JPS5984847U - Ceramic package for semiconductor devices - Google Patents
Ceramic package for semiconductor devicesInfo
- Publication number
- JPS5984847U JPS5984847U JP18119482U JP18119482U JPS5984847U JP S5984847 U JPS5984847 U JP S5984847U JP 18119482 U JP18119482 U JP 18119482U JP 18119482 U JP18119482 U JP 18119482U JP S5984847 U JPS5984847 U JP S5984847U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- ceramic package
- metallized
- semiconductor devices
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図および第２図はそれぞれ従来の半導体素子用セラ
ミックパッケージで各図においでＡは正面図、Ｂは断面
図でミ第３図および第４図はそれぞれ本考案の実施例を
示す半導体素子用セラミックパッケージで各図において
Ａは正面図、Ｂは断面図である。
１・・・・・・セラミック基板、２・・・・・・電極用
メタライ−ズ、３・・・・・・導通メタライズ層、４・
・・・・・金属リード、５・・・・・・セラミック枠体
、６・・・・・・半導体素子用セラミックパッケージ、
７・・・・・・スタッド、８・・・・・・凹部、９・・
・・・・ろう材、１０・・・・・・セラミック絶縁層。1 and 2 are conventional ceramic packages for semiconductor devices, and in each figure, A is a front view, B is a cross-sectional view, and FIGS. 3 and 4 are semiconductor devices showing embodiments of the present invention, respectively. In each figure, A is a front view and B is a cross-sectional view of the ceramic package for use. DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 2... Electrode metallization, 3... Conductive metallization layer, 4...
... Metal lead, 5 ... Ceramic frame, 6 ... Ceramic package for semiconductor element,
7...Stud, 8...Recess, 9...
... Brazing filler metal, 10 ... Ceramic insulation layer.
Claims (1)
、その電極用メタライズから延設される導通メタライズ
層およびその導通メタライズ層の端部において金属リー
ドが設けられるとともに、その金属リードと電極用メタ
ライズとの間に半導体素子を気密封着するためのセラミ
ック枠体が設けられる半導体素子用セラミックパッケー
ジにおいて、セラミック枠体の導通メタライズ部分は内
表面がメタライズされた凹部が設けられるとともに、そ
の凹部と導通メタライズ・ 部とそ囲れる部分はろう
材で気密充填されていることを特徴とする半導体素子用
セラミックパッケージ。 ２ セラミック枠体内の導通メタライズ層上には、セラ
ミック絶縁層が被覆されている実用新案登録請求の範囲
第１項記載の半導体素子用セラミックパッケージ。[Claims for Utility Model Registration] 1. On a ceramic substrate, metallization for an electrode of a semiconductor element, a conductive metallized layer extending from the metallized electrode, and a metal lead at the end of the conductive metallized layer, and the metal In a ceramic package for a semiconductor device in which a ceramic frame for hermetically sealing a semiconductor device is provided between a lead and a metallized electrode, the conductive metallized portion of the ceramic frame is provided with a recess whose inner surface is metalized, and A ceramic package for a semiconductor element, characterized in that the recessed part, the conductive metallized part, and the surrounding part are hermetically filled with a brazing material. 2. The ceramic package for a semiconductor device according to claim 1, wherein the conductive metallized layer in the ceramic frame is coated with a ceramic insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18119482U JPS5984847U (en) | 1982-11-30 | 1982-11-30 | Ceramic package for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18119482U JPS5984847U (en) | 1982-11-30 | 1982-11-30 | Ceramic package for semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5984847U true JPS5984847U (en) | 1984-06-08 |
| JPS6336688Y2 JPS6336688Y2 (en) | 1988-09-28 |
Family
ID=30392690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18119482U Granted JPS5984847U (en) | 1982-11-30 | 1982-11-30 | Ceramic package for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5984847U (en) |
-
1982
- 1982-11-30 JP JP18119482U patent/JPS5984847U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6336688Y2 (en) | 1988-09-28 |
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