JPS5972746A - フイルムマウント形集積回路の保護方法および装置 - Google Patents

フイルムマウント形集積回路の保護方法および装置

Info

Publication number
JPS5972746A
JPS5972746A JP58171031A JP17103183A JPS5972746A JP S5972746 A JPS5972746 A JP S5972746A JP 58171031 A JP58171031 A JP 58171031A JP 17103183 A JP17103183 A JP 17103183A JP S5972746 A JPS5972746 A JP S5972746A
Authority
JP
Japan
Prior art keywords
frame
micropack
short
circuit
shorting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58171031A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6334624B2 (en:Method
Inventor
オツトマ−ル・フリツツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of JPS5972746A publication Critical patent/JPS5972746A/ja
Publication of JPS6334624B2 publication Critical patent/JPS6334624B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/453—
    • H10W42/60—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages

Landscapes

  • Packaging Frangible Articles (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58171031A 1982-09-20 1983-09-16 フイルムマウント形集積回路の保護方法および装置 Granted JPS5972746A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3234745.6 1982-09-20
DE3234745A DE3234745C2 (de) 1982-09-20 1982-09-20 Verfahren zur Handhabung von filmmontierten integrierten Schaltkreisen und Vorrichtung zu seiner Durchführung

Publications (2)

Publication Number Publication Date
JPS5972746A true JPS5972746A (ja) 1984-04-24
JPS6334624B2 JPS6334624B2 (en:Method) 1988-07-11

Family

ID=6173640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58171031A Granted JPS5972746A (ja) 1982-09-20 1983-09-16 フイルムマウント形集積回路の保護方法および装置

Country Status (5)

Country Link
US (1) US4575747A (en:Method)
EP (1) EP0103888B1 (en:Method)
JP (1) JPS5972746A (en:Method)
AT (1) ATE43029T1 (en:Method)
DE (2) DE3234745C2 (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338973A (en) * 1990-08-22 1994-08-16 Nec Corporation Carrier for film carrier type semiconductor device

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4744009A (en) * 1986-10-31 1988-05-10 Amp Incorporated Protective carrier and securing means therefor
US4832612A (en) * 1986-10-31 1989-05-23 Amp Incorporated Protective carrier and securing means therefor
JPH0526746Y2 (en:Method) * 1987-07-14 1993-07-07
US4953002A (en) * 1988-03-31 1990-08-28 Honeywell Inc. Semiconductor device housing with magnetic field protection
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
US4999700A (en) * 1989-04-20 1991-03-12 Honeywell Inc. Package to board variable pitch tab
JPH0727927B2 (ja) * 1990-03-12 1995-03-29 株式会社東芝 テープキャリア
ATE139370T1 (de) * 1990-07-23 1996-06-15 Siemens Nixdorf Inf Syst Filmträger zur bandautomatischen verdrahtung
US5400219A (en) * 1992-09-02 1995-03-21 Eastman Kodak Company Tape automated bonding for electrically connecting semiconductor chips to substrates
US5396032A (en) * 1993-05-04 1995-03-07 Alcatel Network Systems, Inc. Method and apparatus for providing electrical access to devices in a multi-chip module
US6127196A (en) * 1995-09-29 2000-10-03 Intel Corporation Method for testing a tape carrier package
JP3080175B2 (ja) 1996-05-17 2000-08-21 シーメンス アクチエンゲゼルシヤフト 半導体チップ用の支持部材
DE19620025A1 (de) * 1996-05-17 1997-11-20 Siemens Ag Trägerelement für einen Halbleiterchip
DE19635732A1 (de) * 1996-09-03 1998-03-05 Siemens Ag Trägerelement für einen Halbleiterchip
JP2004505442A (ja) * 2000-07-21 2004-02-19 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 改善されたいわゆるソーボーを有する集積回路を製造する方法
WO2010099217A1 (en) 2009-02-25 2010-09-02 Braincells, Inc. Modulation of neurogenesis using d-cycloserine combinations
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338838U (en:Method) * 1976-09-09 1978-04-05

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3027004A (en) * 1957-08-13 1962-03-27 Ind Electronic Hardware Corp Pin-receiving contacts for printed circuit board
US3774075A (en) * 1970-09-23 1973-11-20 Motorola Inc Package including electrical equipment lead shorting element
US3746157A (en) * 1971-10-26 1973-07-17 Motorola Inc Protective carrier for semiconductor devices
GB1326437A (en) * 1971-12-22 1973-08-15 Bowthorpe Hellermann Ltd Retaining clips
US3784960A (en) * 1972-05-01 1974-01-08 Bunker Ramo Carrier for integrated circuit packages
DE2315711B2 (de) * 1973-03-29 1980-07-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer integrierten Schaltungsanordnung
US3820152A (en) * 1973-04-24 1974-06-25 Du Pont Circuit package with fugitive shorting bar
US3823350A (en) * 1973-09-05 1974-07-09 Atomic Energy Commission Protective carrier for semiconductor chips
US4007479A (en) * 1976-03-29 1977-02-08 Honeywell Information Systems, Inc. Fixture for an integrated circuit chip
US4069496A (en) * 1976-12-30 1978-01-17 Honeywell Information Systems Inc. Reusable fixture for an integrated circuit chip
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
DE2830937A1 (de) * 1978-07-14 1980-01-24 Bosch Gmbh Robert Vorrichtung zum schutz einer elektronischen schaltgruppe
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
DE3035125C2 (de) * 1980-09-17 1986-07-31 Siemens AG, 1000 Berlin und 8000 München Integrierter Schaltkreis
DE3207458C1 (de) * 1982-03-02 1983-06-09 Siemens AG, 1000 Berlin und 8000 München Halterung fuer die Einzelverarbeitung von filmmotierten integrierten Schaltkreisen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338838U (en:Method) * 1976-09-09 1978-04-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338973A (en) * 1990-08-22 1994-08-16 Nec Corporation Carrier for film carrier type semiconductor device

Also Published As

Publication number Publication date
DE3234745A1 (de) 1984-03-22
DE3234745C2 (de) 1986-03-06
EP0103888B1 (de) 1989-05-10
DE3379856D1 (en) 1989-06-15
ATE43029T1 (de) 1989-05-15
US4575747A (en) 1986-03-11
JPS6334624B2 (en:Method) 1988-07-11
EP0103888A3 (en) 1985-11-21
EP0103888A2 (de) 1984-03-28

Similar Documents

Publication Publication Date Title
JPS5972746A (ja) フイルムマウント形集積回路の保護方法および装置
US4007479A (en) Fixture for an integrated circuit chip
US3218584A (en) Strip line connection
US4617605A (en) Carrier element for an IC module
US4586105A (en) High voltage protection device with a tape covered spark gap
CN103563493B (zh) 用于屏蔽基板上的部件的电磁屏蔽结构
US4130334A (en) Ground termination and strain relief connector means
US4748293A (en) Flexible cable and method of manufacturing thereof
BE857116A (fr) Dispositif de protection d'un connecteur electrique contre les frequences parasites et procede de fabrication de ce dispositif
NL7905298A (nl) Draagband voor inrichtingen voor het verwerken van elektrische signalen, werkwijze voor het vervaardigen daarvan en toepassing van de band bij een element voor het verwerken van signalen.
US6002569A (en) Electrostatic discharge protection apparatus
US5130881A (en) IC socket having overvoltage protection
US4069496A (en) Reusable fixture for an integrated circuit chip
GB2247109A (en) Shielded portable semiconductor memory unit
US5847914A (en) Electrostatic discharge protection device
EP1360724B1 (en) Method of fabricating integrated circuits, providing improved so-called "saw bow" conductive tracks
US3257585A (en) Assemblage of parallel electric or electronic component-carrier units
CN113466657B (zh) 一种用于芯片测试的电路板、芯片测试系统及方法
US3699501A (en) Conductive probe assembly and method of using
JPH0926459A (ja) シールドされたローノイズマルチリードコンタクトおよびリードフレームの改良方法
US6321994B1 (en) Contactless communication data carrier with fully enclosed holding means for holding a chip and a passive component
DE19749523A1 (de) Elektrischer Apparat, insbesondere Überspannungsableiter, mit einer Vorrichtung zur Anzeige eines Fehlerstromes
JPS5825292A (ja) 印刷配線板
US5177856A (en) Method of making a shield for a printed circuit board
DE602004005436T2 (de) Funkenstreckevorrichtung und Verfahren zum elektrostatischen Entladungsschutz