit board 6 and the solder 3. It is provided so as to be located approximately in the center of the part to be opened.

As described above, in this embodiment, the contact member 7 and the second contact member 9 are provided, and the second contact member 9 is used to solder the printed circuit board 6 in contact with the solder 3. Since the position of the surface 6a is also contacted and supported, the warp of the printed circuit board 6 can be prevented more reliably.

The setting of the position for forming the contact portion 9a of the second contact member 9 and the adjustment of the length of the second contact member 9 associated therewith are performed by the contact portion 9a being soldered to the printed circuit board 6. It is sufficient to set or adjust the length to a position where the soldering surface 6a and the solder 3 can come into contact with each other even after the soldering surface 6a is contacted. Therefore, the contacting portion 9a of the second contact member 9 and the soldering surface 6a of the printed circuit board 6 may be set to contact each other before the soldering surface 6a of the printed circuit board 6 contacts the solder.

Further, in each of the above-described first and second embodiments, the bar-shaped contact member 7 is shown, but the contact member 7 is not limited to these embodiments, and the printed board is not limited thereto. If it is set to contact the printed board 6 after soldering 6, the roller-shaped rotating member may be used to contact the printed board 6.

[0023]

[Effect of device]

 The present invention jets melted solder from a jet port formed in a solder melting tank, and translates the soldering surface of the printed board in contact with the jetted solder so that the soldered surface of the printed board is soldered. A soldering device for automatically soldering a formed conductive foil portion and a circuit component, wherein after the soldering surface of the printed board and the jetted solder come into contact with the solder melting tank, Since a contact member is provided to prevent the warpage of the printed circuit board by contacting the soldering surface, the simple structure ensures the warpage of the printed circuit board without complicating the device and increasing the cost. It is possible to provide a soldering device that can prevent any of the above and does not need to provide a dead space on the printed circuit board and can be applied to any printed circuit board.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of FIG.

FIG. 3 is a perspective view of a main part of FIG.

FIG. 4 is a perspective view showing a second embodiment of the present invention.

[Explanation of symbols]

 1 Soldering Device 2 Solder Melting Tank 3 Solder 4 Jet Port 6 Printed Circuit Board 7 Contact Member

Claims (1)

[Scope of utility model registration request] 1. Various wirings formed on the printed circuit board by jetting melted solder from a jet port formed in a solder melting tank and translating a soldering surface of the printed circuit board in contact with the jetted solder in a contact state. A soldering device for automatically soldering a pattern and a circuit component, the soldering surface of the printed circuit board being contacted with the soldering surface of the printed circuit board after the soldering surface of the printed circuit board and the jetted solder come into contact with the solder melting tank. A soldering device comprising a contact member that is in contact with the printed circuit board to prevent warpage.