JPS5975686A - マイクロピンの製造方法 - Google Patents
マイクロピンの製造方法Info
- Publication number
- JPS5975686A JPS5975686A JP57187047A JP18704782A JPS5975686A JP S5975686 A JPS5975686 A JP S5975686A JP 57187047 A JP57187047 A JP 57187047A JP 18704782 A JP18704782 A JP 18704782A JP S5975686 A JPS5975686 A JP S5975686A
- Authority
- JP
- Japan
- Prior art keywords
- micropins
- plate
- layer
- plating
- metal mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000007747 plating Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 50
- 229910052697 platinum Inorganic materials 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 11
- 238000009760 electrical discharge machining Methods 0.000 claims description 7
- 239000011651 chromium Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract description 13
- 238000012545 processing Methods 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 6
- 239000000243 solution Substances 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 229910021578 Iron(III) chloride Inorganic materials 0.000 abstract description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 3
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 239000008151 electrolyte solution Substances 0.000 abstract description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 abstract description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract description 2
- 238000004090 dissolution Methods 0.000 abstract description 2
- 239000004160 Ammonium persulphate Substances 0.000 abstract 1
- 235000019395 ammonium persulphate Nutrition 0.000 abstract 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- 239000000463 material Substances 0.000 description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 238000003754 machining Methods 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005536 corrosion prevention Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910000497 Amalgam Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57187047A JPS5975686A (ja) | 1982-10-25 | 1982-10-25 | マイクロピンの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57187047A JPS5975686A (ja) | 1982-10-25 | 1982-10-25 | マイクロピンの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5975686A true JPS5975686A (ja) | 1984-04-28 |
| JPS6258158B2 JPS6258158B2 (enExample) | 1987-12-04 |
Family
ID=16199238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57187047A Granted JPS5975686A (ja) | 1982-10-25 | 1982-10-25 | マイクロピンの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5975686A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008143648A (ja) * | 2006-12-08 | 2008-06-26 | Murata Mach Ltd | 乾燥システム |
-
1982
- 1982-10-25 JP JP57187047A patent/JPS5975686A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008143648A (ja) * | 2006-12-08 | 2008-06-26 | Murata Mach Ltd | 乾燥システム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6258158B2 (enExample) | 1987-12-04 |
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