JPS58155845U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS58155845U
JPS58155845U JP5408382U JP5408382U JPS58155845U JP S58155845 U JPS58155845 U JP S58155845U JP 5408382 U JP5408382 U JP 5408382U JP 5408382 U JP5408382 U JP 5408382U JP S58155845 U JPS58155845 U JP S58155845U
Authority
JP
Japan
Prior art keywords
semiconductor device
active element
hermetically sealed
coated
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5408382U
Other languages
Japanese (ja)
Inventor
克朗 平岩
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP5408382U priority Critical patent/JPS58155845U/en
Publication of JPS58155845U publication Critical patent/JPS58155845U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来例の気密封止形半導体パッケージを示す図
、第2図は半導体素子面に樹脂コーテングした従来例を
示す側面図、第3図は本考案の一実施例である気密封止
形半導体パッケージを示す断面図、第4図は本考案の一
実施例である半導体素子を示す要部側面図である。 図において、12はセラミック基板、13は半導体素子
、14はバット電極、15はワイヤ、16は外部リード
、17は不純物拡散層、18はポリイミド樹脂を示す。
Figure 1 is a diagram showing a conventional hermetically sealed semiconductor package, Figure 2 is a side view of a conventional example in which the semiconductor element surface is coated with resin, and Figure 3 is a hermetically sealed semiconductor package that is an embodiment of the present invention. FIG. 4 is a cross-sectional view showing a shaped semiconductor package, and FIG. 4 is a side view of a main part showing a semiconductor element which is an embodiment of the present invention. In the figure, 12 is a ceramic substrate, 13 is a semiconductor element, 14 is a bat electrode, 15 is a wire, 16 is an external lead, 17 is an impurity diffusion layer, and 18 is a polyimide resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外側に端子を配設し、耐熱性絶縁基板の略中夫に半導体
素子を装着し、該基板と同−材又は金属材のキャップで
ハーメチックシールする気密封止形半導体装置であって
、該半導体素子の能動素子mlより低面に信号線接続用
バット面を設けて段差のある境界面となし、前記能動素
子面にはa線遮蔽用樹脂をコーテングし、前記バット面
の電極は不純物拡散層を介して該能動素子と接続されて
なることを特徴とする半導体装置。
A hermetically sealed semiconductor device in which terminals are provided on the outside, a semiconductor element is mounted approximately in the middle of a heat-resistant insulating substrate, and hermetically sealed with a cap made of the same material as the substrate or a metal material, the semiconductor device A butt surface for signal line connection is provided on a lower surface than the active element ml of the device to form a stepped boundary surface, the active element surface is coated with a-ray shielding resin, and the electrode on the butt surface is coated with an impurity diffusion layer. A semiconductor device characterized in that the semiconductor device is connected to the active element via the active element.
JP5408382U 1982-04-14 1982-04-14 semiconductor equipment Pending JPS58155845U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5408382U JPS58155845U (en) 1982-04-14 1982-04-14 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5408382U JPS58155845U (en) 1982-04-14 1982-04-14 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS58155845U true JPS58155845U (en) 1983-10-18

Family

ID=30064715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5408382U Pending JPS58155845U (en) 1982-04-14 1982-04-14 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS58155845U (en)

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